公开(公告)号：US20130236995A1

公开(公告)日：2013-09-12

申请号：US13450097

申请日：2012-04-18

Applicant: Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Mark Anthony Hand ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dicker ,  Christian Miesner ,  Lothar Schopmann ,  Herfried Zimmer

Inventor： Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Mark Anthony Hand ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dicker ,  Christian Miesner ,  Lothar Schopmann ,  Herfried Zimmer

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L2924/0002 ,  H05K1/0256 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y10T29/49172 ,  H01L2924/00

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。

公开(公告)号：US20130201648A1

公开(公告)日：2013-08-08

申请号：US13470301

申请日：2012-05-12

Applicant: TSUNG-JUNG CHENG

Inventor： TSUNG-JUNG CHENG

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00

Abstract: The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.

Abstract translation: 本公开提供一种自密封堆叠结构，其包括基板单元，第一框架，导电单元和阻挡单元。 基板单元包括第一和第二基板以及夹在其间的第一框架。 导电单元包括多个第一导体和电连接第一基板，第一框架和第二基板的第二导体。 第一和第二导体电连接。 包括至少两个第一和至少两个第二阻塞器的阻塞单元分别围绕多个第一和第二导体周围布置。 第一基板和第一框架通过由焊料组合的第一阻挡件以密封方式连接，其中第一框架和第二基板以密封方式连接通过由焊料组合的第二阻挡件。

公开(公告)号：US20130176689A1

公开(公告)日：2013-07-11

申请号：US13824479

申请日：2011-07-08

Applicant: Nozomu Nishimura ,  Nobuhiro Mikami

Inventor： Nozomu Nishimura ,  Nobuhiro Mikami

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K7/02 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/16225 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y10T29/4913

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract translation: 本发明的组件内置模块包括：基板，其包括顶表面和底表面; 多个电子部件，其安装在所述基板的上表面上; 密封基板顶表面的树脂; 以及与基板的底面接合的加强板。 加强板和树脂彼此粘合。

公开(公告)号：US08475181B2

公开(公告)日：2013-07-02

申请号：US12997302

申请日：2009-04-28

Applicant: Toshihiro Niitsu ,  Hideo Nagasawa

Inventor： Toshihiro Niitsu ,  Hideo Nagasawa

IPC: H01R12/00

CPC classification number: H05K3/365 ,  H05K1/0239 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/2018

Abstract: A FPC connector has an insulative housing with a general U-shape that defines an opening that receives a free end of a length of FPC. The housing has a base and two leg portions and the leg portions have engagement arms that hold engage the FPC free end when inserted into the connector housing opening. A cover of the connector housing has press members that press the FPC and dielectric barriers thereon into contact with contacts on a circuit board.

Abstract translation: FPC连接器具有绝缘壳体，该绝缘壳体具有一般的U形，其限定了容纳FPC长度的自由端的开口。 壳体具有基部和两个腿部，并且当插入连接器壳体开口中时，腿部具有保持接合FPC自由端的接合臂。 连接器壳体的盖具有按压构件，其将FPC和介电屏障按压在电路板上的触点上。

公开(公告)号：US08451617B2

公开(公告)日：2013-05-28

申请号：US12847276

申请日：2010-07-30

Applicant: Chun-Kong Chan ,  Chi Ching Chen

Inventor： Chun-Kong Chan ,  Chi Ching Chen

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/18 ,  H05K1/0231 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10757 ,  H05K2201/2018

Abstract: An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.

Abstract translation: 集成电路板包括桥接滤波电容器，旁路电容器，热敏电阻器和变阻器。 集成电路板还包括具有彼此平行并相邻布置的多个电解电容器的电解电容器组和用于分组电解电容器的安装框架。 本发明使用上述元件来减小垂直高度，水平宽度和占用面积。 因此，可以减小电路板的整体尺寸，使电子装置更小，特别是对于液晶电视和屏幕等薄型电子设备。

公开(公告)号：US08416362B2

公开(公告)日：2013-04-09

申请号：US13003019

申请日：2009-07-15

Applicant: Tadashi Inui

Inventor： Tadashi Inui

IPC: G02F1/1333 ,  G02F1/1343 ,  H05K5/00

CPC classification number: G02F1/13452 ,  H04M1/0266 ,  H05K1/141 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2201/2045 ,  H05K2203/0191

Abstract: To provide an electric circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate connected to a circuit board is suppressed. The electric circuit structure includes a mechanical member (9) in the form of a frame having a closed bottom; a circuit board (1) on the surface of which an electric circuit element is formed, the circuit board being accommodated in the mechanical member (9); a flexible substrate (10) that has a connecting terminal formed on one end (10a) thereof, the connecting terminal being connected to an electrode terminal (7) formed on the circuit board (1), and that is folded back and fixed to a rear face of the mechanical member (9) at the other end opposite to the one end (10a); and a circuit element mounted on a portion of the flexible substrate (10) that is folded back to the rear face of the mechanical member (9), wherein the flexible substrate (10) is fixed to the rear face of the mechanical member (9) via a nonwoven fabric adhesive tape employing a nonwoven fabric as a base material.

Abstract translation: 提供一种电路结构，其抑制了安装在与电路板连接的柔性基板上的电路元件的振动引起的声音产生的发生。 电路结构包括具有封闭底部的框架形式的机械构件（9） 在其表面上形成有电路元件的电路板（1），所述电路板容纳在所述机械构件（9）中; 柔性基板（10），其具有形成在其一端（10a）上的连接端子，所述连接端子与形成在所述电路板（1）上的电极端子（7）连接，并且被折回并固定到 在与一端（10a）相对的另一端处的机械构件（9）的后表面; 以及电路元件，其安装在所述柔性基板（10）的被折回到所述机械构件（9）的后表面的部分上，其中所述柔性基板（10）固定到所述机械构件（9）的后表面 ）通过使用无纺布作为基材的无纺布粘合带。

公开(公告)号：US08385081B2

公开(公告)日：2013-02-26

申请号：US12840432

申请日：2010-07-21

Applicant: Hiroyuki Motohara

Inventor： Hiroyuki Motohara

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/144 ,  G01R31/2818 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/162 ,  H01L2924/00

Abstract: A stacked mounting structure includes a first substrate which includes a first electronic component, a second substrate disposed facing the first substrate and including a second electronic component, an intermediate member having a space for accommodating the second electronic component, an electroconductive member provided to the intermediate member, a first electrode for testing electrically connected to the first electronic component, as an electrode for testing an operation of the first electronic component, a connecting electrode toward the second substrate electrically connected to the second electronic component, as an electrode for electrically connecting to the electroconductive member, and a second electrode for testing provided to the first substrate as an electrode for testing an operation of the second electronic component and electrically connected to the second electronic component via the electroconductive member and the connecting electrode toward the second substrate.

Abstract translation: 堆叠式安装结构包括：第一基板，其包括第一电子部件;第二基板，其面向第一基板设置并且包括第二电子部件;中间部件，具有用于容纳第二电子部件的空间;设置在中间部分的导电部件 构件，用于测试电连接到第一电子部件的第一电极，作为用于测试第一电子部件的操作的电极，朝向与第二电子部件电连接的第二基板的连接电极，用作电连接到 导电构件和用于测试第二电子部件的操作的电极的测试用第二电极，并且经由导电部件和连接电极朝向第二基板电连接到第二电子部件 。

公开(公告)号：US08362364B2

公开(公告)日：2013-01-29

申请号：US12705776

申请日：2010-02-15

Applicant: Toshiya Asano ,  Shinnosuke Maeda

Inventor： Toshiya Asano ,  Shinnosuke Maeda

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L23/16 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0058 ,  H05K2201/2009 ,  H05K2201/2018 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.

Abstract translation: 布线基板组件包括矩形板状布线板，其具有多个树脂绝缘层和交替层叠在一起以限定相对的第一和第二主表面的导电层，以及布置在第一主表面上用于与端子表面接触的多个连接端子 所述芯片和矩形框状加固件固定到所述布线板的所述第一主表面，所述连接端子通过所述加强件的开口暴露。 加强构件具有由从加强构件的内周面延伸到外周面的狭缝分隔开的多个结构件。

公开(公告)号：US08210857B2

公开(公告)日：2012-07-03

申请号：US12597130

申请日：2008-04-28

Applicant: Tan Duc Huynh

Inventor： Tan Duc Huynh

IPC: H01R4/58

CPC classification number: H01R13/641 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2428 ,  H01R2201/20 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: An electronic device includes least two electronic components linked electrically to one another using a flexible connector. The flexible connector includes multiple conducting blades, and is interposed between the two electrical components such that longitudinal edges of the flexible connector are held in contact against respective connection pads of each of the electronic components. The flexible connector is ultimately compressed, respectively, against both electronic components. The electronic device is equipped with two additional conducting blades for checking the state of compression of the flexible connector. The two additional conducting blades include an electrical circuit for determining the state of compression of the flexible connector by a resistive measurement and integrating at least one additional conducting blade of the flexible connector.

Abstract translation: 电子设备包括使用柔性连接器彼此电连接的至少两个电子部件。 柔性连接器包括多个导电叶片，并且插入在两个电气部件之间，使得柔性连接器的纵向边缘保持与每个电子部件的相应连接焊盘接触。 柔性连接器最终分别压缩到两个电子部件上。 电子设备配有两个附加的导电叶片，用于检查柔性连接器的压缩状态。 两个额外的导电叶片包括用于通过电阻测量来确定柔性连接器的压缩状态并集成柔性连接器的至少一个附加导电叶片的电路。

公开(公告)号：US08018731B2

公开(公告)日：2011-09-13

申请号：US12302429

申请日：2007-06-19

Applicant: Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

Inventor： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

IPC: H05K7/10 ,  H05K7/12

CPC classification number: H05K1/141 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09145 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

Abstract translation: 至少连接第一电路板和第二电路板的互连基板（1）。 互连基板（1）包括用于连接壳体（10）的顶面和底面的壳体（1）和连接端子电极。 壳体10在其外周上具有突起（11），在其内周具有开口（13）。