公开(公告)号：US20130114234A1

公开(公告)日：2013-05-09

申请号：US13668461

申请日：2012-11-05

Applicant: Delphi Technologies, Inc.

Inventor： CHRIS R. SNIDER ,  MARK A. JACKSON

IPC: H05K5/02 ,  H05K9/00 ,  H05K13/00

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

Abstract translation: 用于车辆应用的轻便音频播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的折叠盒，以形成用于接收音频设备的细节以及用于电气控制和显示所需的电路板。 这种情况是复合结构，包括一个插入模制的导电丝网。 丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。 侧壁关闭构件限定自身接合附件特征，用于固定到壳体，提供与电线屏蔽的电自身接地和与内部功率器件的热接地。 主要组件和组件在最终组装过程中是自固定的，无需专用工具，夹具和组装设备。

公开(公告)号：US20130084754A1

公开(公告)日：2013-04-04

申请号：US13249945

申请日：2011-09-30

Applicant: Jeffery Walter MASON ,  William Brian MURPHY ,  Wayne Stewart ALDEN, III

Inventor： Jeffery Walter MASON ,  William Brian MURPHY ,  Wayne Stewart ALDEN, III

IPC: H01R24/00 ,  H05K1/02

CPC classification number: H01R12/79 ,  H01R12/716 ,  H01R12/721 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A card edge connector for mating to a flex circuit includes a housing having a front, a top and a bottom. The housing has a slot between the top and the bottom. The slot is open at the front. The slot is configured to receive a flex circuit therein. Upper contacts are held by the housing between the slot and the top. The upper contacts are exposed in the slot for mating with an upper surface of the flex circuit. Lower contacts are held by the housing between the slot and the bottom. The lower contacts are exposed in the slot for mating with a lower surface of the flex circuit.

Abstract translation: 用于配合到柔性电路的卡缘连接器包括具有前部，顶部和底部的壳体。 外壳在顶部和底部之间有一个槽。 插槽在前面是开放的。 槽被配置为在其中接收柔性电路。 上部触点由插槽和顶部之间的外壳保持。 上部触点暴露在插槽中以与柔性电路的上表面配合。 下部触点由外壳在插槽和底部之间保持。 下部触点暴露在槽中，用于与柔性电路的下表面配合。

公开(公告)号：US20130005160A1

公开(公告)日：2013-01-03

申请号：US13484774

申请日：2012-05-31

Applicant: Steven E. Minich

Inventor： Steven E. Minich

IPC: H01R12/52

CPC classification number: H01R13/6471 ,  H01R12/707 ,  H01R12/724 ,  H01R12/737 ,  H01R13/65807 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: An electrical connector including a housing; ground contacts; and signal contacts. The signal contacts are differential signal pairs. The electrical connector is a right angle connector. First ends of the ground contacts are in a center row. First ends of a first one of the each differential signal pair are on a first side row at a first side of the center row. First ends of a second one of the differential signal pairs are on a second side row at a second opposite side of the center row. At least one of the first ends of the ground contacts is provided between the first ends of two of the differential signal pairs. An assembly is provided including the electrical connector and a printed circuit board having the electrical connector mounted thereon. The printed circuit board includes through-holes with a shared single antipad one of the differential signal pair.

Abstract translation: 一种电连接器，包括壳体; 地面接触 和信号触点。 信号触点是差分信号对。 电连接器是直角连接器。 接地触点的第一端处于中心排。 每个差分信号对中的第一个的第一端在中心行的第一侧的第一侧排上。 差分信号对中的第二个的第一端在中心行的第二相对侧的第二侧排上。 接地触点的第一端中的至少一个设置在两个差分信号对的第一端之间。 提供了一种组件，包括电连接器和其上安装有电连接器的印刷电路板。 印刷电路板包括具有差分信号对中的一个共同的单一止动件的通孔。

公开(公告)号：US20120329359A1

公开(公告)日：2012-12-27

申请号：US13530088

申请日：2012-06-21

Applicant: Jonathan Capriola

Inventor： Jonathan Capriola

IPC: A63H33/04 ,  H05K3/32

CPC classification number: A63H33/042 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10T29/4913

Abstract: A powered toy budding block includes a printed circuit board, at least a first electrical component mounted to the printed circuit board, at least a first electrical connector mounted to an edge of the printed circuit board and electrically connected to the first electrical component, and a body defining a hollow interior cavity, and at least a first mechanical connector, the printed circuit board and the first electrical component being arranged in the hollow interior cavity with the first electrical connector extending into the first mechanical connector. The first electrical component can be a light emitting diode arranged over an opening in the printed circuit board. The first electrical component can also be a digital audio player, operable to play a digital audio file through a speaker arranged in the body.

Abstract translation: 动力玩具发芽块包括印刷电路板，至少安装到印刷电路板的第一电气部件，至少安装到印刷电路板的边缘并电连接到第一电气部件的第一电连接器，以及 主体限定中空的内部空腔，以及至少第一机械连接器，所述印刷电路板和所述第一电气部件布置在所述中空内部空腔中，所述第一电连接器延伸到所述第一机械连接器中。 第一电气部件可以是布置在印刷电路板的开口上方的发光二极管。 第一电气部件也可以是数字音频播放器，可操作以通过布置在身体中的扬声器播放数字音频文件。

公开(公告)号：US08339798B2

公开(公告)日：2012-12-25

申请号：US12832885

申请日：2010-07-08

Applicant: Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

Inventor： Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

公开(公告)号：US20120127705A1

公开(公告)日：2012-05-24

申请号：US13363879

申请日：2012-02-01

Applicant: Young Sam Park ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Seong Yeon Han ,  Dae Hyun Kim ,  Do Hun Kim ,  Dae Yeon Kim

Inventor： Young Sam Park ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Seong Yeon Han ,  Dae Hyun Kim ,  Do Hun Kim ,  Dae Yeon Kim

IPC: F21V21/005 ,  F21V5/04 ,  F21V21/00

CPC classification number: F21V21/005 ,  F21K9/00 ,  F21V13/02 ,  F21V13/08 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Abstract translation: 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

公开(公告)号：US08168992B2

公开(公告)日：2012-05-01

申请号：US13033856

申请日：2011-02-24

Applicant: Chia-Hsien Chang ,  Yi-Tsuo Wu ,  Hsiao-Chiao Li

Inventor： Chia-Hsien Chang ,  Yi-Tsuo Wu ,  Hsiao-Chiao Li

IPC: H01L33/60

CPC classification number: H05K1/021 ,  F21K9/68 ,  F21V29/505 ,  F21V29/70 ,  F21V29/86 ,  F21V29/87 ,  F21V29/89 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10S257/918

Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.

Abstract translation: 发光二极管背光模块包括设置在基座上的基座和光源。 光源包括基板，散热片和LED芯片。 底座有一个导热体。 光源的散热器耦合在光源的基板和基座的热导体之间。 散热器具有与衬底的第一侧相邻的第一部分和与衬底的第二侧相邻的第二部分。 散热片与导热体接触。 LED芯片设置在散热器的第一部分上并且横向地发光。

公开(公告)号：US08125791B2

公开(公告)日：2012-02-28

申请号：US12124933

申请日：2008-05-21

Applicant: Hiroyuki Hirota ,  Takashi Hasegawa

Inventor： Hiroyuki Hirota ,  Takashi Hasegawa

IPC: H05K7/02

CPC classification number: H04M1/0277 ,  H04M1/0214 ,  H04M1/026 ,  H04M1/03 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/10083 ,  H05K2201/1031 ,  H05K2201/10446 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also includes a terminal member for connecting the circuit board and the connection terminal of the electronic component.

Abstract translation: 便携式电子设备包括壳体，壳体中的电路板，壳体中的电子部件。 电子部件包括连接端子和面向电路板的侧面的部分。 便携式电子设备还包括用于连接电路板和电子部件的连接端子的端子部件。

公开(公告)号：US08119928B2

公开(公告)日：2012-02-21

申请号：US12343844

申请日：2008-12-24

Applicant: Isao Matsui

Inventor： Isao Matsui

IPC: H05K1/16 ,  H05K1/00 ,  H05K1/03

CPC classification number: H01R12/721 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117

Abstract: In a multi-layered wiring substrate according to an exemplary aspect of the present invention, a conductor formed in an edge face area functions as a pad for mounting a connector.

Abstract translation: 在根据本发明的示例性方面的多层布线基板中，形成在边缘区域中的导体用作用于安装连接器的垫。

公开(公告)号：US08111525B2

公开(公告)日：2012-02-07

申请号：US12142928

申请日：2008-06-20

Applicant: Brett C. Ong ,  William A. De Meulenaere ,  Michael S. White

Inventor： Brett C. Ong ,  William A. De Meulenaere ,  Michael S. White

IPC: H05K7/12

CPC classification number: H05K1/141 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2201/10606 ,  H05K2203/304

Abstract: A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard.

Abstract translation: 垂直安装在母板上的电路板的支架包括能够连接到远离母板的电路板的边缘的第一附接构件; 第二附接构件，其能够附接到母板的侧边缘; 以及连接第一附接构件和第二附接构件的刚性支撑件。 刚性支撑件被成形为使得当安装支架时电路板基本上垂直于母板保持。 用于最小化垂直安装在母板上的电路板的干扰的干扰最小化装置包括能够远离母板的端部附接到电路板的附接构件; 当所述干扰最小化装置附接到所述电路板时，所述配合壁基本上平行于所述电路板并抵靠所述电路板; 以及从电路板的远端朝向主板变宽的锥形壁。