Abstract:
A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
Abstract:
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Abstract:
A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing member (30) to the housing (10), and a bonding portion (32) to be soldered. The bonding portion (32) is formed with connecting pieces (33) by making U-shaped cuts through the bonding portion (32) and then bending areas enclosed by the cuts upward. A clearance (S) is defined between the bottom edge of the leading end of each connecting piece (33) and the corresponding through hole (34). The lower surfaces of the connecting pieces (33) and the inner surfaces of the through holes (34) can be soldered.
Abstract:
A light emitting diode (LED) assembly has a printed circuit board, multiple conductors and multiple light emitting diodes (LEDs). The printed circuit board has multiple mounting holes. The conductors are mounted on the PCB and serve respectively as positive electrode conductors and negative electrode conductors. Each conductor has a contact pin and at least one through hole with an inner edge. Each LED is mounted on the positive electrode conductor and the negative electrode conductor and has a die and two contact tabs. Each contact tab has a through hole having an inner edge and multiple hooks extending from the inner edge of the through hole in the contact tab and hooking the inner edge of the at least one through hole in the conductor. Consequently, neither solder nor welding is required to assemble the LED assembly.
Abstract:
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Abstract:
A method for attaching an IC socket connector to a circuit board has acts of fabricating IC socket connectors, installing the IC socket connectors in an IC socket, preparing the IC socket connectors for attachment to a circuit board and attaching the IC socket connector to the circuit board. The IC socket connectors are U-shaped, are punched from a metal sheet, have a closed bottom and are electroplated with a protective nickel coating. After installing the IC socket connectors in an IC socket, a recess is formed in the closed bottom of each IC socket connector in any shape. Solder balls are attached respectively to the recesses in the bottoms of the IC socket connectors. The IC socket connectors are attached to the circuit board by melting the solder ball.
Abstract:
The electronic card connector of the present invention comprises an isolation chassis and a pair of metallic arms. The isolation chassis is made of an insulation material. The isolation chassis comprises a plurality of conductive terminals. A metallic arm is respectively fixed onto each of two ends of the isolation chassis. Each of the metallic arms extends downwardly and has a grounding portion and a welding portion for welding securely to the circuit board. Before attaching the electronic card connector to the circuit board, the welding portion of the metallic arm, which has a low melting point conductive metal, reduces the vertical height on the circuit board, when it gets liquefied due to heat in the convection reflow oven, and thus the connecting point on the circuit board and the welding portion of the metallic arm are electrically connected through the solder.
Abstract:
A socket connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The socket connector can be applied in a wide range of uses with high yield and reduced cost. The socket connector has an insulative housing having a plurality of terminals and a solder material therein. The socket connector is characterized by the insulative housing being provided with a plurality of overflow holes in a direction along which the insulative housing and terminals apply pressure to the solder material.
Abstract:
An electrical connector includes an electrically insulative housing having a plurality of passageways and an identical number of contacts. Each contact has an solder portion connected with a solder ball. The solder portion has at least two solder faces which are perpendicular from each other. The solder faces are partly engaged into the solder ball and soldered with the solder ball.
Abstract:
A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.