公开(公告)号：US5432680A

公开(公告)日：1995-07-11

申请号：US97290

申请日：1993-07-26

Applicant: Toru Tsuchida ,  Hiroyoshi Shigeyama

Inventor： Toru Tsuchida ,  Hiroyoshi Shigeyama

IPC: B65D73/02 ,  B65D85/00 ,  B65D85/86 ,  H01R43/00 ,  H01R43/20 ,  H05K3/34 ,  H05K13/02 ,  H01R9/00 ,  H01R9/09

CPC classification number: H05K3/3405 ,  H01R12/57 ,  H01R43/205 ,  H05K2201/10386 ,  H05K2201/10924

Abstract: A pair of holding members, which are displaced from each other along the horizontal plane of a plate face, are formed on each forward end of a plurality of plate type lead terminals fixed to a long base tape. An electronic component body is resiliently held by the paired holding members which are bent in opposite directions in relation to the plate thickness direction. The lead terminals are divided into first and second groups; bending modes for the pairs of holding members provided on the lead terminals belonging to the first group are opposite to those for the pairs of holding members provided on the lead terminals belonging to the second group in relation to the plate thickness direction. Thus, it is possible to suppress distortion of the electronic component with respect to the base tape.

Abstract translation: 沿着固定在长基带上的多个板式引线端子的每个前端形成有沿着板面的水平面彼此偏移的一对保持构件。 电子部件主体由相对于板厚方向相反方向弯曲的一对保持部件弹性地保持。 引线端子分为第一组和第二组; 设置在属于第一组的引线端子上的成对的保持构件的弯曲模式与设置在属于第二组的引线端子上的成对的保持构件相对于板厚度方向的弯曲模式相反。 因此，可以抑制电子部件相对于基带的变形。

公开(公告)号：US5420758A

公开(公告)日：1995-05-30

申请号：US222519

申请日：1994-04-04

Applicant: Louis H. Liang

Inventor： Louis H. Liang

IPC: H01L23/498 ,  H05K3/34 ,  H05K5/02

CPC classification number: H05K3/3405 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/10386 ,  H05K2201/10924

Abstract: An integrated-circuit package assembly including a lead frame having a number of inwardly extending fingers, the alternate ends of which are formed into an upper row and a lower row to provide a space there between for receipt of the outer edges of a multi-layer printed circuit board (PCB). Vias formed adjacent to the outer edges of the PCB engage with corresponding alternate ends of the inwardly extending fingers when the edges of the multi-layer PCB are inserted in the space provided between the row of fingers in the upper plane and the row of fingers in the lower plane. The ends of the inwardly extending fingers have various lengths which engage via contact pads formed on opposite surfaces of the PCB. A group of the fingers can be pivoted to open the space between the upper and lower row of fingers.

Abstract translation: 一种集成电路封装组件，其包括具有多个向内延伸的指状物的引线框架，所述引线框架的交替端形成为上排和下排以在其间提供空间，用于接收多层的外边缘 印刷电路板（PCB）。 当多层PCB的边缘插入设置在上平面中的指状指和在手指列之间的空间中时，与PCB的外边缘相邻形成的通孔与向内延伸的指状物的相应的交替端接合， 下平面。 向内延伸的指状物的端部具有各种长度，其通过形成在PCB的相对表面上的接触垫接合。 一组手指可以枢转以打开上下手指之间的空间。

公开(公告)号：US5398166A

公开(公告)日：1995-03-14

申请号：US245924

申请日：1994-05-19

Applicant: Masao Yonezawa ,  Akiyoshi Moriyasu

Inventor： Masao Yonezawa ,  Akiyoshi Moriyasu

IPC: H01G2/06 ,  H01L23/50 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K3/306 ,  H05K3/366 ,  H05K2201/09709 ,  H05K2201/10386 ,  H05K2201/10424 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K3/301 ,  H05K3/3447

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Abstract translation: 电子部件包括具有芯片部分的基板。 第一引线端子和第二引线端子从基板的一端引导到外部。 第一引线端子在中间部分具有保持部分。 第二引线端子具有用于连接到基板的连接部分和用于插入外部电路板的孔的插入部分。 第二引线端子的连接部分和插入部分与倾斜部分连接。 第一引线端子的保持部分与垂直于基板表面的同一平面处于倾斜部分和第二引线端子的插入部分之间的边界部分。

公开(公告)号：US5291372A

公开(公告)日：1994-03-01

申请号：US949144

申请日：1992-09-23

Applicant: Hideo Matsumoto

Inventor： Hideo Matsumoto

IPC: H01L23/36 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L25/16 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H01L23/49568 ,  H01L23/49811 ,  H01L25/16 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10386 ,  H05K2201/10924

Abstract: An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate.

Abstract translation: 用于混合电路组件的整体散热端子结构包括用于结合到混合集成电路的基板的散热板和用于连接到基板的端子。 散热板和端子在与基板连接之前和之后相对于基板以相同的预定位置关系与公共框架一体。 当该结构用于制造混合集成电路组件时，首先将散热板接合到基板，然后将端子连接到基板。

公开(公告)号：US5246391A

公开(公告)日：1993-09-21

申请号：US762900

申请日：1991-09-19

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01R4/02 ,  H05K3/34

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H01R4/02 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K3/3457 ,  Y10S439/936

Abstract: A solder-bearing lead having a C-clip to resiliently grip the upper and lower surfaces of a substrate. One of the two arms forming the "C" is solder-bearing for mechanical and electrical connection to a conductive area on the substrate. In one embodiment, a polymer plug may be provided on the second arm, the plug having a narrowed neck region for improved retention by the second arm. In another embodiment, the second arm is coated with a non-conductive material, eliminating the need for mechanically retaining a plug or other insulator between the second arm and substrate. The coating on the lead is provided preferably by applying a liquid polymer to the second arm of the lead and hardening the polymer to form a durable, insulating coating.

Abstract translation: 具有C形夹以弹性地夹持衬底的上表面和下表面的焊接轴承引线。 形成“C”的两个臂中的一个是用于与衬底上的导电区域机械和电连接的焊料。 在一个实施例中，可以在第二臂上设置聚合物塞，塞子具有变窄的颈部区域，以改善第二臂的保持力。 在另一个实施例中，第二臂涂覆有非导电材料，消除了在第二臂和衬底之间机械地保持塞子或其它绝缘体的需要。 优选地，通过将​​液体聚合物施加到引线的第二臂并硬化聚合物以形成耐用的绝缘涂层来提供引线上的涂层。

公开(公告)号：US5090926A

公开(公告)日：1992-02-25

申请号：US661252

申请日：1991-02-26

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H01R4/02 ,  H01R43/02 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K3/341 ,  H05K3/3457 ,  H05K3/403 ,  Y10T29/49149

Abstract: A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

Abstract translation: 可焊引线沿其长度形成有C形接触部分。 C部分的内部的尺寸设计成在预定接触垫处接收和弹性地接触基底。 在C形接触部分的外部设置一层焊料，并且围绕其边缘延伸。 在加热期间，焊料通过毛细管作用迁移到C部分的内部到基板的接触焊盘与C部分的内部之间的区域。 当焊料是液体时，C部分保持与衬底的接合。

公开(公告)号：US5079672A

公开(公告)日：1992-01-07

申请号：US427859

申请日：1989-10-13

Applicant: Georg Haubner ,  Hartmut Zobl

Inventor： Georg Haubner ,  Hartmut Zobl

IPC: H01R12/71 ,  H01L25/16 ,  H05K1/02 ,  H05K5/00 ,  H05K7/20

CPC classification number: H05K5/0082 ,  H01L25/16 ,  H05K1/0203 ,  H01L2924/0002 ,  H05K2201/10189 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10659 ,  H05K2201/10689

Abstract: An electrical switching and control device comprising a plurality of heat-emitting electronic components arranged on a hybrid plate, and a plurality of plug-in contacts having surface areas contacting a surface area of the hybrid plate for dissipating heat from the electronic components, and end portions directly connected with connection elements of the hybrid plate.

Abstract translation: PCT No.PCT / DE88 / 00128 Sec。 371日期：1989年10月13日 102（e）日期1989年10月13日PCT提交1988年3月9日PCT公布。 第WO88 / 09058号公报 日期：1988年11月17日。一种电气开关和控制装置，包括布置在混合板上的多个发热电子部件和多个插入式触点，其具有与混合板的表面区域接触以散热的表面区域 从电子部件和与混合板的连接元件直接连接的端部。

公开(公告)号：US4870224A

公开(公告)日：1989-09-26

申请号：US214219

申请日：1988-07-01

Applicant: William D. Smith ,  Richard Dennis ,  Nicholas Brathwaite ,  Richard C. Blish, II

Inventor： William D. Smith ,  Richard Dennis ,  Nicholas Brathwaite ,  Richard C. Blish, II

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01L23/315 ,  H01L23/49811 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/16251 ,  H05K1/141 ,  H05K2201/10386 ,  H05K3/284 ,  H05K3/3426 ,  Y10T29/49121

Abstract: The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.

Abstract translation: 本发明提供一种用于容纳集成电路装置的装置和方法。 集成电路器件耦合到陶瓷衬底，其中集成电路器件的触点与衬底表面上的触点配合。 导线然后将触点耦合到衬底的周边边缘，其中引线框架组件的一组端部与导体配合。 使用封装技术来封装器件，使得仅引线框架组件的另一组端部从封装延伸。 在替代实施例中，集成电路通过设置在集成电路上方的密封盖来密封。 在第二替代实施例中，基板能够在其上放置多个集成电路。 本发明提供了引线数对芯片尺寸比的显着增加。

公开(公告)号：US4737115A

公开(公告)日：1988-04-12

申请号：US944456

申请日：1986-12-19

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01R4/02 ,  H01R12/57 ,  H01R43/02 ,  H01R43/20 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R12/57 ,  H01R43/0256 ,  H05K3/3405 ,  H05K2201/10386 ,  H05K2201/10984 ,  Y10T29/49149

Abstract: A comb-like array of electrical leads is provided, each having a solder mass and/or a locating structure at a terminal end, the array being in two sets for respective attachment to conducting areas on the top and bottom surfaces of a substrate (such as a printed circuit board), the leads being pivotable either at their stem ends (as in FIGS. 1-2, 21-22 and 31-33) or at an intermediate fulcrum (as in FIGS. 40-41). Resilient structures in the form of resilient bowed portions are formed in the leads, so that upon applying appropriate force to the resilient structures, the sets of leads are separated to accept a substrate therebetween, with the lead terminal ends aligned with respective contact pads on the substrate, and so that upon releasing such force, the leads will tend to return to their initial positions and thereby resiliently clamp the lead structure to the substrate, to be held there during subsequent soldering.

Abstract translation: 提供梳状阵列的电引线，每个电引线在终端具有焊料质量和/或定位结构，该阵列分成两组，用于分别连接到衬底的顶表面和底表面上的导电区域（例如 作为印刷电路板），引线可以在其端部（如图1-2,21-22和31-33）或中间支点（如图40-41所示）中枢转。 弹性弯曲部分形式的弹性结构形成在引线中，使得当对弹性结构施加适当的力时，引导组被分离以接受它们之间的衬底，其中引线端部端部与 衬底，并且使得当释放这种力时，引线将趋向于返回到其初始位置，从而弹性地将引线结构夹持到衬底，以在随后的焊接期间保持在该位置。

公开(公告)号：US4629267A

公开(公告)日：1986-12-16

申请号：US856862

申请日：1986-04-25

Applicant: William E. Stepan

Inventor： William E. Stepan

IPC: H01R12/52 ,  H01R12/57 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/57 ,  H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/10303 ,  H05K2201/10386 ,  H05K2201/10962 ,  H05K3/3447

Abstract: A circuit terminating device for mechanically retaining and electrically connecting a planar substrate such as a thick/thin film circuit to a printed wiring card. The terminating device is characterized by a terminating body having planar sidewalls defining a hollow interconnection post receiving area therebetween. A pair of substrate spring members extend from a sidewall of the terminating body arranged to compressively accept an edge of the substrate retaining and connecting the substrate to the terminating body. Post spring members extending inwardly into the post receiving area engage an interconnection post which extends from the printed wiring card thereby retaining the terminating body to the printed wiring card.

Abstract translation: 一种用于将诸如厚/薄膜电路的平面基板机械地保持并电连接到印刷线路卡的电路端接装置。 终端设备的特征在于终端主体具有限定其间的中空互连柱接收区域的平面侧壁。 一对基板弹簧构件从端接体的侧壁延伸，该侧壁被布置成压缩地接受基板的边缘，保持并将基板连接到端接体。 向内延伸到柱接收区域的后弹簧构件接合从印刷线路卡延伸的互连柱，从而将端接体保持在印刷线路卡上。