公开(公告)号：US07787615B2

公开(公告)日：2010-08-31

申请号：US11402300

申请日：2006-04-11

Applicant: Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

Inventor： Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R4/2429 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a crosstalk compensation arrangement for reducing crosstalk at the jack. The circuit board also includes arrangements that reduce return loss at the jack.

Abstract translation: 本公开涉及一种电信插孔，其包括具有用于接收插头的端口的壳体。 千斤顶还包括多个接触弹簧，其适于当插头插入壳体的端口时与插头电接触，以及多个用于将插线端接到插座的导线终端触头。 千斤顶还包括将接触弹簧电连接到导线终端触点的电路板。 电路板包括用于减小插座处的串扰的串扰补偿装置。 电路板还包括降低插座回波损耗的布置。

公开(公告)号：US07722406B2

公开(公告)日：2010-05-25

申请号：US12049807

申请日：2008-03-17

Applicant: Yung-Hsin Huang

Inventor： Yung-Hsin Huang

IPC: H01R25/00

CPC classification number: H05K1/117 ,  H01R31/06 ,  H01R2201/06 ,  H05K2201/049 ,  H05K2201/09245

Abstract: An output adapting device of a plug-in power system is used to connect an output terminal of the plug-in power system with an input terminal of an electronic device, so as to transmit the power from the plug-in power system to the electronic device. The adapting device includes an output adapting terminal and an input adapting terminal respectively corresponding to the output terminal and the input terminal, in which corresponding pins of the corresponding terminals have identical potential, and at least one corresponding pair of pins of the output adapting terminal and the input adapting terminal have different potential. Furthermore, the adapting device also includes an adapting unit for adapting and outputting the power from the output adapting terminal to another pin with identical potential of the input adapting terminal. Therefore, the output terminal of the plug-in power system can be standardized for widely applying in various electronic devices.

Abstract translation: 插电系统的输出适配装置用于将插入式电力系统的输出端与电子设备的输入端连接起来，以将电力从插电系统传输到电子装置 设备。 适配装置包括分别对应于输出端子和输入端子的输出适配端子和输入适配端子，其中相应端子的相应引脚具有相同的电位，以及输出适配端子和至少一个对应的一对引脚 输入适配终端具有不同的潜力。 此外，适配装置还包括适配单元，用于将输出适配端子的功率适配并输出到具有输入适配终端相同电位的另一个引脚。 因此，插电式电源系统的输出端子可以被标准化，广泛应用于各种电子设备。

公开(公告)号：US07706524B2

公开(公告)日：2010-04-27

申请号：US09993138

申请日：2001-11-16

Applicant: Jared L. Zerbe

Inventor： Jared L. Zerbe

IPC: H04M1/00

CPC classification number: H04B3/32 ,  H01R13/6467 ,  H05K1/0228 ,  H05K2201/09245 ,  H05K2201/10689

Abstract: Described herein is a technique for reducing the effects of crosstalk between adjacent signal lines of a data path. The data path is formed by multiple signal lines arranged adjacent each other and traversing multiple segments. The signal lines are transposed between segments in a manner that is chosen to reduce differences in interline couplings between different pairs of the signal lines. The interline coupling of a pair of signal lines is represented as a function of coupling terms. A coupling term corresponds to each segment of a pair of signal lines, and is a function of the distance between the signal lines over that segment. Prior to transmitting a digital signal over the data path, the digital signal is encoded to reduce variations over time in a collective signal level of the digital signal.

Abstract translation: 这里描述了一种用于减少数据路径的相邻信号线之间串扰的影响的技术。 数据路径由彼此相邻布置并遍历多个段的多个信号线形成。 信号线以选择以减少不同对的信号线之间的线间耦合的差异的方式在段之间转置。 一对信号线的线间耦合表示为耦合项的函数。 耦合项对应于一对信号线的每个段，并且是该段上的信号线之间的距离的函数。 在通过数据路径发送数字信号之前，数字信号被编码以减少数字信号的集体信号电平中随时间的变化。

公开(公告)号：US20100033443A1

公开(公告)日：2010-02-11

申请号：US12534921

申请日：2009-08-04

Applicant: Shinya HASHIMOTO

Inventor： Shinya HASHIMOTO

IPC: G06F3/041

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device having a highly reliable electrostatic capacitive type touch panel which allows finger touch inputting and possesses excellent detection sensitivity is provided. With respect to X electrodes and Y electrodes which are formed on an electrostatic capacitive type touch panel, either one of the X electrodes and the Y electrodes is divided corresponding to a ratio between the number of X electrodes and the number of Y electrodes, and a floating electrode is formed in gaps formed along with the reduction of area of the electrode thus adjusting the area of the electrode. Due to the contraction of the area of the individual electrode, a noise level can be lowered more compared to lowering of a signal level and hence, an S/N ratio can be increased thus enhancing the detection sensitivity. Further, a line is branched on a flexible printed circuit board, intersecting lines are formed on a back surface of the flexible printed circuit board, and the intersecting lines are arranged to orthogonally intersect with lines formed on a front surface of the flexible printed circuit board thus lowering line capacitance.

Abstract translation: 提供一种具有高度可靠的静电电容型触摸面板的显示装置，其允许手指触摸输入并且具有优异的检测灵敏度。 对于形成在静电电容型触摸面板上的X电极和Y电极，X电极和Y电极中的任一个根据X电极的数量与Y电极的数量相对应而分割， 浮动电极形成在与电极的面积减小形成的间隙中，从而调节电极的面积。 由于单个电极的面积的缩小，与信号电平的降低相比，可以降低噪声水平，因此可以增加S / N比，从而提高检测灵敏度。 此外，线在柔性印刷电路板上分支，在柔性印刷电路板的后表面上形成相交线，并且交叉线布置成与柔性印刷电路板的前表面上形成的线垂直相交 从而降低线路电容。

公开(公告)号：US07642702B2

公开(公告)日：2010-01-05

申请号：US11767877

申请日：2007-06-25

Applicant: Masafumi Moriya ,  Kazuya Ishiwata ,  Hiroaki Toshima

Inventor： Masafumi Moriya ,  Kazuya Ishiwata ,  Hiroaki Toshima

IPC: H01J1/02

CPC classification number: H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/0209 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315

Abstract: To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.

Abstract translation: 提供一种电子源，包括：布线板，其具有：在其表面上设置有沟槽的基板; 第一导电构件，沿着沟槽中的凹槽布置; 以及第二导电构件，其布置在与所述第一导电构件交叉的所述第一导电构件的上方; 以及电子发射器件，其布置在所述布线板上并电连接到所述第一导电部件和所述第二导电部件; 其中，所述第一导电构件和所述凹槽的内壁之间布置有颗粒。

公开(公告)号：US20090107717A1

公开(公告)日：2009-04-30

申请号：US12181330

申请日：2008-07-29

Applicant: Chien-Min Hsu ,  Shih-Hsien Wu ,  Shinn-Juh LAI ,  Min-Lin LEE

Inventor： Chien-Min Hsu ,  Shih-Hsien Wu ,  Shinn-Juh LAI ,  Min-Lin LEE

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/162 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09245 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/10734 ,  H01L2224/05599

Abstract: An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.

Abstract translation: 导电结构包括第一导电结构和第二导电结构。 每个在一端具有导电部分，另一端具有耦合部分。 第一和第二导电部分分别电连接到电子设备的电源和接地触点。 第一和第二耦合部分分别与电路板的电源层和接地层连接。 第一耦合部分通过第一延伸部分与第一导电部分连接，第二耦合部分通过第二延伸部分与第二导电部分连接。 导电结构的至少两个耦合部分成对布置。 第一导电结构和第二导电结构以交错阵列布置以形成具有相反电流方向的两个布线环，从而产生磁通消除效果。

公开(公告)号：US07509615B2

公开(公告)日：2009-03-24

申请号：US11281477

申请日：2005-11-18

Applicant: Chih-Chien Hung ,  Ming-Che Wu

Inventor： Chih-Chien Hung ,  Ming-Che Wu

IPC: G06F17/50 ,  H01L23/48 ,  H01L23/52

CPC classification number: H05K1/0228 ,  H01L23/49838 ,  H01L23/5225 ,  H01L23/528 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H01L2924/00

Abstract: A symmetrical circuit layout structure includes a number of signal wires, a ground wire and a dielectric layer. The signal wires include a first portion placed on a first plane and a second portion placed on a second plane. The ground wire includes a first portion placed above the first portion of the signal wires and adjacent to the second portion of the signal wires, and a second portion placed below the second portion of the signal wires and adjacent to the first portion of the signal wires. The dielectric layer is placed between the first plane and the second plane.

Abstract translation: 对称电路布局结构包括多个信号线，接地线和电介质层。 信号线包括放置在第一平面上的第一部分和放置在第二平面上的第二部分。 接地线包括放置在信号线的第一部分上方并与信号线的第二部分相邻的第一部分，第二部分放置在信号线的第二部分的下方并与信号线的第一部分相邻 。 电介质层位于第一平面和第二平面之间。

公开(公告)号：US20080205019A1

公开(公告)日：2008-08-28

申请号：US11917527

申请日：2006-06-21

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

IPC: H05K1/14

CPC classification number: H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Abstract translation: 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。

公开(公告)号：US20070252607A1

公开(公告)日：2007-11-01

申请号：US11789162

申请日：2007-04-23

Applicant: Hidekatsu Muroi

Inventor： Hidekatsu Muroi

IPC: G01R31/02

CPC classification number: G01R31/2849 ,  H01L23/66 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/341 ,  H05K2201/0909 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2224/05599

Abstract: A method of manufacturing a circuit module having a low price and good productivity, a collective board for the circuit module, and a circuit module manufactured by the method are provided. In the method of manufacturing the circuit module of the invention, when performing a burn-in test, a collective board 1 having a circuit board 2 can be used as a test board. Accordingly, since it is not necessary to have an additional test board, it is possible to obtain a low price product. In addition, since a test is performed in a state where the bare chip 8 is attached (e.g., soldering) to the circuit board 2, the number of the process of the bare chip 8. Accordingly, it is possible to obtain good productivity.

Abstract translation: 提供了一种制造价格低廉且生产效率高的电路模块的方法，用于电路模块的集体板以及通过该方法制造的电路模块。 在本发明的电路模块的制造方法中，进行老化试验时，可以使用具有电路基板2的集体基板1作为试验板。 因此，由于不需要附加测试板，因此可以获得低价格的产品。 此外，由于在将裸芯片8安装（例如焊接）到电路板2的状态下执行测试，裸芯片8的处理次数。 因此，可以获得良好的生产率。

公开(公告)号：US20070238365A1

公开(公告)日：2007-10-11

申请号：US11402250

申请日：2006-04-11

Applicant: Bernard Hammond ,  David Murray ,  Ian George

Inventor： Bernard Hammond ,  David Murray ,  Ian George

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R13/6658 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes first and second conductive layers separated by a relatively thin dielectric layer. The first and second conductive layers include a crosstalk compensation arrangement having spaced-apart capacitor members. The relatively thin dielectric layer allows a high level of capacitance to be generated between the capacitor members.

Abstract translation: 本公开涉及一种电信插孔，其包括具有用于接收插头的端口的壳体。 千斤顶还包括多个接触弹簧，其适于当插头插入壳体的端口时与插头电接触，以及多个用于将插线端接到插座的导线终端触头。 千斤顶还包括将接触弹簧电连接到导线终端触点的电路板。 电路板包括由相对薄的电介质层分开的第一和第二导电层。 第一和第二导电层包括具有间隔开的电容器构件的串扰补偿装置。 相对薄的电介质层允许在电容器构件之间产生高电平的电容。