公开(公告)号：US11053592B2

公开(公告)日：2021-07-06

申请号：US16254295

申请日：2019-01-22

Applicant: Applied Materials, Inc.

Inventor： Sanjay D. Yadav

IPC: H01L21/67 ,  H01L21/687 ,  C23C16/52 ,  G01J5/08 ,  G01J5/00 ,  C23C16/458 ,  C23C16/46 ,  C23C16/509 ,  G01J5/04 ,  G01J5/02 ,  C23C14/54

Abstract: Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a lift pin. The lift pin has a body. The body has an interior passage and a rounded top surface configured for contacting a substrate when in use. A substrate temperature sensor disposed in the interior passage.

公开(公告)号：US11044423B2

公开(公告)日：2021-06-22

申请号：US16530232

申请日：2019-08-02

Applicant: REBELLION PHOTONICS, INC.

Inventor： Robert Timothy Kester

IPC: H04N5/33 ,  G01J3/02 ,  G01J3/28 ,  G01J5/00 ,  H04N5/225 ,  G01N21/3504 ,  G02B5/20 ,  G06K9/00 ,  G06K9/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02 ,  G01J3/10 ,  G01J3/12

Abstract: In one embodiment, an infrared (IR) imaging system for determining a concentration of a target species in an object is disclosed. The imaging system can include an optical system including an optical focal plane array (FPA) unit. The optical system can have components defining at least two optical channels thereof, said at least two optical channels being spatially and spectrally different from one another. Each of the at least two optical channels can be positioned to transfer IR radiation incident on the optical system towards the optical FPA. The system can include a processing unit containing a processor that can be configured to acquire multispectral optical data representing said target species from the IR radiation received at the optical FPA. Said optical system and said processing unit can be contained together in a data acquisition and processing module configured to be worn or carried by a person.

公开(公告)号：US20210181025A1

公开(公告)日：2021-06-17

申请号：US17105839

申请日：2020-11-27

Applicant: Commissariat à l'Energie Atomique et aux Energies Alternatives

Inventor： Sébastien BECKER ,  Frank FOURNEL

IPC: G01J5/04 ,  G01J5/02

Abstract: The invention relates to a method for fabricating a detection device 1, comprising the following steps: forming a stack 10, comprising a thermal detector 20, a mineral sacrificial layer 15 and a thin encapsulation layer 16 having a lateral indentation 4; forming a stack 30, comprising a thin supporting layer 33, a getter portion 34 and a thin protective layer 35; directly bonding the thin supporting layer 33 to the thin encapsulation layer 16 so that the getter portion 34 is located in the lateral indentation 4; forming a vent 17, and eliminating the mineral sacrificial layer 15 and the thin protective layer 35; depositing a thin sealing layer 5, blocking the vent 17.

公开(公告)号：US20210152754A1

公开(公告)日：2021-05-20

申请号：US17024485

申请日：2020-09-17

Applicant: Waymo LLC

Inventor： Alexander McCauley ,  Ralph H. Shepard ,  Brandyn White ,  Simon Verghese

IPC: H04N5/33 ,  G06N3/08 ,  G01J5/04 ,  G01J5/02 ,  G01S17/87 ,  G06K9/00

Abstract: The present disclosure relates to systems and methods that utilize machine learning techniques to improve object classification in thermal imaging systems. In an example embodiment, a method is provided. The method includes receiving, at a computing device, one or more infrared images of an environment. The method additionally includes, applying, using the computing device, a trained machine learning system on the one or more infrared images to determine an identified object type in the environment by at least: determining one or more prior thermal maps associated with the environment; using the one or more prior thermal maps and the one or more infrared images, determining a current thermal map associated with the environment; and determining the identified object type based on the current thermal map. The method also includes providing the identified object type using the computing device.

公开(公告)号：US20210126038A1

公开(公告)日：2021-04-29

申请号：US17141232

申请日：2021-01-05

Applicant: Meridian Innovation Pte Ltd

Inventor： Piotr KROPELNICKI ,  Ilker Ender OCAK ,  Paul Simon PONTIN

IPC: H01L27/146 ,  G01J5/04 ,  G01J5/12 ,  G01J5/02 ,  B81C1/00 ,  G01J5/08 ,  G01J5/16 ,  H01L31/0224 ,  H01L31/09

Abstract: Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

公开(公告)号：US10989603B2

公开(公告)日：2021-04-27

申请号：US16486473

申请日：2018-02-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsumi Kakimoto ,  Takafumi Okudo ,  Yosuke Hagihara ,  Akira Matsuura

IPC: G01J5/16 ,  G01J5/04 ,  G01J5/20

Abstract: The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.

公开(公告)号：US10983008B2

公开(公告)日：2021-04-20

申请号：US16438847

申请日：2019-06-12

Applicant: RAYTHEON COMPANY

Inventor： Jeffrey Mitchell ,  Ryan P. Boesch ,  Matthew C. Thomas

IPC: G01J5/46 ,  G01J5/04 ,  H04N5/33 ,  G01J5/12 ,  G01J5/00

Abstract: A bolometer pixel trigger including a substrate, a bolometer formed on the substrate, and a thermal-sensitive film trigger. The thermal-sensitive film trigger includes a resistive varying thermal-sensitive material configured to change resistance in response to a change in temperature thereof. The thermal-sensitive film trigger is configured such that current flow therethrough varies in response to changes in the resistance of the resistive varying thermal-sensitive material.

公开(公告)号：US10973410B2

公开(公告)日：2021-04-13

申请号：US15529103

申请日：2015-11-25

Applicant: Inova Design Solutions Ltd

Inventor： Leon Marsh

IPC: A61B5/00 ,  A61B5/01 ,  G01J5/02 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/145 ,  G01J5/04 ,  G01J5/12 ,  G01J5/00 ,  G01J5/08 ,  A61B5/11 ,  A61B5/333

Abstract: Wearable devices capable of measuring a core body temperature and other vital signs of a user in a range of situations are described herein. The wearable device is arranged to be retained within the ear canal of the ear, in order to prevent the wearable device from inadvertently removing itself from the ear. Providing an infrared thermopile at the innermost end of the ear insert ensures that the infrared thermopile is provided as close as possible to the tympanic membrane which will be used to provide an indication of the core body temperature.

公开(公告)号：US10969335B2

公开(公告)日：2021-04-06

申请号：US16095771

申请日：2017-04-28

Applicant: Tokyo Institute of Technology

Inventor： Yukio Kawano ,  Daichi Suzuki

IPC: G01J3/42 ,  G01J5/04 ,  G01N21/35 ,  H01L51/00 ,  G01N21/3586

Abstract: A terahertz wave detection device includes a low-dimensional electron system material formed on a substrate; and a first electrode and a second electrode opposingly arranged on a two-dimensional plane of the low-dimensional electron system material. The first electrode and the second electrode are made of metals having different thermal conductivity. An 8-element array sensor includes eight terahertz wave detection devices aligned in an array. The terahertz wave detection device includes carbon nanotube film; a first electrode disposed on one side of the carbon nanotube film; and a second electrode disposed on the other side of the carbon nanotube film. The first electrode and the second electrode have different thermal conductivity.

公开(公告)号：US20210059344A1

公开(公告)日：2021-03-04

申请号：US17006741

申请日：2020-08-28

Applicant: QWAKE TECHNOLOGIES, LLC

Inventor： Michael E. Ralston ,  Sam J. Cossman ,  Omer Haciomeroglu ,  John Davis Long, II

IPC: A42B3/04 ,  G02B27/01 ,  G01J5/04 ,  G06T19/00 ,  G06F3/01

Abstract: An assisted perception (AP) module comprises an attachment mechanism to attach the AP module to a helmet, and a housing to integrate modular components of the AP module. The housing comprises a front portion and side portion, the front portion located over an eye of the user. The modular components include sensors to collect information about an environment as sensor data, and processors located in the side portion. The processors execute one or more assisted perception engines that process the sensor data from the sensors into enhanced characterization data. Output devices electronically communicate the enhanced characterization data to a user, wherein at least one of the output devices protrudes from the front portion of the housing in front of an eye of the user.