公开(公告)号：US20070218710A1

公开(公告)日：2007-09-20

申请号：US11525755

申请日：2006-09-22

Applicant: Dirk Brown ,  John Williams ,  William Long

Inventor： Dirk Brown ,  John Williams ,  William Long

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10719 ,  H05K2201/10924 ,  H05K2201/10946

Abstract: An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.

Abstract translation: 弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。 在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。 在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

公开(公告)号：US20070197091A1

公开(公告)日：2007-08-23

申请号：US11309718

申请日：2006-09-15

Applicant: MING-CHIH HSIEH

Inventor： MING-CHIH HSIEH

IPC: H01R13/648

CPC classification number: H01R12/52 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/366 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A PCB assembly includes a motherboard, a daughter board, and an elastic strip. The motherboard is electrically connected to the daughter board via connectors. Each of the motherboard and the daughter board includes an area connected to a power layer or a ground layer. One end of the elastic strip electrically connects to the area of the motherboard. The other end of the elastic strip electrically connects to the area of the daughter board whereby increases electrically connection between the motherboard and the daughter board.

Abstract translation: PCB组件包括母板，子板和弹性条。 主板通过连接器与子板电连接。 主板和子板中的每一个包括连接到电源层或接地层的区域。 弹性带的一端电连接到母板的区域。 弹性带的另一端电连接到子板的区域，从而增加母板和子板之间的电连接。

公开(公告)号：US07226296B2

公开(公告)日：2007-06-05

申请号：US11022137

申请日：2004-12-23

Applicant: Hung Viet Ngo

Inventor： Hung Viet Ngo

IPC: H01L21/00

CPC classification number: H01R43/0256 ,  H01R12/57 ,  H01R13/514 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: An electrical contact for a ball grid array connector is disclosed for providing improved solder ball connection with a substrate. The contacts may be compressed, enabling solder balls of the connector to abut with the substrate prior to reflow. During reflow, the compression may be relieved by the contact extending further into the solder ball, returning the contact to an uncompressed state.

Abstract translation: 公开了一种用于球栅阵列连接器的电接触件，用于提供与衬底的改进的焊球连接。 触点可以被压缩，使得连接器的焊球能够在回流之前与基板邻接。 在回流期间，通过进一步延伸到焊球中的接触可以减轻压缩，使接触件返回到未压缩状态。

公开(公告)号：US07187518B2

公开(公告)日：2007-03-06

申请号：US10878044

申请日：2004-06-29

Applicant: Min-pyo Hong ,  Yong-kyu Byun ,  Jeong-seok Koh

Inventor： Min-pyo Hong ,  Yong-kyu Byun ,  Jeong-seok Koh

IPC: G11B17/02 ,  H01R9/09 ,  H02K5/22

CPC classification number: H05K3/365 ,  H05K1/056 ,  H05K2201/0311

Abstract: A flexible printed circuit (FPC), electrically connecting a spindle motor on a base of a disk drive with a printed circuit board (PCB) outside of the base, and a disk drive including the FPC, are provided. The FPC includes a wiring portion having one end connected to the spindle motor; a bonded portion connected to the other end of the wiring portion and attached to the base; electrode supports, each having a predetermined elasticity and extending from an outside edge of the bonded portion; a wiring disposed along the wiring portion and the bonded portion; and first electrodes disposed on the electrode supports and connected to the wiring. The first electrodes contact second electrodes disposed on the PCB due to the elasticities of the electrode supports. The disk drive allows the spindle motor to be electrically connected to the PCB using only the FPC, i.e., without using a separate connector.

Abstract translation: 提供了将磁盘驱动器的基座上的主轴电动机与基座之外的印刷电路板（PCB）电连接的柔性印刷电路（FPC）以及包括FPC的盘驱动器。 FPC包括具有连接到主轴电机的一端的布线部分; 接合部，其与所述配线部的另一端连接并安装于所述基座; 每个电极支撑件具有预定的弹性并且从接合部分的外边缘延伸; 沿着布线部分和接合部分布置的布线; 以及设置在所述电极支架上并连接到所述布线的第一电极。 由于电极支撑件的弹性，第一电极接触设置在PCB上的第二电极。 磁盘驱动器允许主轴电机仅使用FPC电连接到PCB，即不使用单独的连接器。

公开(公告)号：US20060281341A1

公开(公告)日：2006-12-14

申请号：US11421720

申请日：2006-06-01

Applicant: Kaoru Soeta

Inventor： Kaoru Soeta

IPC: H01R12/00

CPC classification number: H01R13/2421 ,  H01L24/95 ,  H01L2224/73204 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01R12/7076 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10083 ,  H05K2201/10106 ,  H05K2201/10265 ,  H05K2201/10977 ,  H01L2924/00

Abstract: An electronically functioning device module, an input device having the electronically functioning device module, and electronic equipment having the input device is provided. LEDs or a microphone device are mounted to a back surface of a seat member on which reversing plates are mounted.

Abstract translation: 提供电子功能装置模块，具有电子功能装置模块的输入装置和具有输入装置的电子设备。 LED或麦克风装置安装到座椅构件的背面上，在其上安装有反转板。

公开(公告)号：US20060276059A1

公开(公告)日：2006-12-07

申请号：US11408566

申请日：2006-04-21

Applicant: Larry Dittmann ,  John Williams ,  William Long

Inventor： Larry Dittmann ,  John Williams ,  William Long

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A Flat Flex Connector (FFC) has connector flanges embedded in its insulated electrical traces. The flanges engage electrical circuits in a camera module such as a CMOS or CCD and are clamped into electrical engagement. The opposite end of the FFC makes electrical contact with another electrical device such as a semiconductor circuit. The assembly allows electrical connection of two or more devices in a confined space in which the electrical device are not easily aligned for electrical contact.

公开(公告)号：US20060258183A1

公开(公告)日：2006-11-16

申请号：US11491160

申请日：2006-07-24

Applicant: John Williams

Inventor： John Williams

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive layers and holes through the substrate. The first and second conductive layers are adhered to opposite sides of the flexible substrate and have a plurality of raised contact elements in registration with at least a subset of the holes. At least some contact elements on the first and second conductive layers that oppose each other are in electrical communication with one another by way of the plating.

公开(公告)号：US07114961B2

公开(公告)日：2006-10-03

申请号：US11265205

申请日：2005-11-03

Applicant: John D. Williams

Inventor： John D. Williams

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive layers and holes through the substrate. The first and second conductive layers are adhered to opposite sides of the flexible substrate and have a plurality of raised contact elements in registration with at least a subset of the holes. At least some contact elements on the first and second conductive layers that oppose each other are in electrical communication with one another by way of the plating.

Abstract translation: 兼容，可扩展，热电机械，柔性电连接器。 在一种配置中，柔性电连接器包括柔性基板，第一和第二导电层以及连续施加在导电层上的电镀层和通过基板的孔。 第一和第二导电层粘附到柔性基板的相对侧上，并且具有多个与至少一个孔的子集对准的凸起接触元件。 在第一和第二导电层上彼此相对的至少一些接触元件通过电镀彼此电连通。

公开(公告)号：US20060211278A1

公开(公告)日：2006-09-21

申请号：US11440145

申请日：2006-05-23

Applicant: Gaetan Mathieu ,  Benjamin Eldridge

Inventor： Gaetan Mathieu ,  Benjamin Eldridge

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/71 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

公开(公告)号：US20060158855A1

公开(公告)日：2006-07-20

申请号：US11039212

申请日：2005-01-19

Applicant: James Wilson ,  Michael Moore

Inventor： James Wilson ,  Michael Moore

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/3677 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2203/083 ,  H01L2924/00

Abstract: According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.

Abstract translation: 根据本发明的一个实施例，一种用于电子组件的热管理系统包括耦合到基板的电子部件，耦合到冷板的基板，设置在电子部件和冷板之间并与其接合的弹簧部件，以及 传热元件设置在由弹簧构件形成的腔室内。