公开(公告)号：US20150305144A1

公开(公告)日：2015-10-22

申请号：US14405774

申请日：2013-06-04

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Hiroshi TAJIMA ,  Sirou YAMAUCHI

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0221 ,  B32B7/02 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/32 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/0393 ,  H05K9/0088 ,  H05K2201/0355 ,  H05K2201/0715

Abstract: Provided is a shield film having good shielding characteristics in the high frequency region, and a shield printed wiring board. A shield film, provided with, in a layered state: a plurality of metal layers (12, 14) (metal thin film (12), metal foil (14)); an insulating layer (13) disposed between the metal layers; and an electroconductive adhesive layer (15) disposed on the surface of the metal foil (14), from amongst the metal layers (12, 14), on which the insulating layer (13) is not disposed.

Abstract translation: 提供了在高频区域具有良好屏蔽特性的屏蔽膜和屏蔽印刷布线板。 以分层状态设置有多个金属层（12,14）（金属薄膜（12），金属箔（14））的屏蔽膜。 设置在所述金属层之间的绝缘层（13） 以及从未设置绝缘层（13）的金属层（12,14）中设置在金属箔（14）的表面上的导电粘合剂层（15）。

公开(公告)号：US20150302291A1

公开(公告)日：2015-10-22

申请号：US14753843

申请日：2015-06-29

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Hiroyoshi GOTOU

IPC: G06K19/077 ,  H05K3/40

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other.

Abstract translation: 一种天线片的制造方法。 该方法用于将天线线圈和连接图案中的至少一个连接到导电构件。 天线线圈和连接图案中的至少一个设置在基板的一个表面上，并且导电构件设置在基板的另一个表面上。 该方法包括对基板形成第一通孔进行压制处理，其中第一通孔穿过基板，并使天线线圈和连接图案中的至少一个与导电部件接触 彼此。 该方法还包括将天线线圈和连接图案中的至少一个和导电构件彼此熔化的熔化过程。

公开(公告)号：US20150264812A1

公开(公告)日：2015-09-17

申请号：US14724242

申请日：2015-05-28

Applicant: TECNOMAR OY

Inventor： Tom MARTTILA

IPC: H05K1/11

CPC classification number: H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

Abstract: A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.

Abstract translation: 层压体包含导电电路图案，基底材料和粘合剂图案或其它粘结。 每个导电电路图案和衬底材料通过粘合剂图案或其他结合物相互连接，其尺寸和形状基本上与每个导电电路图案的主要轮廓相匹配。 每个导电电路图案具有细线和薄的间隙空间，通过去除导电材料在粘合剂图案的顶部图案化或其他结合图案，使得电路图案的细间线空间可以具有粘合剂图案或其它粘合物的残留物。 在导电电路图案的主要轮廓之外，除了主轮廓的边缘区域之外，基底材料基本上不含粘合剂或其它粘合物。

公开(公告)号：US20150250080A1

公开(公告)日：2015-09-03

申请号：US14414514

申请日：2013-06-05

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Yusuke Haruna ,  Sirou Yamauchi ,  Hiroshi Tajima ,  Kenji Kamino

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0088 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/00 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0296 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0707 ,  H05K2201/0715 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract translation: 提供：在屏蔽膜的高频区域中具有优异屏蔽特性的屏蔽膜; 和屏蔽印刷线路板。 在柔性印刷电路板（8）上设置有具有形成有信号电路（6a）的基膜（5）的屏蔽膜（1）和设置在整个上部的绝缘膜（7） 所述基膜（5）的表面使得所述绝缘膜覆盖所述信号电路（6a）。 屏蔽膜1具有设置在绝缘膜7的整个表面上的导电粘合剂层15和设置在导电粘合剂层15的整个表面上的金属层11。

公开(公告)号：US09107324B2

公开(公告)日：2015-08-11

申请号：US14231758

申请日：2014-04-01

Applicant: Petteri Palm ,  Risto Tuominen ,  Antti Iihola

Inventor： Petteri Palm ,  Risto Tuominen ,  Antti Iihola

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/30

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H05K1/182 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.

Abstract translation: 制造方法和电路模块，其包括绝缘体层，并且在绝缘体层的内部至少一个部件，其包括其材料包含第一金属的接触区域。 绝缘体层的表面是包括至少第一层和第二层的导体，至少第二层含有第二金属。 电路模块包括接触区域和用于形成电触点的导体之间的接触元件。 接触元件在其接触区域的材料的表面上包括含有第三金属的中间层，使得第一，第二和第三金属是不同的金属和触点 中间层和接触面之间的表面积（ACONT 1）小于接触面积的表面积（APAD）。

公开(公告)号：US09101065B2

公开(公告)日：2015-08-04

申请号：US14306887

申请日：2014-06-17

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： Hiromasa Kato

IPC: B23K31/02 ,  H05K3/06 ,  H01L21/44 ,  B23K1/00 ,  H01L23/15 ,  H01L23/373 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K3/062 ,  B23K1/0016 ,  B23K2101/36 ,  C04B37/026 ,  C04B2235/658 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/706 ,  H01L21/44 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/202 ,  H05K3/3484 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0392 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/125 ,  H05K2203/167 ,  Y10T29/49156 ,  H01L2924/00

Abstract: According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm2 or less in the brazing material protrudent part is one or less (including zero).

Abstract translation: 根据一个实施例，陶瓷电路板包括陶瓷基板，铜电路板和钎焊材料突出部分。 铜电路板通过包括Ag，Cu和Ti的钎料层结合到陶瓷基板的至少一个表面上。 钎焊材料突出部分包括Ti相和总共3质量％以上的TiN相，其与介于陶瓷基板之间的钎焊材料层中的Ti相和TiN相的总量不同 和铜电路板。 钎焊材料凸部的面积为200μm2以下的空隙数为1个以下（包括零）。

公开(公告)号：US20150136460A1

公开(公告)日：2015-05-21

申请号：US14589004

申请日：2015-01-05

Applicant: PPG Industries Ohio, Inc.

Inventor： John R. Short

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/10272

Abstract: A transparency having a bus bar system includes a non-conductive substrate having a major surface. At least one conductive coating is located over at least a portion of the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is located over at least a portion of the conductive coating. A metallic member, such as a metallic foil or metallic braid, is located over the isotropically conductive adhesive.

Abstract translation: 具有母线系统的透明体包括具有主表面的非导电衬底。 至少一个导电涂层位于主表面的至少一部分上方。 导电粘合剂，例如各向同性导电的带或膜，位于导电涂层的至少一部分上方。 诸如金属箔或金属编织物的金属构件位于各向同性导电粘合剂上方。

公开(公告)号：US20150118474A1

公开(公告)日：2015-04-30

申请号：US14162045

申请日：2014-01-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung Hwan PARK ,  Sung Taek LIM ,  Dong Hoon KIM

IPC: H05K1/03 ,  B29B15/10

CPC classification number: H05K3/022 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/1545 ,  Y10T428/249921

Abstract: The present invention relates to a substrate raw material such as a copper clad laminate for manufacturing a circuit board. A substrate raw material in accordance with an embodiment of the present invention includes an insulating layer and an organic fiber cloth disposed in the insulating layer.

Abstract translation: 本发明涉及用于制造电路板的覆铜层压板等基板原料。 根据本发明实施例的基板原料包括设置在绝缘层中的绝缘层和有机纤维布。

公开(公告)号：US08998622B2

公开(公告)日：2015-04-07

申请号：US13601884

申请日：2012-08-31

Applicant: Taylor H. Gilbert ,  Sean S. Corbin

Inventor： Taylor H. Gilbert ,  Sean S. Corbin

IPC: H01R12/00 ,  H05K1/00 ,  H01R12/52 ,  H01R4/04 ,  H01R43/26 ,  H05K3/36 ,  H01R12/62

CPC classification number: H01R12/52 ,  H01R4/04 ,  H01R12/00 ,  H01R12/62 ,  H01R43/26 ,  H05K1/00 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/1034

Abstract: Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.

Abstract translation: 电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。 连接器可以形成在电子部件之间的小间隙中。 连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。 可以使用附接到连接器的施加器将连接器安装在组件之间。 施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。 涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。 连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

公开(公告)号：US20150041428A1

公开(公告)日：2015-02-12

申请号：US14518434

申请日：2014-10-20

Applicant: Viasystems Technologies Corp., L.L.C.

Inventor： Raj Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

IPC: H05K3/46

CPC classification number: H05K3/4623 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0271 ,  H05K2203/0502 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1461 ,  H05K2203/1536 ,  H05K2203/304 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

Abstract translation: 一种制造印刷电路板的至少一部分的方法。 该方法包括：在第一多层基板上施加层压粘合剂，该第一多层基板包括多个电路层，在第一多层基板的第一侧具有至少一个第一金属焊盘; 在层压粘合剂上涂上保护膜; 将至少一个通孔形成到所述层压粘合剂中以暴露所述第一多层基板的第一侧上的所述至少一个金属焊盘; 将至少一个导电浆料填充到在层压粘合剂中形成的至少一个通孔中; 去除所述保护膜以将所述层叠粘合剂暴露在所述第一多层基板上; 以及在所述第二多层基板的第二面上，将具有包含多个电路层的第二多层基板与至少一个第二金属焊盘连接的第一多层基板。