公开(公告)号：US20040046006A1

公开(公告)日：2004-03-11

申请号：US10609955

申请日：2003-06-30

Inventor： Lars-Anders Olofsson

IPC: B23K031/00 ,  B23K031/02

CPC classification number: H05K3/4046 ,  H05K1/0204 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit board that may include several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

Abstract translation: 公开了一种在包括一层或多层板材的印刷电路板中提供热通孔的方法。 通孔提供从安装在电路板上的组件传导热量。 一个或多个孔（4）设置在可包括若干金属层的印刷电路板中。 将金属球（6）插入每个孔中并施加压力以使所述球变形，并将所得的块塞紧紧地固定在所述孔的壁（5）上。 固定在孔中的可能具有金属化内表面的变形的球或块被用来在印刷电路板的金属化顶部（2）和底侧（3）之间以及中间金属化层之间传导热和/或电 在多层板的情况下。

公开(公告)号：US20030202332A1

公开(公告)日：2003-10-30

申请号：US10393238

申请日：2003-03-20

Inventor： Tommi Reinikainen ,  Pirkka Myllykoski

IPC: H05K007/10 ,  H05K007/12

CPC classification number: H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00

Abstract: Surface mount packages having a plurality of polymer and metallic contacts (e.g., balls) applied thereon and methods of fabricating and utilizing such packages are provided. The polymer balls are employed to improve mechanical compliance of the package; and the metallic (e.g., copper) balls are employed to improve thermal conduction between the package and a substrate to which the package is attached. The polymer balls can be located on a periphery portion of a package where mechanical and thermal stresses are the highest; and the metallic balls can be located on a middle portion of the package. Thus the present invention improves both mechanical stresses and thermal conductivity of a second level packaging interconnection, which in turn improves reliability of an electronic device.

Abstract translation: 提供了具有多个聚合物和施加在其上的金属触点（例如球）的表面贴装封装以及制造和利用这种封装的方法。 聚合物球用于提高包装的机械顺从性; 并且使用金属（例如铜）球来改善封装与封装所附接的衬底之间的热传导。 聚合物球可以位于机械和热应力最高的包装的周边部分上; 并且金属球可以位于包装的中间部分。 因此，本发明改进了第二级封装互连的机械应力和导热性，这又提高了电子设备的可靠性。

公开(公告)号：US20030155656A1

公开(公告)日：2003-08-21

申请号：US10346288

申请日：2003-01-17

Inventor： Cindy Chia-Wen Chiu ,  David Hsein-Pin Chen ,  Philip Yi Zhi Chu ,  Hsiao Ken Chuang ,  H. Paul Barker

IPC: H01L023/48

CPC classification number: H01L23/49827 ,  H01L2224/11334 ,  H01L2224/16237 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2201/10378

Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.

Abstract translation: 用于提供电子部件之间的电互连的各向异性导电结构以及制造这种各向异性导电结构的方法。 各向异性导电结构包括具有基本上均匀厚度的介电矩阵; 穿过矩阵的通孔阵列; 多个导电元件，其中单个通孔包含至少一个导电元件; 粘附到基质的第一主表面上的第一粘合剂层; 以及可选地，粘附到基质的第二主表面的第二粘合剂层。

公开(公告)号：US20030139032A1

公开(公告)日：2003-07-24

申请号：US10124068

申请日：2002-04-15

Inventor： Moriss Kung ,  Kwun-Yao Ho

IPC: H01L021/4763

CPC classification number: H01L21/486 ,  H01L21/76898 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/1189

Abstract: A method of forming metal posts. A fixture having an array of wire guide heads is provided. A conductive wire is threaded through a hole in each wire guide heads. The wire guide heads have a transient electric arcing mechanism for heating the conductive wire so that a teardrop shaped blob of material is formed at the tip of the conductive wire. The wire guide heads on the fixture are pulled towards a substrate, thereby forming a plurality of metal posts over the substrate. The technique of forming metal posts finds applications in the manufacturing of printed circuit board, package substrate (carrier) and silicon wafer.

Abstract translation: 一种形成金属柱的方法。 提供具有导线头阵列的固定装置。 导线穿过每个线导向头中的孔。 导线头具有用于加热导线的瞬时电弧机构，使得在导线的尖端处形成泪滴形状的材料块。 夹具上的导丝头被拉向衬底，从而在衬底上形成多个金属柱。 形成金属柱的技术可用于制造印刷电路板，封装衬底（载体）和硅晶片。

公开(公告)号：US20030060066A1

公开(公告)日：2003-03-27

申请号：US10255373

申请日：2002-09-26

Applicant: NEC Corporation

Inventor： Tomoko Harada

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  H01L2924/00

Abstract: A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core. Thus, the quantity of the solder material included in the ball is supplemented by the solder material filled into the depressions. Preferably, the core has a higher melting point than the solder layer and wettability to the solder layer. The core may have a cavity in its inside, thereby forming a shell-shaped core. The core may be made of a porous metal body having pores, in which part of the pores reaches the outer surface of the core, thereby forming the depressions.

Abstract translation: 焊球容易获得所需量的用于焊接接头的焊料材料，而不增加形成覆盖芯的焊料层的厚度。 焊球包括在其外表面上具有凹陷的导电芯，以及形成为以填充芯的凹陷的方式覆盖芯的外表面的焊料层。 因此，包含在球中的焊料材料的量由填充到凹部中的焊料材料补充。 优选地，芯具有比焊料层更高的熔点和对焊料层的润湿性。 芯可以在其内部具有空腔，从而形成壳形芯。 芯可以由具有孔的多孔金属体制成，其中一部分孔到达芯的外表面，从而形成凹陷。

公开(公告)号：US20020182903A1

公开(公告)日：2002-12-05

申请号：US10195865

申请日：2002-07-15

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H01R012/00

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，所述材料将接合销接合到相对方垫81.接合销由大于通孔的开口直径的接合头部11构成，并形成接合 以及具有能够将该腿部插入通孔的尺寸的腿部12。 脚部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。大体上具有球形而不是接合销的接合球也可以连接到通孔 由导电材料制成。

公开(公告)号：US20020047216A1

公开(公告)日：2002-04-25

申请号：US10011686

申请日：2001-11-13

Inventor： Tongbi Jiang ,  Salman Akram

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

Abstract: A ball grid array for a flip-chip assembly. The ball grid array includes a plurality of bumps bonded between an active surface of a semiconductor die and a top surface of a printed circuit board or any type of substrate carrier. The plurality of balls include at least one bump having a core material and an outer layer. The rigidity of the core material is greater than that of the material of the outer layer. Additionally, the melting temperature of the core material is higher than the material of the outer layer. By this arrangement, the core material with an outer layer provides bumps that are substantially uniform in height. In addition, the balls only procure marks or deformation to the core material during burn-in testing and reflow.

Abstract translation: 用于倒装芯片组合的球栅阵列。 球栅阵列包括结合在半导体管芯的有源表面和印刷电路板的顶表面之间的多个凸起或任何类型的衬底载体。 多个球包括至少一个具有芯材料和外层的凸块。 芯材的刚性大于外层材料的刚度。 此外，芯材料的熔化温度高于外层的材料。 通过这种布置，具有外层的芯材料提供高度基本均匀的凸块。 此外，在老化测试和回流过程中，球只会对芯材料产生痕迹或变形。

公开(公告)号：US20010011675A1

公开(公告)日：2001-08-09

申请号：US09761594

申请日：2001-01-16

Inventor： Hans-Jurgen Hacke ,  Klaus-Peter Galuschki

IPC: B23K035/12 ,  B23K031/02

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

Abstract translation: 描述了具有芯片的半导体器件，其芯片具有至少一个第一绝缘层和不含绝缘层的电连接焊盘。 在第一绝缘层上，互连从电连接焊盘延伸到外部连接元件的基极区域。 进一步施加的绝缘层设置有从外部连接到外部连接元件的基部区域的开口。 在开口中有导电粘合剂，至少在外部放置金属的小球。 半导体元件还可以在开口中包含焊膏代替导电粘合剂，并且将金属化的小塑料球放置在焊膏上。 本发明还涉及所述半导体器件的制造方法。

公开(公告)号：US20010002330A1

公开(公告)日：2001-05-31

申请号：US09768112

申请日：2001-01-23

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L021/44 ,  H01L021/46 ,  H01L021/50 ,  H01L023/48

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

公开(公告)号：US06198052B1

公开(公告)日：2001-03-06

申请号：US09227267

申请日：1999-01-08

Applicant: Toshihiko Omote ,  Yasuhito Ohwaki ,  Kenichiro Ito

Inventor： Toshihiko Omote ,  Yasuhito Ohwaki ,  Kenichiro Ito

IPC: H01R1204

CPC classification number: H05K3/243 ,  H05K3/28 ,  H05K3/328 ,  H05K2201/10234

Abstract: In a circuit board with a conductor circuit formed on an insulating layer, a covering is formed on the conductor circuit and a terminal is connected to the conductor circuit penetrating through the covering to obtain high reliability for the connection between the terminal of the electronic component mounted on the circuit board and that of the circuit board. There is provided a level difference of 3 &mgr;m or less between the surface of the covering and that of the terminal.

Abstract translation: 在具有形成在绝缘层上的导体电路的电路板中，在导体电路上形成覆盖物，并且将端子连接到穿过覆盖层的导体电路，以获得高可靠性，用于安装在电子元件的端子之间的连接 在电路板和电路板的电路板上。 在覆盖物的表面和端子的表面之间提供3μm以下的水平差。