公开(公告)号：US20050003171A1

公开(公告)日：2005-01-06

申请号：US10891652

申请日：2004-07-14

Applicant: Scott Terrell ,  Clifton Seusy ,  Robert Cannon ,  Darrell Mason ,  Brandon Bailey ,  Douglas Hastings

Inventor： Scott Terrell ,  Clifton Seusy ,  Robert Cannon ,  Darrell Mason ,  Brandon Bailey ,  Douglas Hastings

IPC: H01R13/24 ,  H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32 ,  H05K3/42 ,  H01L21/44

CPC classification number: H01R13/2414 ,  H05K1/113 ,  H05K3/062 ,  H05K3/108 ,  H05K3/243 ,  H05K3/247 ,  H05K3/325 ,  H05K3/326 ,  H05K3/427 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10378 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: An interposer with a contact well, a layer that isolates one side of the interposer from the other side, for isolations of off gasses, and an optional elastomeric pad and a hard stop layer. Included is a method of making the interposer.

Abstract translation: 具有接触阱的插入器，将隔离物的一侧与另一侧隔离的层，用于隔离气体，以及可选的弹性垫和硬停止层。 包括一种制作插值器的方法。

公开(公告)号：US20040252010A1

公开(公告)日：2004-12-16

申请号：US10855342

申请日：2004-05-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Koichi Tanaka

IPC: H01C010/32

CPC classification number: H01C17/24 ,  H01C17/22 ,  H05K1/167 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/171

Abstract: A circuit board high in reliability and a method for manufacturing the circuit board are provided. The electrical resistance is accurately adjustable without damaging the circuit body even if it is made of resinous material and is free from a change over time. A circuit board in which a resistor (16) consisting of a resistor paste is printed between electrodes (14a) formed on a circuit pattern (14) printed on a printed circuit board (11), wherein a conductor (18) for adjusting the electrical resistance value of the resistor is coated on the surface of the resistor.

Abstract translation: 提供了可靠性高的电路板和制造电路板的方法。 电阻精确可调，即使是由树脂材料制成，也不会随时间变化而损坏电路体。 一种电路板，其中由形成在印刷电路板（11）上的电路图案（14）上形成的电极（14a）之间印刷由电阻膏组成的电阻器（16），其中，用于调节电气 电阻器的电阻值涂覆在电阻器的表面上。

公开(公告)号：US20040238953A1

公开(公告)日：2004-12-02

申请号：US10449212

申请日：2003-05-30

Inventor： Masood Murtuza ,  Muthiah Venkateswaran ,  Satyendra Singh Chauhan

IPC: H01L023/48

CPC classification number: H01L23/49811 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H05K1/111 ,  H05K3/243 ,  H05K3/245 ,  H05K3/3452 ,  H05K2201/035 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In accordance with the present invention, a built-up bump pad structure and method for the same are provided. The bump pad structure includes a substrate, a bump pad disposed upon the substrate, a solder mask disposed upon the substrate defining an opening around the bump pad, and a conductive material deposited upon the bump pad such that the conductive material at least partially fills the opening around the bump pad.

Abstract translation: 根据本发明，提供了一种用于其的积层凸块焊盘结构及其方法。 所述凸块焊盘结构包括衬底，设置在所述衬底上的凸块焊盘，设置在所述衬底上的限定围绕所述凸块焊盘的开口的焊接掩模以及沉积在所述凸块焊盘上的导电材料，使得所述导电材料至少部分地填充 打开碰撞垫周围。

公开(公告)号：US20040198053A1

公开(公告)日：2004-10-07

申请号：US10832436

申请日：2004-04-27

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

公开(公告)号：US06794956B2

公开(公告)日：2004-09-21

申请号：US10223629

申请日：2002-08-20

Applicant: Masaaki Taniguchi ,  Hidekazu Kitamura

Inventor： Masaaki Taniguchi ,  Hidekazu Kitamura

IPC: H03H700

CPC classification number: H01L27/016 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K1/167 ,  H05K3/245 ,  H05K3/321 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10992 ,  Y02P70/611

Abstract: A circuit substrate includes resistive films are disposed on the surfaces of lands included in a circuit pattern and these resistive films are used as resistances connected in series to a capacitor. Therefore, the resistances are connected in series without increasing the inductance in the capacitor, and accordingly, a circuit having a small impedance variation with respect to frequency can be obtained. Therefore, it is possible to obtain a power supply circuit and so forth having stable operation and fast response.

Abstract translation: 电路基板包括电阻膜设置在包括在电路图案中的焊盘的表面上，并且这些电阻膜用作串联连接到电容器的电阻。 因此，电阻串联连接而不增加电容器中的电感，因此可以获得相对于频率具有小的阻抗变化的电路。 因此，可以获得稳定运行和快速响应的电源电路等。

公开(公告)号：US06768064B2

公开(公告)日：2004-07-27

申请号：US10190496

申请日：2002-07-09

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H01R1204

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste being projected from said resin film.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线板组装部件来层叠多层布线基板组件，该多个多层布线基板组装部件通过制备由镀铜树脂膜制成的镀铜树脂膜10，该镀铜树脂膜由具有粘合性的树脂膜制成，该树脂膜具有 在其一个表面上结合有铜箔，其中通过所述铜箔和所述树脂膜打开通孔，以及通过丝网印刷嵌入所述镀铜树脂膜的所述铜箔的所述铜箔的通孔中的导电膏， 所述导电浆料的端部从所述树脂膜突出。

公开(公告)号：US06736058B2

公开(公告)日：2004-05-18

申请号：US10152257

申请日：2002-05-21

Applicant: John M. Michiels ,  Darryl M. Stansbury

Inventor： John M. Michiels ,  Darryl M. Stansbury

IPC: B41M112

CPC classification number: B41M1/12 ,  B41M1/34 ,  B41M3/006 ,  H01J29/92 ,  H01L51/0004 ,  H05K1/092 ,  H05K1/181 ,  H05K3/1233 ,  H05K3/248 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09045 ,  H05K2201/09981 ,  H05K2203/0264

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner. The disclosed method is particularly suitable for forming continuous electrically conductive structures or circuit traces extending from a lower level of a substrate, such as an anode plate of an FED device, up onto at least one second surface vertically distanced from the substrate. The electrically conductive structure may optionally terminate into a specifically configured contact pad for accommodating complementary contacting structures located on a mating component, such as a cathode plate of an FED device.

Abstract translation: 在基板上丝网印刷连续结构的方法，其中丝网印刷结构从至少第一层延伸到至少第二层。 所公开的方法特别适用于制造微电子器件及其组件，包括制造场致发射显示器件。 优选地，使用具有通过其形成的预配置印刷图案的优选厚度的印刷丝网与具有优选范围内的硬度的刮板组合，以将丝网印刷物质强制在基材上，同时将印刷丝网的一部分保持在 优选的参考角度。 所得到的丝网印刷结构以连续的“上坡”方式从至少一个下层延伸到至少一个上层。 所公开的方法特别适用于形成从底层（例如FED装置的阳极板）的下层延伸到连续离开衬底的至少一个第二表面上的连续导电结构或电路迹线。 导电结构可以可选地端接到具体配置的接触焊盘中，用于容纳位于配合部件（例如FED装置的阴极板）上的互补接触结构。

公开(公告)号：US20040078967A1

公开(公告)日：2004-04-29

申请号：US10689471

申请日：2003-10-20

Inventor： Tongbi Jiang ,  Edward A. Schrock

IPC: H01R013/432 ,  H01R009/00 ,  H05K003/34

CPC classification number: H01L24/83 ,  H01L24/31 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49181 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract translation: 可以使用含有导电颗粒的树脂沉积物形成Z轴电接触，所述导电颗粒可以沿着表面区域排列以在树脂材料上形成电传导路径。 如果树脂材料是热塑性的，则材料可以被加热以机械地结合到接触表面。 有利地，树脂材料可以通过强制含有导电颗粒的树脂基质通过模板中的环形开口形成。 所得到的构件允许接触表面，其可以是不规则的或可以被天然氧化物层覆盖。

公开(公告)号：US06616864B1

公开(公告)日：2003-09-09

申请号：US09651629

申请日：2000-08-30

Applicant: Tongbi Jiang ,  Edward A. Schrock

Inventor： Tongbi Jiang ,  Edward A. Schrock

IPC: H01B102

CPC classification number: H01L24/83 ,  H01L24/31 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49181 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract translation: 可以使用含有导电颗粒的树脂沉积物形成Z轴电接触，所述导电颗粒可以沿着表面区域排列以在树脂材料上形成电传导路径。 如果树脂材料是热塑性的，则材料可以被加热以机械地结合到接触表面。 有利地，树脂材料可以通过强制含有导电颗粒的树脂基质通过模板中的环形开口形成。 所得到的构件允许接触表面，其可以是不规则的或可以被天然氧化物层覆盖。

公开(公告)号：US20020134584A1

公开(公告)日：2002-09-26

申请号：US10102628

申请日：2002-03-22

Applicant: FUJIKURA LTD.

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K003/46

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a flexible resin film 1 which is provided with a copper foil 2 bonded to one surface thereof and an adhesive layer 3 bonded to the other surface, opening a through hole 7 in the copper plated resin film 10 through the resin film 1 and the adhesive layer 3, filling the through hole by screen printing from the copper foil 2 with a conductive paste to form a conductive paste filler 8 having a projection 8b as projected from the adhesive layer 3.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线基板组装体来层叠多层布线基板组件，该多个布线基板组装部件通过制备由柔性树脂膜1制成的镀铜树脂膜10制成，该柔性树脂膜1设置有一个接合在一个上的铜箔2 表面和粘合到另一表面的粘合剂层3，通过树脂膜1和粘合剂层3在镀铜树脂膜10中打开通孔7，通过丝网印刷从铜箔2填充通孔 导电膏以形成具有从粘合剂层3突出的突起8b的导电糊状填料8。