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    Combination circuit board and segmented conductive bus substrate
    44.
    发明授权
    Combination circuit board and segmented conductive bus substrate 失效
    组合电路板和分段导电总线基板

    公开(公告)号：US06535396B1

    公开(公告)日：2003-03-18

    申请号：US09560981

    申请日：2000-04-28

    Applicant: Thomas Alan Degenkolb ,  Darrel Eugene Peugh ,  Bruce Alan Myers

    Inventor： Thomas Alan Degenkolb ,  Darrel Eugene Peugh ,  Bruce Alan Myers

    IPC: H01R900

    CPC classification number: H01L25/162 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01R12/58 ,  H05K1/0263 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/1441 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0397 ,  H05K2201/10272 ,  H05K2201/1053 ,  H01L2924/00014

    Abstract: A combination circuit board (12) and segmented bus structure (54) defines a composite circuit board/bus assembly (52) upon which an electrical circuit may be assembled. The various segments (54a-54f) of bus structure (54) may be variously configured to achieve one or more assembly, performance, testing, and/or reliability goals. For example, one bus segment configuration provides integral connector tabs (54a and 54e) for mechanical and/or electrical connection to interconnecting wires or electrical terminals of one or more external devices. Another bus segment configuration (54d) provides for mechanical and high current electrical interconnections between one or more bus segments (54a-54f) and one or more electrical components (16, 18, 20) and/or conductive film patterns(64) formed on top surface (12b) of the circuit board (12). Still another bus segment configuration provides integral tabs (54b and 54c) for electrical connection to and mechanical attachment of electrical components (16, 18, 20) from one or more of such tabs (54b and 54c) extending through the circuit board (12) to other such tabs (54b and 54c) or other circuit structures. Yet another bus structure (54f) provides for highly efficient heat sinking capability and/or electrical connection for electrical components (18) mounted either directly to one or more bus segments (54f) and for electrical components (18) mounted to a substrate (68) that is itself mounted directly to one or more bus segments (54f).

    Abstract translation: 组合电路板（12）和分段总线结构（54）限定复合电路板/总线组件（52），电路可以在其上组装。 总线结构（54）的各个段（54a-54f）可以被不同地配置成实现一个或多个组件，性能，测试和/或可靠性目标。 例如，一个总线段配置提供一体的连接器接头（54a和54e），用于机械和/或电连接到一个或多个外部设备的互连电线或电气端子。 另一个总线段配置（54d）提供一个或多个总线段（54a-54f）与一个或多个电气部件（16,18,20）和/或形成在其上的导电膜图案（64）之间的机械和高电流电互连 电路板（12）的顶表面（12b）。 另一个总线段构造提供了一体的突片（54b和54c），用于与延伸穿过电路板（12）的一个或多个这样的突片（54b和54c）电连接并机械地附接电气部件（16,18,20） （54b和54c）或其他电路结构。 另一总线结构（54f）为直接安装到一个或多个总线段（54f）和安装到衬底（68f）上的电气部件（18）的电气部件（18）提供了高效的散热能力和/或电连接 ），其本身直接安装在一个或多个总线段（54f）上。

    Resistors
    45.
    发明申请
    Resistors 审中-公开
    电阻器

    公开(公告)号：US20030016117A1

    公开(公告)日：2003-01-23

    申请号：US10150579

    申请日：2002-05-17

    Applicant: Shipley Company, L.L.C.

    Inventor： David D. Senk ,  John Schemenaur ,  Wen-Yi Lin ,  Andrew T. Hunt

    IPC: H01C001/012

    CPC classification number: H05K1/167 ,  H01C7/006 ,  H01C17/08 ,  H01C17/24 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2203/171

    Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

    Abstract translation: 提供了具有轴依赖性的电阻率的电阻材料。 这种电阻材料在正交方向具有第一方向的电阻率和非常不同的电阻率。 这些电阻材料特别适用于嵌入印刷电路板的电阻器。

    Method of manufacture of integral low and high value resistors on a printed circuit board
    47.
    发明申请
    Method of manufacture of integral low and high value resistors on a printed circuit board 审中-公开
    在印刷电路板上制造集成的低和高值电阻器的方法

    公开(公告)号：US20020013997A1

    公开(公告)日：2002-02-07

    申请号：US09957747

    申请日：2001-09-21

    Inventor： Gregory J. Dunn ,  Min-Xian Zhang ,  Jovica Savic

    IPC: H01C017/06 ,  H01C017/00

    CPC classification number: H05K1/167 ,  H05K1/095 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/4913

    Abstract: Printed circuit boards with integral high and low value resistors are efficiently produced. The method of their manufacture entails applying a first layer of a low resistance material onto a dielectric substrate in a predetermined thickness and pattern. The pattern defines the electrical lengths and widths of low value resistors, as well as pairs of terminal electrode pads for the high value resistors. A second layer of a high resistance material is applied between and in contact with the top surfaces of the facing ends of each member of the terminal pad pairs. The fixed lengths, widths and thicknesses of the patterned high resistance material determine the values of the high value resistors. Conductive metal terminals are provided at the ends of the low value resistors and at the distal ends of the high value resistor pad pairs to complete the resistors.

    Abstract translation: 具有集成高，低值电阻器的印刷电路板得到有效的生产。 其制造方法需要以预定的厚度和图案将第一层低电阻材料施加到电介质基板上。 该模式定义了低值电阻器的电气长度和宽度，以及用于高值电阻器的一对端子电极焊盘。 将高电阻材料的第二层施加在端子垫对的每个构件的面对端的顶表面之间并与之接触。 图案化高电阻材料的固定长度，宽度和厚度决定了高值电阻器的值。 导电金属端子设置在低值电阻的两端，并在高电阻焊盘对的末端设置，以完成电阻。

    Flexible multi-layer circuit wiring board
    49.
    发明授权
    Flexible multi-layer circuit wiring board 失效
    柔性多层电路接线板

    公开(公告)号：US5408052A

    公开(公告)日：1995-04-18

    申请号：US117150

    申请日：1993-09-13

    Applicant: Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

    Inventor： Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

    IPC: H01L21/60 ,  H01L23/14 ,  H01L23/495 ,  H01L23/50 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H05R1/02

    CPC classification number: H05K3/4092 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0391 ,  H05K2201/09754 ,  H05K3/281

    Abstract: A flexible multi-layer circuit wiring board which is capable of constituting finger lead-like terminals that are little liable to be deformed even when the circuit conductors protruding like finger leads are finely formed and is capable of maintaining good flexibility at a bent portion. Circuit conductors 2 composed of an electrically conducting metal having a large Young's modulus are disposed at the ends of one surface of a flexible insulating base member 1 to form finger lead-like terminals 3, required circuit wiring conductors 4 composed of an electrically conducting metal rich in flexibility are disposed on the other surface of the flexible insulating base member 1 inclusive of a bent portion A of the circuit wiring board, and through-hole connection portions 5 are formed to electrically connect required portions of the circuit conductors 2 and the circuit wiring conductors 4.

    Abstract translation: PCT No.PCT / JP93 / 00029 Sec。 371日期1993年9月13日 102（e）1993年9月13日PCT 1993年1月12日PCT PCT。 第WO93 / 15520BC号公报 日期：1993年8月5日。一种柔性多层电路布线板，其能够构成指状引线状端子，即使在电线导体如指状突起突出的情况下也很难变形，并且能够保持良好 弯曲部分的柔韧性。 具有大杨氏模量的导电金属构成的电路导体2设置在柔性绝缘基底构件1的一个表面的端部，以形成指状引线端子3，所需的电路布线导体4由导电金属富集 在柔性绝缘基底构件1的另一个表面（包括电路布线板的弯曲部分A）上设置柔性，并且形成通孔连接部分5以将电路导体2的所需部分和电路布线 导体4。

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