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    Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights
    41.
    发明授权
    Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights 有权
    具有散热器的电子组件，特别是用于机动车辆前灯的放电灯控制模块

    公开(公告)号：US07646612B2

    公开(公告)日：2010-01-12

    申请号：US11178156

    申请日：2005-07-08

    Applicant: Marc Duarte ,  Jean-Marc Nicolai ,  David Myotte ,  Fabrice Govin

    Inventor： Marc Duarte ,  Jean-Marc Nicolai ,  David Myotte ,  Fabrice Govin

    IPC: H05K7/14 ,  H05K7/18

    CPC classification number: H05K7/205 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/0061 ,  H05K7/142 ,  H05K2201/09054 ,  H05K2203/0191 ,  H05K2203/167 ,  H01L2924/00

    Abstract: The present invention concerns an electronic assembly with a heat sink in particular for a discharge lamp control module for a motor vehicle headlight.The electronic assembly with heat sink comprises essentially a printed circuit and a housing able to serve for thermal insulation and/or for electrical insulation and which comprises a heat sink. The heat sink is interposed between at least one face of the printed circuit and a face of the housing, the said heat sink extending over a major part of the face of the printed circuit and comprising an adhesive face for securing it to the printed circuit on the one hand and an adhesive face for securing it to the face of the housing on the other hand.

    Abstract translation: 本发明涉及具有散热器的电子组件，特别是用于机动车辆前灯的放电灯控制模块。 具有散热器的电子组件基本上包括印刷电路和能够用于隔热和/或用于电绝缘并且包括散热器的外壳。 散热器插入在印刷电路的至少一个面和壳体的表面之间，所述散热器延伸在印刷电路的表面的主要部分上，并且包括用于将其固定到印刷电路上的粘合面 另一方面，一方面是用于将其固定到壳体的表面上的粘合面。

    Driver module structure with flexible circuit board
    42.
    发明授权
    Driver module structure with flexible circuit board 失效
    驱动器模块结构采用柔性电路板

    公开(公告)号：US07582959B2

    公开(公告)日：2009-09-01

    申请号：US10598903

    申请日：2005-03-11

    Applicant: Hiroyuki Fukusako

    Inventor： Hiroyuki Fukusako

    IPC: G02F1/1345 ,  H05K7/20

    CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

    Abstract: A driver module structure includes a flexible circuit board (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible circuit board (2), and an electrically conductive heat-radiating member (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8). The flexible circuit board (2) has a cavity (9) that exposes a portion of the ground wiring pattern (8). The exposed portion of the ground wiring pattern (8) and the heat-radiating member (4) are connected to establish electrical continuity via a member (11) that is fitted into the cavity (9).

    Abstract translation: 驱动器模块结构包括设置有布线图案（7）的柔性电路板（2），安装在柔性电路板（2）上的半导体器件）和接合到半导体器件的导电散热构件 。 布线图案（7）包括接地布线图案（8）。 柔性电路板（2）具有露出接地布线图形（8）的一部分的空腔（9）。 接地布线图案（8）和散热构件（4）的暴露部分被连接以经由装配到空腔（9）中的构件（11）建立电连续性。

    Support structure of electronic device and hard disk drive comprising the same
    43.
    发明授权
    Support structure of electronic device and hard disk drive comprising the same 有权
    包括该装置的电子设备和硬盘驱动器的支持结构

    公开(公告)号：US07577001B2

    公开(公告)日：2009-08-18

    申请号：US11648563

    申请日：2007-01-03

    Applicant: Kwang-Hoon Park ,  Jong-Yun Yun ,  Joo-Won Cho

    Inventor： Kwang-Hoon Park ,  Jong-Yun Yun ,  Joo-Won Cho

    IPC: H05K7/02

    CPC classification number: G11B33/1426 ,  G11B25/043 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/09054

    Abstract: A hard disk drive (HDD) includes a disk, a spindle motor assembly for rotating the disk, an arm assembly for reading data from and/or reproducing data onto the disk, integrated circuits (ICs) for controlling the spindle motor and arm assemblies, a printed circuit board (PCB) having integrated circuit (IC) mounting areas on which the ICs are mounted and a through-hole open to at least one of the IC mounting areas and a base to which the spindle motor assembly, arm assembly and PCB are assembled, the base including a heat dissipation column contacting the PCB opposite the IC mounting area so as to transfer heat generated by the IC to the base. The heat dissipation column includes a heat dissipation body and at least one hemispherical protrusion protruding from a surface of the body into the through-hole and into contact with the PCB. The base has a simple structure that is easy to manufacture, and the heat dissipation column of the base does not affect the overall size of the HDD and can effectively dissipate the heat generated by the IC during the operation of the HDD.

    Abstract translation: 硬盘驱动器（HDD）包括盘，用于旋转盘的主轴马达组件，用于从盘读取数据和/或再现数据的臂组件，用于控制主轴马达和臂组件的集成电路（IC） 具有安装IC的集成电路（IC）安装区域的印刷电路板（PCB）和至少一个IC安装区域的通孔以及主轴电机组件，臂组件和PCB的基座 所述基座包括与IC安装区域相对的PCB的散热柱，以将IC产生的热量传递到基座。 散热柱包括散热体和从主体的表面突出到通孔并与PCB接触的至少一个半球形突起。 基座具有易于制造的简单结构，并且基座的散热柱不影响HDD的总体尺寸，并且可以在HDD的操作期间有效地散发由IC产生的热量。

    DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD
    44.
    发明申请
    DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD 有权
    器件安装结构和器件安装方法

    公开(公告)号：US20090122495A1

    公开(公告)日：2009-05-14

    申请号：US12263853

    申请日：2008-11-03

    Applicant: Masahiro TAMURA

    Inventor： Masahiro TAMURA

    IPC: H05K7/20

    CPC classification number: H05K1/0204 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10409 ,  H01L2924/00

    Abstract: The present invention provides a device mounting structure and a device mounting method in which the short circuit can be prevented between a device lead part and a device ground part when the reflow process is executed. Thus, in the device mounting structure of the present invention, the device is contained in an aperture part provided in a wired board on a heat-radiating plate, a device main part of the device being fixed on the device ground part, a device lead part extending from opposing sides of the device main part is connected to a wiring part on the wired board, and an internal wall of the aperture part positioned just under the device lead part and the device ground part positioned on the heat-radiating plate are separated by a predetermined distance.

    Abstract translation: 本发明提供了一种装置安装结构和装置安装方法，其中当执行回流处理时，可以防止在器件引线部分和器件接地部分之间的短路。 因此，在本发明的装置安装结构中，该装置被容纳在设置在散热板上的布线板的开口部中，该装置的装置主要部分固定在装置接地部上，装置引线 与设备主体的相对侧延伸的部分连接到布线板上的布线部分，位于设备引线部分正下方的开口部分的内壁和位于散热板上的设备接地部分分离 预定距离。

    LIGHT SOURCE DEVICE ASSEMBLY
    45.
    发明申请
    LIGHT SOURCE DEVICE ASSEMBLY 审中-公开
    光源设备组件

    公开(公告)号：US20080205057A1

    公开(公告)日：2008-08-28

    申请号：US11678482

    申请日：2007-02-23

    Applicant: Wen-Ho Chen ,  Ming-Kang Chen ,  Mao-Ching Yang

    Inventor： Wen-Ho Chen ,  Ming-Kang Chen ,  Mao-Ching Yang

    IPC: F21V21/00

    CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/10106

    Abstract: A novel light source device assembly comprises a substrate, a plurality of light source devices and a heat dissipation plate. In the substrate, a plurality of through holes is provided at a plurality of predetermined positions, to support the plurality of light source devices. In the heat dissipation plate, at positions corresponding to that of the plurality of through holes, a plurality of upwardly protruded tongue pieces is provided, whereby each tongue piece is in contact with its respectively corresponding light source device in the plurality of through holes. Metal solders may be applied in between the plurality of tongue pieces and their corresponding plurality of light source devices to enhance the heat dissipation efficiencies. Necessary circuitry may be provided in the substrate and the circuitry may be in connection with the light source device electrically.

    Abstract translation: 一种新颖的光源装置组件包括基板，多个光源装置和散热板。 在基板中，多个通孔设置在多个预定位置，以支撑多个光源装置。 在散热板中，在与多个贯通孔的位置对应的位置设置有多个向上突出的舌片，由此每个舌片与多个通孔中的相应的光源装置相接触。 可以将金属焊料施加在多个舌片与其相应的多个光源装置之间，以增强散热效率。 可以在衬底中提供必要的电路，并且电路可以与光源器件电连接。

    Backlighting apparatus and manufacturing process
    47.
    发明申请
    Backlighting apparatus and manufacturing process 有权
    背光装置及制造工艺

    公开(公告)号：US20080144315A1

    公开(公告)日：2008-06-19

    申请号：US11640587

    申请日：2006-12-18

    Applicant: Shou Lung Chen ,  Kwan Wah Ng ,  Ying Liu

    Inventor： Shou Lung Chen ,  Kwan Wah Ng ,  Ying Liu

    IPC: F21V29/00 ,  F21V19/00 ,  H01J9/00

    CPC classification number: H05K1/0204 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133611 ,  H05K1/056 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/1572 ,  Y10S362/80

    Abstract: Apparatuses for backlighting and manufacturing processes thereof are disclosed. There is provided a backlight module. The backlight module comprises a double-sided circuit board with thermal conducting material as one of the core layers; a plurality of light source components mounted on the first surface of the circuit board; and, a plurality of electronic components mounted on the second surface of the circuit board. The thermal conducting core layer discharges heat generated by the light source components. The circuit board has at least one window on the surface layer at the second surface to expose the thermal conducting core layer for thermal dissipation. As such, the component heights on the illuminating side of the circuit board are unified, and the reflector can be made as a smooth planar sheet to provide a more uniform backlight illumination compared to a single-side circuit board design. Further, such an arrangement reduces the complexity in manufacturing the reflector and hence the cost thereof.

    Abstract translation: 公开了用于背光及其制造方法的装置。 提供背光模组。 背光模块包括具有导热材料作为芯层之一的双面电路板; 安装在电路板的第一表面上的多个光源组件; 以及安装在电路板的第二表面上的多个电子部件。 导热芯层对由光源部件产生的热量进行放电。 电路板在第二表面的表层上具有至少一个窗口，以露出导热芯层以进行散热。 因此，电路板的照明侧的部件高度是一体的，并且与单面电路板设计相比，反射器可以制成平滑的平面片材以提供更均匀的背光照明。 此外，这种布置降低了制造反射器的复杂性并因此降低了其成本。

    Cooled power switching device
    49.
    发明授权
    Cooled power switching device 失效
    冷却电源开关装置

    公开(公告)号：US07173824B2

    公开(公告)日：2007-02-06

    申请号：US10513377

    申请日：2003-04-23

    Applicant: Patrice Laurent ,  Marc Meynet ,  Cécile Deviller ,  Marc Hervieu

    Inventor： Patrice Laurent ,  Marc Meynet ,  Cécile Deviller ,  Marc Hervieu

    IPC: H05K7/20

    CPC classification number: B60R16/0239 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/202 ,  H05K7/20854 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/063 ,  Y10S439/949

    Abstract: This power switching device comprises semiconductor members (60) having drain, gate and source connections. Said members (60) are soldered by their drain soles to protuberances of an electrically conductive cooling plate (20), while the gates and the sources (62, 63) of the semiconductor members (60) are connected to a control circuit and to power connectors via a routing circuit (40) placed generally parallel to and in the vicinity of said plate (20) but separated therefrom by a spacer (30) and having openings (42) corresponding to the flat protuberances of the subjacent plate (20), which protuberances lie in a plane close to the routing circuit (40), by means of which the semiconductor devices (60) may be connected to the plate (20) and to the routing circuit (40) substantially in the same plane.

    Abstract translation: 该电源开关装置包括具有漏极，栅极和源极连接的半导体部件（60）。 所述构件（60）通过它们的漏极脚焊接到导电冷却板（20）的突起，同时半导体构件（60）的栅极和源极（62,63）连接到控制电路并且 连接器经由布置在所述板（20）上大致平行于所述板（20）并且在所述板（20）附近放置但通过间隔件（30）分离并具有对应于所述下层板（20）的平坦突起的开口（42）的布线电路（40） 这些突起位于靠近路由电路（40）的平面中，半导体器件（60）可以基本上在同一平面上连接到板（20）和布线电路（40）。

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