公开(公告)号：US20150043177A1

公开(公告)日：2015-02-12

申请号：US14467079

申请日：2014-08-25

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

Abstract translation: 电子模块技术领域本发明涉及电子模块。 具体地，涉及一种包括嵌入在安装基座中的一个或多个部件的电子模块。 电子模块可以是类似于电路板的模块，其包括通过在模块中制造的导电结构电连接的多个部件。 这些组件可以是无源组件，微电路，半导体组件或其他类似组件。 通常连接到电路板的组件形成一组组件。 另一个重要的组件组件是通常封装以连接到电路板的组件。 本发明涉及的电子模块当然也可以包括其它类型的组件。

公开(公告)号：US08927874B2

公开(公告)日：2015-01-06

申请号：US13368520

申请日：2012-02-08

Applicant: Shohei Koide ,  Yusuke Suzuki ,  Mizuyo Kawano ,  Hiromitsu Mizutani

Inventor： Shohei Koide ,  Yusuke Suzuki ,  Mizuyo Kawano ,  Hiromitsu Mizutani

IPC: H05K1/00 ,  B41J2/14 ,  H05K1/02

CPC classification number: B41J2/14233 ,  B41J2002/14266 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/0293 ,  H05K2201/056 ,  Y10T29/49004 ,  Y10T29/49401

Abstract: A flexible wiring substrate includes: a flexible base material; a wire provided on the base material; and an inspection wire provided on the base material, having an inspection segment which breaks up under a condition that the inspection segment is folded with not less than a predetermined curvature and a non-inspection segment which does not break up under a condition that the non-inspection segment is folded with not less than the predetermined curvature.

Abstract translation: 柔性布线基板包括：柔性基材; 设置在基材上的线; 以及设置在基材上的检查丝，具有检查段在检查段以不小于预定曲率折叠的条件下分解的检查段和在非非预定曲率的条件下不分裂的非检查段， - 不同于预定曲率折叠。

公开(公告)号：US20140321601A1

公开(公告)日：2014-10-30

申请号：US14175344

申请日：2014-02-07

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan K. Koduri

IPC: A61B6/03 ,  G01N23/04

CPC classification number: A61B6/032 ,  A61B6/0407 ,  A61B6/107 ,  A61B6/4233 ,  A61B6/54 ,  A61B8/0858 ,  G01T1/2018 ,  H05K1/0216 ,  H05K1/189 ,  H05K2201/056

Abstract: An active shield for an X-ray computed tomography machine includes a radiation shielding substrate and a flexible circuit board wrapped around the substrate.

Abstract translation: 用于X射线计算机断层摄影机的主动屏蔽包括辐射屏蔽衬底和缠绕在衬底周围的柔性电路板。

公开(公告)号：US20140307391A1

公开(公告)日：2014-10-16

申请号：US13862400

申请日：2013-04-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Martin STANDING

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/189 ,  H05K1/0277 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/047 ,  H05K2201/056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133

Abstract: Representative implementations of devices and techniques provide a printed circuit board (PCB) arranged to at least partly surround an electrical component having a plurality of non-coplanar outer surfaces. The PCB is arranged to fold at one or more predetermined boundaries.

Abstract translation: 设备和技术的代表性实现提供布置成至少部分地围绕具有多个非共面外表面的电部件的印刷电路板（PCB）。 PCB布置成在一个或多个预定边界处折叠。

公开(公告)号：US08859909B2

公开(公告)日：2014-10-14

申请号：US13410857

申请日：2012-03-02

Applicant: Gary Dimmock

Inventor： Gary Dimmock

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01M2/1016 ,  H01M2/1061 ,  H01M2/1077 ,  H01M2/202 ,  H01M2/22 ,  H01M2/266 ,  H01M10/486 ,  H05K1/118 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A flexible cable with a substrate divided into at least two sections is disclosed. The first section includes a first electrically conductive track and a first attach pad, while the section includes a second and third electrically conductive tracks, as well as a second attach pad. The first section is disposed on the second section to align the attach pads and connect the first electrically conductive track to the third electrically conductive track. The resulting flexible cable can be used with a low profile electrical device.

Abstract translation: 公开了一种具有分为至少两个部分的基板的柔性电缆。 第一部分包括第一导电轨道和第一附接垫，而该部分包括第二和第三导电轨道以及第二附接垫。 第一部分设置在第二部分上以对准附接垫并将第一导电轨道连接到第三导电轨道。 所得到的柔性电缆可以与低调的电气设备一起使用。

公开(公告)号：US20140216792A1

公开(公告)日：2014-08-07

申请号：US14232977

申请日：2012-07-12

Applicant: Simon Sebanz ,  Hannes Voraberger ,  Richard McConnell ,  Luis Chau

Inventor： Simon Sebanz ,  Hannes Voraberger ,  Richard McConnell ,  Luis Chau

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K3/4611 ,  H05K3/4673 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/056 ,  H05K2201/09127 ,  H05K2203/1461 ,  Y10T29/49155

Abstract: A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps: providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material. Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.

Abstract translation: 制造刚柔柔性印刷电路板或其子组件的方法包括以下步骤：提供刚性绝缘材料层，去除刚性绝缘材料的至少一个区域，将柔性绝缘材料插入去除或切割的， 所述刚性绝缘材料的外部区域覆盖所述刚性和柔性绝缘材料，所述绝缘材料在至少一个表面上至少形成刚性柔性印刷电路板的至少另一层的刚性部分上的导电材料层（ s），其中刚性柔性印刷电路板的至少一个另外的层部分地与绝缘材料的柔性区域重叠。 此外，提供了刚性柔性印刷电路板或其子组件。

公开(公告)号：US08797748B2

公开(公告)日：2014-08-05

申请号：US13316348

申请日：2011-12-09

Applicant: Teodor Dabov

Inventor： Teodor Dabov

IPC: H05K1/00

CPC classification number: G06F1/1613 ,  H04M1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/09027 ,  H05K2201/2009

Abstract: An electronic device may be provided that has flexible circuitry such as spiral wrapped flexible circuitry. Flexible circuitry may be connected to one or more sides of an electronic component such as rigid printed circuit board or coupled between a rigid printed circuit board an another device component. Flexible circuitry may include an adhesive strip for maintaining a spiral wrap configuration of the flexible circuitry. An adhesive strip may be covered by a removable protective liner during manufacturing of an electronic device so that the flexible circuitry may be tested in a flat, unrolled configuration prior to installation in the electronic device. Flexible circuitry may include a conductive layer configured to form an electromagnetic shield for an electronic component mounted in the spiral wrap. Flexible circuitry may be wrapped around an elongated support member that is mounted along an edge of the electronic component.

Abstract translation: 可以提供具有诸如螺旋缠绕的柔性电路的柔性电路的电子设备。 柔性电路可以连接到诸如刚性印刷电路板的电子部件的一个或多个侧面，或者连接在刚性印刷电路板与另一个器件部件之间。 柔性电路可以包括用于维持柔性电路的螺旋卷绕构型的胶带。 在制造电子设备期间，粘合剂条可以由可移除的保护性衬垫覆盖，使得柔性电路可以在安装到电子设备中之前以平坦的展开形式进行测试。 柔性电路可以包括被配置为形成用于安装在螺旋状卷体中的电子部件的电磁屏蔽的导电层。 柔性电路可以围绕沿着电子部件的边缘安装的细长支撑构件缠绕。

公开(公告)号：US20130341597A1

公开(公告)日：2013-12-26

申请号：US13654317

申请日：2012-10-17

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hak-Gyu Kim

IPC: H01L27/32

CPC classification number: H01L27/3225 ,  H01L27/3276 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: An organic light emitting diode (OLED) display including a display panel, a chip on film, and a printed circuit (PCB) is disclosed. In one embodiment, the display panel includes a display area having an OLED and a pixel circuit, and a pad area in an outer side of the display area. The chip on film is connected to the pad area, is bent toward a non-luminescent surface of the display panel, and include an integrated circuit chip. The PCB includes at least a part overlapping with the chip on film in an outer side of the non-luminescent surface of the display panel, and an opening for receiving the integrated circuit.

Abstract translation: 公开了一种有机发光二极管（OLED）显示器，包括显示面板，胶片芯片和印刷电路（PCB）。 在一个实施例中，显示面板包括具有OLED和像素电路的显示区域和在显示区域的外侧的焊盘区域。 薄膜上的芯片连接到焊盘区域，朝向显示面板的非发光表面弯曲，并且包括集成电路芯片。 PCB包括与显示面板的非发光面的外侧的膜上的芯片重叠的部分和用于接收集成电路的开口的至少一部分。

公开(公告)号：US20130326863A1

公开(公告)日：2013-12-12

申请号：US13589220

申请日：2012-08-20

Applicant: ROLAND J. MENASSA ,  PAMELA R. PATTERSON ,  GEOFFREY P. MCKNIGHT ,  GUILLERMO A. HERRERA ,  HUNG D. NGUYEN ,  DOUGLAS MARTIN LINN ,  CHRIS A. IHRKE

Inventor： ROLAND J. MENASSA ,  PAMELA R. PATTERSON ,  GEOFFREY P. MCKNIGHT ,  GUILLERMO A. HERRERA ,  HUNG D. NGUYEN ,  DOUGLAS MARTIN LINN ,  CHRIS A. IHRKE

IPC: H01C17/28

CPC classification number: G01L1/22 ,  G01L5/009 ,  G01L5/226 ,  H05K1/0268 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10151 ,  H05K2203/163 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49103

Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.

Abstract translation: 公开了一种制造称重传感器组件的方法和折叠电路装置的方法。 提供一种柔性电路体，其包括具有至少一个铰链的条带，带材处于第一位置或展开位置。 多个应变计连接到条上，铰链位于应变计之间。 设置夹具，并且利用夹具将柔性电路体的条带沿着铰链折叠以限定条带的第二位置或折叠位置。

公开(公告)号：US20130308296A1

公开(公告)日：2013-11-21

申请号：US13608391

申请日：2012-09-10

Applicant: Dong-Hyun YOO ,  Bo-Yeong KIM ,  Jae-Won KIM ,  Kyung-Ho PARK ,  Hyung-Jun PARK

Inventor： Dong-Hyun YOO ,  Bo-Yeong KIM ,  Jae-Won KIM ,  Kyung-Ho PARK ,  Hyung-Jun PARK

IPC: H05K5/00 ,  G09F13/04

CPC classification number: G06F1/16 ,  G02F1/13452 ,  G02F2001/13332 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A top chassis assembly includes a top chassis and a contact unit. The top chassis surrounds a non-display area of a display panel. The non-display area includes a pad part through which a signal is provided to the display panel. The contact unit is disposed at an inner surface of the top chassis and contacts the pad part on the non-display area of the display panel.

Abstract translation: 顶部底盘组件包括顶部底盘和接触单元。 顶部底盘围绕显示面板的非显示区域。 非显示区域包括将信号提供给显示面板的焊盘部分。 接触单元设置在顶部机架的内表面处，并与显示面板的非显示区域上的焊盘部分接触。