公开(公告)号：US20170215277A1

公开(公告)日：2017-07-27

申请号：US15414167

申请日：2017-01-24

Applicant: KYOCERA Corporation

Inventor： Masaaki HARAZONO ,  Takayuki UMEMOTO

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H01L2224/16225 ,  H05K1/0373 ,  H05K3/4673 ,  H05K2201/0191 ,  H05K2201/0769

Abstract: The wiring board of the present disclosure includes an insulating layer, and a wiring conductor existing so as to be adjacent to both main surfaces of the insulating layer; the insulating layer includes at least two particle-containing resin layers containing insulating particles in an insulating resin, and a particle-free resin layer formed of an insulating resin; and the particle-free resin layer is interposed between the particle-containing resin layers.

公开(公告)号：US20160381795A1

公开(公告)日：2016-12-29

申请号：US15161661

申请日：2016-05-23

Applicant: FUJITSU LIMITED

Inventor： Junya Ikeda ,  Miwa Kozawa ,  Tsuyoshi Kanki ,  Yoshihiro Nakata

IPC: H05K1/09 ,  H05K1/18 ,  H01L23/498 ,  H05K3/46 ,  H05K3/32 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/09 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0353 ,  H05K1/185 ,  H05K3/0085 ,  H05K3/244 ,  H05K3/285 ,  H05K3/32 ,  H05K3/388 ,  H05K3/4661 ,  H05K2201/0769 ,  H05K2201/2072 ,  H05K2203/0713 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/1361 ,  H01L2924/00012

Abstract: An electronic device includes: a substrate; a Cu-containing wiring layer formed over the substrate; a barrier metal layer that covers a surface of the Cu-containing wiring layer and suppresses diffusion of Cu; and a coating insulating layer that covers the barrier metal layer, wherein the barrier metal layer has a void that does not reach the Cu-containing wiring layer, and the void is filled with the coating insulating layer.

Abstract translation: 电子设备包括：基板; 形成在所述基板上的含Cu布线层; 覆盖含Cu布线层的表面并抑制Cu的扩散的阻挡金属层; 以及覆盖所述阻挡金属层的覆盖绝缘层，其中所述阻挡金属层具有不到达所述含Cu布线层的空隙，并且所述空隙填充有所述涂覆绝缘层。

公开(公告)号：US09491858B2

公开(公告)日：2016-11-08

申请号：US14864895

申请日：2015-09-25

Applicant: FUJIFILM Corporation

Inventor： Yasushi Endo ,  Nobuyuki Tada ,  Kenji Naoi ,  Tomohito Asai ,  Hideo Ikeda ,  Michihiro Shibata

IPC: H05K1/09 ,  H05K1/11 ,  C09J133/26 ,  C08F220/18 ,  C09J133/08 ,  C09J133/10 ,  H05K1/02 ,  H05K3/28 ,  G06F3/044 ,  H05K3/46

CPC classification number: H05K1/11 ,  C08F220/18 ,  C09J133/08 ,  C09J133/10 ,  C09J133/26 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/285 ,  H05K3/4673 ,  H05K2201/0108 ,  H05K2201/0761 ,  H05K2201/0769 ,  C08F2220/1858 ,  C08F220/20

Abstract: This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.

Abstract translation: 该布线板设置有：设置在绝缘基板上的多个金属线; 以及设置在金属线上并与金属线直接接触的透明粘合剂层。 金属线包括：具有供给脉冲信号的第一金属线; 以及施加有固定电位的第二金属线。 脉冲信号具有与固定电位相同的参考电平，并且具有脉冲序列，其中布置脉冲宽度不超过3毫秒的多个脉冲，脉冲在600秒的周期内的积分时间 小于60秒。

公开(公告)号：US20150234271A1

公开(公告)日：2015-08-20

申请号：US14706564

申请日：2015-05-07

Applicant: FUJIFILM Corporation

Inventor： Tsukasa TOKUNAGA ,  Shin TAJIRI ,  Makoto SUTOU ,  Toshinari FUJII ,  Shinichi NAKAHIRA ,  Kensuke KATAGIRI ,  Nozomu TONOIKE

IPC: G03F7/004 ,  G03F7/16 ,  G03F7/40 ,  G03F7/20

CPC classification number: G03F7/0043 ,  G03C1/047 ,  G03C1/053 ,  G03C1/85 ,  G03C1/915 ,  G03C5/04 ,  G03C2001/0475 ,  G03C2001/0478 ,  G03F7/168 ,  G03F7/20 ,  G03F7/40 ,  G06F3/041 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/092 ,  H05K3/105 ,  H05K3/106 ,  H05K3/28 ,  H05K3/381 ,  H05K3/386 ,  H05K2201/0215 ,  H05K2201/0769 ,  H05K2203/0796 ,  H05K2203/162

Abstract: A manufacturing method of a conductive sheet includes: a step A of forming a silver halide-containing photosensitive layer, which contains silver halide, gelatin, and a polymer different from the gelatin and in which a mass ratio (Y/X) of a mass Y of the polymer to a mass X of the gelatin is equal to or greater than 0.1, on a support; a step B of forming conductive portions containing metal silver by performing exposure and then development treatment on the silver halide-containing photosensitive layer; and a step C of treating the support having the conductive portions with an oxidant which has a standard electrode potential of equal to or greater than +1.5 V and decomposes the gelatin.

Abstract translation: 导电片的制造方法包括：形成含有卤化银，明胶和不同于明胶的聚合物的含卤化银的感光层的步骤A，其中质量比（Y / X） 在支持体上聚合物相对于明胶质量X的Y等于或大于0.1; 通过对含有卤化银的感光层进行曝光，然后显影处理，形成含有金属银的导电部分的工序B; 以及步骤C，用标准电极电位等于或大于+ 1.5V的氧化剂处理具有导电部分的载体并分解明胶。

公开(公告)号：US20150034366A1

公开(公告)日：2015-02-05

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US20150014030A1

公开(公告)日：2015-01-15

申请号：US14467680

申请日：2014-08-25

Applicant: FUJIFILM Corporation

Inventor： Yasuhiro MITAMURA ,  Masaya NAKAYAMA ,  Yuki MATSUNAMI

IPC: H05K1/02 ,  H05K1/09 ,  H01B3/44

CPC classification number: H05K1/0256 ,  B32B3/08 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/00 ,  C08K5/378 ,  C08K5/47 ,  H01B3/447 ,  H05K1/092 ,  H05K3/285 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0206 ,  H05K2201/032 ,  H05K2201/0769 ,  Y10T428/2804

Abstract: A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.

Abstract translation: 用于形成银离子扩散抑制层的组合物包括绝缘树脂和包含选自三唑结构，噻二唑结构和苯并咪唑结构的结构的化合物; 巯基; 和至少一个任选含有杂原子的烃基，烃基或碳原子数的总数为5以上。 用于形成银离子扩散抑制层的组合物允许形成能够抑制银或银合金的金属互连之间的银离子迁移的银离子扩散抑制层，以提高金属互连之间的绝缘的可靠性。

公开(公告)号：US08847390B2

公开(公告)日：2014-09-30

申请号：US13951596

申请日：2013-07-26

Applicant: Eiji Hashino ,  Shinji Ishikawa ,  Shinichi Terashima ,  Masamoto Tanaka

Inventor： Eiji Hashino ,  Shinji Ishikawa ,  Shinichi Terashima ,  Masamoto Tanaka

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498

CPC classification number: H01L23/49866 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2924/301 ,  H01L2924/381 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0769 ,  H05K2203/041 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2924/01015 ,  H01L2924/01012 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01025 ,  H01L2924/01013 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: According to a lead-free solder bump bonding structure, by causing the interface (IMC interface) of the intermetallic compound layer at a lead-free-solder-bump side to have scallop shapes of equal to or less than 0.02 [portions/μm] without forming in advance an Ni layer as a barrier layer on the surfaces of respective Cu electrodes of first and second electronic components like conventional technologies, a Cu diffusion can be inhibited, thereby inhibiting an occurrence of an electromigration. Hence, the burden at the time of manufacturing can be reduced by what corresponds to an omission of the formation process of the Ni layer as a barrier layer on the Cu electrode surfaces, and thus a lead-free solder bump bonding structure can be provided which reduces a burden at the time of manufacturing in comparison with conventional technologies and which can inhibit an occurrence of an electromigration.

Abstract translation: 根据无铅焊料接合结构，通过使无铅焊料凸点侧的金属间化合物层的界面（IMC界面）具有等于或小于0.02 [份/μm]的扇形， 在不像传统技术那样在第一和第二电子部件的各个Cu电极的表面上预先形成Ni层作为阻挡层的情况下，可以抑制Cu扩散，从而抑制电迁移的发生。 因此，可以通过对作为Cu电极表面上的阻挡层的Ni层的形成处理的省略来减少制造时的负担，从而可以提供无铅焊料凸块接合结构，其中， 与传统技术相比，减少制造时的负担，并且可以抑制电迁移的发生。

公开(公告)号：US08653375B2

公开(公告)日：2014-02-18

申请号：US13059502

申请日：2008-08-21

Applicant: John W. Osenbach

Inventor： John W. Osenbach

IPC: H01B5/00

CPC classification number: H05K3/244 ,  C23C10/02 ,  C23C10/04 ,  C23C26/00 ,  H01L23/49534 ,  H01L23/49582 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K2201/0769 ,  H01L2924/00

Abstract: An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.

Abstract translation: 电子设备包括具有表面的金属导电引线。 表面上的预焊料涂层基本上由锡和选自Al或稀土元素的一种或多种掺杂剂组成。

公开(公告)号：US08350161B2

公开(公告)日：2013-01-08

申请号：US12696962

申请日：2010-01-29

Applicant: Kimihiro Yamanaka ,  Manabu Ichinose ,  Satoshi Nakamura

Inventor： Kimihiro Yamanaka ,  Manabu Ichinose ,  Satoshi Nakamura

IPC: H01R12/04 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12 ,  H05K7/02 ,  H05K7/04

CPC classification number: H05K1/116 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0769 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2201/0969

Abstract: According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.

Abstract translation: 根据本发明之一，电路板包括导电层。 导电层包括第一接地部分，在平面图中与第一接地部分分开的第二接地部分和将第一接地部分和第二接地部分彼此连接的线路部分。 线部分包括电流流过的引线部分和布置在引线部分之间的开口部分。 开口部在厚度方向上贯通导电层。

公开(公告)号：US08337606B2

公开(公告)日：2012-12-25

申请号：US12668127

申请日：2008-07-10

Applicant: Peter Kuhlkamp

Inventor： Peter Kuhlkamp

IPC: C23F11/167 ,  C23F11/04 ,  C23C22/74 ,  B23K1/20 ,  H05K3/28

CPC classification number: C23F11/1676 ,  C23C22/74 ,  C23F11/04 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/0769 ,  Y10T428/31678

Abstract: Described is a new a solution comprising a phosphorous compound and a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract translation: 描述了一种新的包含磷化合物和可焊性增强化合物的溶液及其在增加金属或金属合金表面的可焊性和耐腐蚀性的方法中的用途。