公开(公告)号：US20230189446A1

公开(公告)日：2023-06-15

申请号：US17925145

申请日：2021-05-26

Applicant: Mycronic AB

Inventor： Gustaf MARTENSSON ,  Per-Erik GUSTAFSSON

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/12 ,  H05K13/08

CPC classification number: H05K3/0005 ,  H05K1/0266 ,  H05K3/125 ,  H05K13/0813 ,  H05K13/086 ,  H05K2201/0302 ,  H05K2203/0528

Abstract: A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.

公开(公告)号：US09659478B1

公开(公告)日：2017-05-23

申请号：US14572610

申请日：2014-12-16

Applicant: Multek Technologies Ltd.

Inventor： Mark Bergman ,  Michael James Glickman

IPC: G08B21/00 ,  G08B21/18 ,  G01L1/22

CPC classification number: H05K3/42 ,  G01M5/0041 ,  G01M5/0083 ,  G06F1/16 ,  G08B21/182 ,  G08B23/00 ,  H05K1/0201 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2203/0338 ,  H05K2203/0723

Abstract: A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.

公开(公告)号：US20170139509A1

公开(公告)日：2017-05-18

申请号：US15421254

申请日：2017-01-31

Applicant: Mitsubishi Electric Corporation

Inventor： Takahiro NISHIOKA ,  Naoki NAKAGAWA ,  Masafumi AGARI ,  Takeshi ONO ,  Seiichiro MORI

IPC: G06F3/044 ,  H05K1/09 ,  H05K1/02 ,  G06F3/041 ,  G02F1/1333

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/047 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

公开(公告)号：US09642243B2

公开(公告)日：2017-05-02

申请号：US14240815

申请日：2012-09-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Muthu Sebastian ,  Dominic M. Travasso ,  Nancy S. Lennhoff ,  Steven T. Swartz

IPC: G03C5/58 ,  H05K1/02 ,  G06F3/044 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/0274 ,  G06F3/044 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0302 ,  H05K2201/032

Abstract: An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.

公开(公告)号：US09603239B2

公开(公告)日：2017-03-21

申请号：US14378072

申请日：2013-02-21

Applicant: Mitsubishi Electric Corporation

Inventor： Takahiro Nishioka ,  Naoki Nakagawa ,  Masafumi Agari ,  Takeshi Ono ,  Seiichiro Mori

IPC: G06F3/044 ,  H05K1/02 ,  G06F3/047 ,  G02F1/1333 ,  G06F3/041

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/047 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

公开(公告)号：US09549473B2

公开(公告)日：2017-01-17

申请号：US15033211

申请日：2015-08-27

Applicant: TOYO INK SC HOLDINGS CO., LTD. ,  TOYOCHEM CO., LTD.

Inventor： Satoshi Nishinohara ,  Hidenobu Kobayashi ,  Kazunori Matsudo ,  Tsutomu Hayasaka

IPC: H05K1/09 ,  H05K1/03 ,  H01R43/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4611 ,  H05K1/02 ,  H05K2201/0302 ,  H05K2201/0364

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract translation: 本发明的目的是提供即使在回流步骤之后也不太可能引起发泡并且金属加强板不太可能被剥离的印刷线路板，其制造方法和电子设备。 根据本发明的印刷电路板（1）包括布线电路板（6），导电粘合层（3）和金属加强板（2）。 导电性粘合剂层（3）与布线电路基板（6）和金属加强板（2）接合。 金属加强板（2）包括形成在金属板（2a）的表面上的镍层（2b）。 存在于镍层（2b）的表面中的氢氧化镍与镍的表面积的比例大于3且等于或小于20。

公开(公告)号：US09538651B2

公开(公告)日：2017-01-03

申请号：US14820978

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi Inagaki ,  Kota Noda

IPC: H05K1/11 ,  H05K3/06 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/18

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

公开(公告)号：US09524813B2

公开(公告)日：2016-12-20

申请号：US14360904

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: B32B3/00 ,  H01B13/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  G06F3/041 ,  H01B1/02 ,  H01B1/22 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.

公开(公告)号：US20160270243A1

公开(公告)日：2016-09-15

申请号：US15033211

申请日：2015-08-27

Applicant: TOYO INK SC HOLDINGS CO., LTD. ,  TOYOCHEM CO., LTD.

Inventor： Satoshi NISHINOHARA ,  Hidenobu KOBAYASHI ,  Kazunori MATSUDO ,  Tsutomu HAYASAKA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4611 ,  H05K1/02 ,  H05K2201/0302 ,  H05K2201/0364

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2).The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract translation: 金属加强板（2）包括形成在金属板（2a）的表面上的镍层（2b）。 存在于镍层（2b）的表面中的氢氧化镍与镍的表面积的比例大于3且等于或小于20。

公开(公告)号：US20160044777A1

公开(公告)日：2016-02-11

申请号：US14774593

申请日：2014-07-30

Applicant: LG CHEM, LTD.

Inventor： Jiehyun SEONG ,  Jinmi JUNG ,  Yong Goo SON ,  Seung Heon LEE ,  Song Ho JANG ,  Bu Gon SHIN ,  Ji Young HWANG

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K1/0274 ,  H01L51/0023 ,  H01L51/105 ,  H01L51/442 ,  H01L51/445 ,  H01L51/5212 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09681 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.

Abstract translation: 提供一种透明导电性层叠体，具备透明导电性层叠体的透明电极及透明导电性层叠体的制造方法。