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    Assembly including vertical and horizontal joined circuit panels
    42.
    发明授权
    Assembly including vertical and horizontal joined circuit panels 有权
    组装包括垂直和水平连接电路板

    公开(公告)号：US07489524B2

    公开(公告)日：2009-02-10

    申请号：US11143201

    申请日：2005-06-02

    Applicant: Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    Inventor： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    IPC: H05K1/11

    CPC classification number: H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

    Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    Abstract translation: 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

    Control Apparatus, in Particular a Mechatronic Transmission Control Device or Engine Control Device
    43.
    发明申请
    Control Apparatus, in Particular a Mechatronic Transmission Control Device or Engine Control Device 有权
    控制装置，特别是机电传动控制装置或发动机控制装置

    公开(公告)号：US20090002959A1

    公开(公告)日：2009-01-01

    申请号：US11658775

    申请日：2005-04-29

    Applicant: Josef A Loibl ,  Karl Smirra

    Inventor： Josef A Loibl ,  Karl Smirra

    IPC: H05K5/00 ,  H05K1/00

    CPC classification number: H05K1/147 ,  F16H61/0006 ,  H01L2224/05554 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01R12/59 ,  H01R13/5202 ,  H05K1/142 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/09745 ,  H05K2201/0999 ,  H05K2203/049 ,  H05K2203/1147

    Abstract: A control device permits a number of individual partially flexible printed circuit boards to be arranged in a manner that makes it possible to optimally disentangle signal and current paths while simultaneously reducing the investment in expensive flexible surfaces to a minimum. The improvement helps in saving on flexible surfaces and to design flexible component parts in order to make an optimal utilization possible and so no waste results. The individual partially flexible printed circuit boards are preferably laminated on an aluminum base plate. The edge areas of the partially flexible printed circuit board are formed by appropriate measures whereby obtaining a reliable sealing by means of a molded seal. The device is suited for mechatronic control units, particularly for control devices for mounting in a transmission or engine of a motor vehicle.

    Abstract translation: 控制装置允许多个单独的部分柔性印刷电路板布置成使得可以最佳地分离信号和电流路径，同时将昂贵的柔性表面的投资降至最低。 该改进有助于节省柔性表面并设计灵活的组件，以便最佳利用成为可能，因此不会产生浪费。 各个部分柔性的印刷电路板优选层叠在铝基板上。 部分柔性印刷电路板的边缘区域通过适当的措施形成，由此通过模制密封获得可靠的密封。 该装置适用于机电一体化控制装置，特别适用于安装在机动车辆的变速器或发动机中的控制装置。

    Secure Card Reader
    46.
    发明申请
    Secure Card Reader 有权
    安全读卡器

    公开(公告)号：US20080164320A1

    公开(公告)日：2008-07-10

    申请号：US10591267

    申请日：2005-02-18

    Applicant: Enrique Garrido-Gadea ,  Andrew Graham Hodges ,  Richard Andrew Hodson ,  Richard Ward ,  Gareth Alexander Richards

    Inventor： Enrique Garrido-Gadea ,  Andrew Graham Hodges ,  Richard Andrew Hodson ,  Richard Ward ,  Gareth Alexander Richards

    IPC: G06K7/00

    CPC classification number: G08B13/128 ,  G06K7/0013 ,  G06K7/0091 ,  H05K1/0275 ,  H05K2201/0999 ,  H05K2201/10151

    Abstract: A secure card reader (1) includes several security measures. Access to the reader's main circuitry is prevented by an enclosure (9) whose walls contain embedded i conductive paths (18a, 18b, 18c). Breaking or grounding of one of these paths can be detected electronically. A similar arrangement of conductive paths prevent enlarging of a card receiving slot (9c) If tampering is detected using the embedded conductive paths (18a, 18b, 18c), the reader's memory (69) is wiped. The enclosure (9) has apertures (20) in its walls and is held in place by a potting material that extends into the apertures. Means (31, 35) is also provided to detect attempts to probe behind a keypad membrane (7). The contacts (42) for the chip of a chip card are arranged so that their leads all extend away from the card insertion slot.

    Abstract translation: 安全读卡器（1）包括几种安全措施。 通过其墙壁包含嵌入式i导电路径（18a，18b，18c）的外壳（9）防止对读取器的主电路的访问。 可以电子检测这些路径之一的断路或接地。 导电路径的类似布置防止卡接收槽的扩大（9c）如果使用嵌入式导电路径（18a，18b，18c）检测到篡改，则读取器的存储器（69）被擦除。 外壳（9）在其壁中具有孔（20），并通过延伸到孔中的灌封材料保持就位。 还提供了装置（31,35）以检测在键盘隔膜（7）后面探测的尝试。 用于芯片卡的芯片的触点（42）布置成使得它们的引线全部从卡插入槽延伸。

    Optical transmission module
    47.
    发明授权
    Optical transmission module 有权
    光传输模块

    公开(公告)号：US07367717B2

    公开(公告)日：2008-05-06

    申请号：US11131342

    申请日：2005-05-18

    Applicant: Juhyun Yu ,  Kinya Yamazaki ,  Hidetaka Kawauchi ,  Tenpei Inoue ,  Hiroki Katayama

    Inventor： Juhyun Yu ,  Kinya Yamazaki ,  Hidetaka Kawauchi ,  Tenpei Inoue ,  Hiroki Katayama

    IPC: G02B6/36

    CPC classification number: H05K1/147 ,  G02B6/4204 ,  G02B6/4292 ,  H04B10/501 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10598

    Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.

    Abstract translation: 光传输模块具有：具有光学元件和插座部分的光学模块; 电路板，其通过电连接构件电连接到所述光学模块; 以及其中放置光学模块和电路板的壳体。 光学模块与壳体表面接触并固定在壳体上。 插座部分和电路板不与壳体接触。 容纳部分至少在与从光学元件发射的光的光轴垂直的方向上具有位置自由度的同时受到限制。 电路板被限制在至少沿光轴的方向具有位置自由度的位置。

    ELECTRONIC DEVICE AND METHOD OF FABRICATION OF A SAME
    48.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF FABRICATION OF A SAME 有权
    电子设备及其制造方法

    公开(公告)号：US20080008890A1

    公开(公告)日：2008-01-10

    申请号：US11773279

    申请日：2007-07-03

    Applicant: Te Wei Li

    Inventor： Te Wei Li

    IPC: B32B27/40 ,  C23F4/00

    CPC classification number: H05K1/144 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H04M1/0277 ,  H05K1/16 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/0999 ,  H05K2201/10303 ,  H05K2203/161 ,  Y10T428/31504 ,  Y10T428/31551

    Abstract: An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.

    Abstract translation: 提供了一种电子设备和制造方法。 该电子设备包括：衬底，用作形成在衬底的外表面上的天线层的图案化导电层，与用于发送或接收无线信号的印刷电路板（PCB）电连接，其中衬底放置在 图案导电层和PCB。 图案化导电层可以通过连接片通过基板中的孔与PCB电连接。 基板可以是电子设备的壳体。

    Electronic device having improved electrical connection
    49.
    发明申请
    Electronic device having improved electrical connection 有权
    具有改善的电连接的电子设备

    公开(公告)号：US20070177359A1

    公开(公告)日：2007-08-02

    申请号：US11343296

    申请日：2006-01-31

    Applicant: William Roberts

    Inventor： William Roberts

    IPC: H05K1/14

    CPC classification number: H05K3/365 ,  G01D9/005 ,  G01D11/245 ,  H05K2201/058 ,  H05K2201/0999

    Abstract: The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.

    Abstract translation: 本发明涉及一种用于通过将电子部件设置在将电气部件保持在一起并在其间形成电连接的两个相对的多个突起之间来将多个电子部件电互连在一起的方法和装置。 每个多个突起可以与相对的突起以偏移的方式设置。 当相对的突起位于相对的突起组之间时，电子部件弯曲并采取偏转的几何形状。 这种弯曲导致电子部件彼此偏压，使得每个电子部件上的电触点可以保持在一起，从而形成电连接。 结果，相对的突起组可用于在没有夹紧，粘附，焊接或夹紧的情况下将多个电气部件电连接。

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