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公开(公告)号：US11800603B2
公开(公告)日：2023-10-24
申请号：US17580183
申请日：2022-01-20
Applicant: KT&G CORPORATION
Inventor： Hun Il Lim , Tae Hun Kim , Jung Ho Han , Sang Kyu Park
IPC: A24F13/00 , A24F40/42 , A24F40/90 , A24F40/46 , A24B15/167 , A24F40/20 , A24F40/30 , A24D3/17 , A24D1/20 , A24F40/60 , F21V3/00 , F21V5/00 , G02B19/00 , H05B3/54 , A24F40/485 , A24F40/10 , A24F40/44 , A24F40/40 , A24F40/57 , A24F40/65 , H05K1/02 , H05K1/14 , H05K1/18 , A24F40/50 , A24F40/95 , A24F15/01 , A24F40/51 , F21Y115/10
CPC classification number: A24F40/42 , A24B15/167 , A24D1/20 , A24D3/17 , A24F15/01 , A24F40/10 , A24F40/20 , A24F40/30 , A24F40/40 , A24F40/44 , A24F40/46 , A24F40/485 , A24F40/50 , A24F40/57 , A24F40/60 , A24F40/65 , A24F40/90 , A24F40/95 , F21V3/00 , F21V5/00 , G02B19/0009 , G02B19/0061 , H05B3/54 , H05K1/0203 , H05K1/0277 , H05K1/148 , H05K1/181 , A24F40/51 , F21Y2115/10 , H05K2201/012 , H05K2201/0154 , H05K2201/10219
Abstract: Provided is an aerosol generating apparatus including: a heater configured to generate aerosol by heating a cigarette, the heater including a first electrically conductive heating element formed along a first path on an electrically insulating substrate, a second electrically conductive heating element formed along a second path on the electrically insulating substrate, and a temperature sensor track formed along a third path in a region between the first path and the second path; a battery configured to supply power to the heater; and a controller configured to control the power supplied from the battery to the heater and monitor a temperature sensed using the temperature sensor track.
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公开(公告)号：US11700884B2
公开(公告)日：2023-07-18
申请号：US16639020
申请日：2018-10-26
Applicant: KT&G CORPORATION
Inventor： Hwi Kyeong An
IPC: A24F13/00 , A24F40/42 , A24F40/90 , A24F40/46 , A24B15/167 , A24F40/20 , A24F40/30 , A24D3/17 , A24D1/20 , A24F40/60 , F21V3/00 , F21V5/00 , G02B19/00 , H05B3/54 , A24F40/485 , A24F40/10 , A24F40/44 , A24F40/40 , A24F40/57 , A24F40/65 , H05K1/02 , H05K1/14 , H05K1/18 , A24F40/50 , A24F40/95 , A24F15/01 , A24F40/51 , F21Y115/10
CPC classification number: A24F40/42 , A24B15/167 , A24D1/20 , A24D3/17 , A24F15/01 , A24F40/10 , A24F40/20 , A24F40/30 , A24F40/40 , A24F40/44 , A24F40/46 , A24F40/485 , A24F40/50 , A24F40/57 , A24F40/60 , A24F40/65 , A24F40/90 , A24F40/95 , F21V3/00 , F21V5/00 , G02B19/0009 , G02B19/0061 , H05B3/54 , H05K1/0203 , H05K1/0277 , H05K1/148 , H05K1/181 , A24F40/51 , F21Y2115/10 , H05K2201/012 , H05K2201/0154 , H05K2201/10219
Abstract: Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.
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公开(公告)号：US11666092B2
公开(公告)日：2023-06-06
申请号：US16639020
申请日：2018-10-26
Applicant: KT&G CORPORATION
Inventor： Hwi Kyeong An
IPC: A24F13/00 , A24F40/42 , A24F40/90 , A24F40/46 , A24B15/167 , A24F40/20 , A24F40/30 , A24D3/17 , A24D1/20 , A24F40/60 , F21V3/00 , F21V5/00 , G02B19/00 , H05B3/54 , A24F40/485 , A24F40/10 , A24F40/44 , A24F40/40 , A24F40/57 , A24F40/65 , H05K1/02 , H05K1/14 , H05K1/18 , A24F40/50 , A24F40/95 , A24F15/01 , A24F40/51 , F21Y115/10
CPC classification number: A24F40/42 , A24B15/167 , A24D1/20 , A24D3/17 , A24F15/01 , A24F40/10 , A24F40/20 , A24F40/30 , A24F40/40 , A24F40/44 , A24F40/46 , A24F40/485 , A24F40/50 , A24F40/57 , A24F40/60 , A24F40/65 , A24F40/90 , A24F40/95 , F21V3/00 , F21V5/00 , G02B19/0009 , G02B19/0061 , H05B3/54 , H05K1/0203 , H05K1/0277 , H05K1/148 , H05K1/181 , A24F40/51 , F21Y2115/10 , H05K2201/012 , H05K2201/0154 , H05K2201/10219
Abstract: Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.
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公开(公告)号：US20180337319A1
公开(公告)日：2018-11-22
申请号：US15979238
申请日：2018-05-14
Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor： Masaki MIGITA
CPC classification number: H01L35/32 , H01L33/36 , H01L33/644 , H01L33/645 , H01L35/10 , H01S5/005 , H01S5/02216 , H01S5/02248 , H01S5/02276 , H01S5/02296 , H01S5/02415 , H01S5/02438 , H01S5/02476 , H01S5/0683 , H01S5/3401 , H05K1/0203 , H05K1/0204 , H05K1/145 , H05K2201/042 , H05K2201/10106 , H05K2201/10219
Abstract: A light emitting apparatus includes: a module including a Peltier device with a first face and a second face, a supporting member with a principal surface, and a light emitting semiconductor device, the first face being opposite to the second face; and a package housing the module, the principal surface having a first area and a second area adjacent to the first area, the supporting member supporting the first face of the Peltier device on the first area of the principal surface, and the supporting member supporting the light emitting semiconductor device on the second area of the principal surface.
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公开(公告)号：US10064270B2
公开(公告)日：2018-08-28
申请号：US15174677
申请日：2016-06-06
Applicant: North Carolina State University
Inventor： Jesse S. Jur , Murat Yokus , Rachel Foote , Amanda Caton Myers , Raj Pravinbhai Bhakta
CPC classification number: H05K1/0283 , G01N33/367 , H01L23/4985 , H01L23/49883 , H01L33/62 , H05K1/038 , H05K1/189 , H05K3/361 , H05K2201/0129 , H05K2201/09263 , H05K2201/10106 , H05K2201/10219
Abstract: Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.
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Patent Agency Ranking
公开(公告)号：US09907181B2
公开(公告)日：2018-02-27
申请号：US14909180
申请日：2014-07-03
Applicant: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH
Inventor： Guenther Kraft , Krunoslac Orcic , Didier Berthomier , Thomas Schiemann , Valod Noshadi
CPC classification number: H05K1/185 , H01L23/38 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L25/16 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/15153 , H05K1/0203 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K1/183 , H05K2201/10159 , H05K2201/10219 , H05K2201/10734 , Y02P70/611
Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.
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公开(公告)号：US09627291B2
公开(公告)日：2017-04-18
申请号：US14672729
申请日：2015-03-30
Applicant: FUJITSU LIMITED
Inventor： Shinichiro Uekusa
CPC classification number: H01L23/345 , H01L23/467 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/13101 , H01L2224/16225 , H01L2924/014 , H01L2924/15174 , H01L2924/15311 , H05K1/0212 , H05K1/111 , H05K1/181 , H05K3/3436 , H05K2201/10219 , H01L2924/00014
Abstract: A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.
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公开(公告)号：US20150334842A1
公开(公告)日：2015-11-19
申请号：US14713064
申请日：2015-05-15
Applicant: IBIDEN CO., LTD.
Inventor： Toyotaka SHIMABE , Ryuichiro Tominaga
CPC classification number: H05K1/183 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L2224/16227 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/0145 , H05K2201/09854 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10219 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1
Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1
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49.发明授权公开(公告)号：US08893513B2
公开(公告)日：2014-11-25
申请号：US13888847
申请日：2013-05-07
Applicant: Phononic Devices, Inc.
Inventor： M. Sean June , Robert Joseph Therrien , Abhishek Yadav , Jesse W. Edwards
CPC classification number: F25B21/00 , F25B21/02 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/10219 , Y10T29/49002
Abstract: A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
Abstract translation: 热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置的第一表面上的第一散热盖和热电装置的第二表面上的第二散热盖。 在每个热电器件和第一和第二散热盖之间存在热界面材料。 第一散热盖和第二散热盖被定向成使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。
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50.发明申请公开(公告)号：US20130291559A1
公开(公告)日：2013-11-07
申请号：US13888847
申请日：2013-05-07
Applicant: PHONONIC DEVICES, INC.
Inventor： M. Sean June , Robert Joseph Therrien , Abhishek Yadav , Jesse W. Edwards
IPC: F25B21/00
CPC classification number: F25B21/00 , F25B21/02 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/10219 , Y10T29/49002
Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
Abstract translation: 公开了一种具有散热盖的散热盖的优化热传导盖和多个热电元件之间的热界面电阻的热电换热器部件的实施例及其制造方法。 在一个实施例中，热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置上的散热盖和热电装置与散热盖之间的热界面材料。 散热盖的取向（即，倾斜）使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。
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