公开(公告)号：US09978706B2

公开(公告)日：2018-05-22

申请号：US15069435

申请日：2016-03-14

Applicant: International Business Machines Corporation

Inventor： Eric V. Kline ,  Arvind K. Sinha

IPC: H01L21/44 ,  H01L23/00 ,  H05K1/11 ,  H05K13/04 ,  B23K1/018 ,  B23K1/00 ,  H05K3/22 ,  B23K101/42

CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/16227 ,  H01L2224/1713 ,  H05K1/11 ,  H05K3/225 ,  H05K13/0486 ,  H05K2201/0308 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/1115 ,  H05K2203/176

Abstract: Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

公开(公告)号：US20160007515A1

公开(公告)日：2016-01-07

申请号：US14836363

申请日：2015-08-26

Applicant: International Business Machines Corporation

Inventor： Eric V. Kline ,  Arvind K. Sinha

IPC: H05K13/04 ,  B23K1/018

CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/16227 ,  H01L2224/1713 ,  H05K1/11 ,  H05K3/225 ,  H05K13/0486 ,  H05K2201/0308 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/1115 ,  H05K2203/176

Abstract: Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Abstract translation: 本发明的实施例涉及一种用于返修BGA封装的方法。 存储器形状材料被放置在与封装的多个焊接点相邻的位置。 对材料施加刺激，刺激导致材料从非刺激形状变成刺激形状。 这种刺激导致材料的膨胀。 随着材料膨胀，它在BGA封装和相邻定位的载体上施加张力，导致两个部件分离，同时减轻相邻定位部件的侧向热量。

公开(公告)号：US20140340826A1

公开(公告)日：2014-11-20

申请号：US13896332

申请日：2013-05-17

Applicant: Asia Vital Components Co., Ltd.

Inventor： Ching-Hang Shen ,  Fu-Kuei Chang

IPC: G06F1/16 ,  H05K1/02

CPC classification number: G06F1/1666 ,  H05K1/0216 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/28 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/029 ,  H05K2201/0308 ,  H05K2201/051 ,  H05K2201/057 ,  H05K2201/09781 ,  H05K2201/09936 ,  H05K2201/10037

Abstract: A portable input device includes a flexible main body, a sensing electrode layer, a protection layer and a memory metal body. The flexible main body has a first face and a second face. The sensing electrode layer has a first sensing electrode and a second sensing electrode disposed on the second face of the flexible main body. The protection layer is correspondingly disposed on the second face of the flexible main body to cover the sensing electrode layer. The memory metal body is disposed on one face of the flexible main body or one face of the protection layer for curling the flexible main body for easy carry or storage. Accordingly, the convenient portable input device is flexible, lightweight and thin for a user to conveniently carry.

Abstract translation: 便携式输入装置包括柔性主体，感测电极层，保护层和记忆金属体。 柔性主体具有第一面和第二面。 感测电极层具有设置在柔性主体的第二面上的第一感测电极和第二感测电极。 保护层相应地设置在柔性主体的第二面上以覆盖感测电极层。 记忆金属体设置在柔性主体的一个面或保护层的一个表面上，用于卷曲柔性主体以便于携带或存放。 因此，方便的便携式输入设备是灵活的，轻便的和薄的，用户方便携带。

公开(公告)号：US20060263929A1

公开(公告)日：2006-11-23

申请号：US11130662

申请日：2005-05-17

Applicant: Akira Matsunami

Inventor： Akira Matsunami

IPC: H01L21/00 ,  H01L21/44 ,  H01L23/02

CPC classification number: H01L21/4846 ,  H01L23/49816 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0308 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

Abstract: A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At least one of a plurality of solder balls of an IC device are then onto the at least one of the plurality of contact pads on the PCB. The temperature is then increased to reflow the solder paste. The IC device is then pulled away from the PCB as a function of a geometric shape of the IC device and held in a new position upon reflowing the solder paste to transform the at least one of the plurality of solder balls and the reflowed solder paste into a high shear strength solder joint structure. The reflow temperature is then lowered to room temperature to attach the high shear strength solder joint structure to the at least one of the plurality of lands on the PCB.

Abstract translation: 一种用于将BGA焊球附着到PCB上的技术。 在一个示例性实施例中，这通过将焊膏施加到PCB上的多个接触焊盘中的至少一个来实现。 然后，IC器件的多个焊球中的至少一个焊接到PCB上的多个接触焊盘中的至少一个上。 然后升高温度以回流焊膏。 然后将IC器件作为IC器件的几何形状的函数从PCB中拉出，并且在回流焊膏时保持在新的位置，以将多个焊球和回流的焊膏中的至少一个变换为 高剪切强度焊点结构。 然后将回流温度降低至室温，以将高剪切强度焊点结构附着到PCB上的多个焊盘中的至少一个。

公开(公告)号：US20060019510A1

公开(公告)日：2006-01-26

申请号：US11040930

申请日：2005-01-21

Applicant: Dickory Rudduck ,  Michael Razic ,  Geoffrey Sizer ,  Michael Hort

Inventor： Dickory Rudduck ,  Michael Razic ,  Geoffrey Sizer ,  Michael Hort

IPC: H01R12/00

CPC classification number: F16B1/0014 ,  F16B35/04 ,  H05K3/301 ,  H05K7/142 ,  H05K2201/0308 ,  H05K2201/10598

Abstract: The invention provides a fastener assembly suitable for joining a first element such as a circuit board to a second element such as a casing or another circuit board. The fastener assembly includes a first component which has a pin and a second component which includes a cavity for receiving at least part of the pin. In one aspect, at least part of the second component capable of being received within a bore in the first element. Either the first component or the second component is made of material which can change from a first shape to a second shape at a particular temperature. The pin of the first component is adapted to be locked into the cavity of the second component when the second shape is attained, through interaction of the material with the cavity, without deformation of the pin.

Abstract translation: 本发明提供了一种紧固件组件，其适于将诸如电路板的第一元件接合到诸如外壳或另一电路板的第二元件。 紧固件组件包括具有销和第二部件的第一部件，第二部件包括用于接收销的至少一部分的空腔。 在一个方面，能够容纳在第一元件的孔内的第二部件的至少一部分。 第一部件或第二部件都可以由在特定温度下从第一形状变为第二形状的材料制成。 当通过材料与空腔的相互作用而获得第二形状时，第一部件的销适于锁定到第二部件的空腔中，而销的变形。

公开(公告)号：US20060002783A1

公开(公告)日：2006-01-05

申请号：US11133747

申请日：2005-05-19

Applicant: Dickory Rudduck ,  Michael Hort ,  Nicholas Ng ,  Geoffrey Sizer

Inventor： Dickory Rudduck ,  Michael Hort ,  Nicholas Ng ,  Geoffrey Sizer

IPC: F16B39/00

CPC classification number: H05K3/301 ,  F16B1/0014 ,  F16B33/02 ,  F16B35/04 ,  F16B37/08 ,  F16B2001/0035 ,  H05K2201/0308 ,  H05K2201/10598

Abstract: Quick release bolt assembly included shank and head of larger cross-section than that of shank. The screw thread of shank is adapted to rotatably engage with a complementary screw thread in a nut. Disengagement means are adapted in use to disengage the head or the nut without rotation of the nut or shank. The disengagement means includes a material such as shape memory alloy or epoxy resin, adapted to change form to facilitate engagement when activated. Activation may take place by a direct power supply or remotely by a radio frequency, magnetic, ultrasonic or infra red signal. Bolt can be used for anchoring seat belts. Computer systems and methods for the identification of a target, including enquiring as to the status of the target and having means to command the target to change the status are also disclosed and claimed.

Abstract translation: 快速释放螺栓组件包括柄部和头部，横截面大于柄部。 柄的螺纹适于与螺母中的互补螺纹旋转地接合。 拆卸装置适用于在螺母或柄部旋转的情况下使头部或螺母脱开。 分离装置包括诸如形状记忆合金或环氧树脂的材料，其适于改变形式以促进当被激活时的接合。 激活可以通过直接电源或远程通过射频，磁，超声波或红外线信号进行。 螺栓可用于固定安全带。 还公开并声明了用于识别目标的计算机系统和方法，包括询问目标的状态并具有指示目标改变状态的方法。

公开(公告)号：US06906262B2

公开(公告)日：2005-06-14

申请号：US10860579

申请日：2004-06-04

Applicant: Yuichi Fujimura

Inventor： Yuichi Fujimura

IPC: H05K7/00 ,  H01B7/00 ,  H01B7/08 ,  H01R4/01 ,  H02G11/00 ,  H05K1/00 ,  H05K7/14

CPC classification number: H05K1/028 ,  H01R4/01 ,  H01R12/59 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: In a flexible print circuit having a plurality of signal wires, core wires formed from a shape memory material are provided on the two end portions thereof in the direction of width, and are caused to memorize a wiring completion shape within an electronic instrument in advance. In a wire harness having a plurality of signal wires, core wires formed from a shape memory alloy are disposed on the two sides of the planar signal wire array, or positioned along the central axis of the signal wires which are bundled into circular form. A guide frame for guiding a wire harness having a plurality of signal wires and which is caused to memorize in advance a shape which removes the wire harness from the movement range of a movable component within the electronic instrument.

Abstract translation: 在具有多条信号线的柔性印刷电路中，由形状记忆材料形成的芯线在其宽度方向的两端部设置，并预先在电子仪器内记忆布线完成形状。 在具有多个信号线的线束中，由形状记忆合金形成的芯线设置在平面信号线阵列的两侧，或沿着捆扎成圆形的信号线的中心轴定位。 引导框架，用于引导具有多根信号线的线束，并且预先记录从电子仪器内的可移动部件的移动范围移除线束的形状。

公开(公告)号：US06764325B2

公开(公告)日：2004-07-20

申请号：US10152144

申请日：2002-05-20

Applicant: George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

Inventor： George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

IPC: H01R1362

CPC classification number: H05K3/306 ,  H01R4/01 ,  H01R12/7035 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2203/306

Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

Abstract translation: 本发明涉及用于最小化载体基底和与其连接的部件之间的开放电连接的装置和方法，其由于暴露于将部件固定到基板而遇到的增加的热分布而由于在基板中的下垂而发生。 零插入力热活化固定销在升温过程中膨​​胀或弯曲，在印刷电路板上产生向上的力。 该向上的力抵抗向下的下垂力，并使载体基板保持与所连接部件的共面关系。

公开(公告)号：US20040038560A1

公开(公告)日：2004-02-26

申请号：US10651821

申请日：2003-08-29

Applicant: FormFactor, Inc.

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US20040011557A1

公开(公告)日：2004-01-22

申请号：US10198792

申请日：2002-07-18

Inventor： Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/303 ,  H01L2224/81141 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.

Abstract translation: 一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。 保持器包括热膨胀构件和保持构件。 由可热膨胀材料形成的热膨胀构件与保持构件联接并围绕其周围设置。 保持构件被构造成与部件联接，并且当组件组装到双面印刷电路板上时，保持构件被形成在双面印刷电路板中的开口接收。 热膨胀构件构造成在组件的组装期间膨胀，与限定开口的内表面接合。 因此，当双面印刷电路板随后被倒置，填充和回流时，该部件被保持和支撑。