公开(公告)号：US07606049B2

公开(公告)日：2009-10-20

申请号：US11125018

申请日：2005-05-09

Applicant: Paul Goodwin ,  James W. Cady

Inventor： Paul Goodwin ,  James W. Cady

IPC: H05K7/00

CPC classification number: G11C5/00 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  G11C5/143 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.

Abstract translation: 电路模块将热能分流到使用模块的计算应用的机箱组件或一部分盒子中。 在一个优选的模式中，柔性电路沿其每个第一和第二主要侧面都具有两个等级的IC，最好是阵列型（CSP）装置。 插入触点通常沿着IC的第一侧在两个IC级之间在柔性电路的第一侧上设置成两组。 具有第一和第二侧面的基底提供了用于模块的形式。 该基底优选由金属材料构成，并且表现出边缘，柔性电路围绕该边缘被包裹，并且在基底的另一端延伸，其与基底部件热连接，直接或优选通过热 导管，例如导热柔性材料。

公开(公告)号：US07606040B2

公开(公告)日：2009-10-20

申请号：US11077952

申请日：2005-03-11

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K7/02

CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

Abstract translation: 存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。 本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。 许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。 设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。 描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

公开(公告)号：US07443023B2

公开(公告)日：2008-10-28

申请号：US11231418

申请日：2005-09-21

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

公开(公告)号：US20070115017A1

公开(公告)日：2007-05-24

申请号：US11624608

申请日：2007-01-18

Applicant: Paul Goodwin ,  James Cady ,  Douglas Wehrly

Inventor： Paul Goodwin ,  James Cady ,  Douglas Wehrly

IPC: G01R31/02

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

Abstract translation: 柔性电路具有用于安装在插座或卡缘连接器中的触点。 柔性电路包括安装在边缘连接器触头两侧的集成电路器件。 优选地，柔性电路围绕刚性基板的边缘缠绕，并且在基板的两侧上提供用于安装在插座中的触点。 可以用相同的策略覆盖多个柔性电路。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。

公开(公告)号：US20070070607A1

公开(公告)日：2007-03-29

申请号：US11234342

申请日：2005-09-23

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L25/105 ,  H01L2224/16 ,  H01L2225/107 ,  H01L2225/1094

Abstract: A heat spreader is devised with one or more extensions to increase effective surface area exposed to air. Whether air flow is forced or ambient, and where preferred high thermal conductivity materials are employed, an opportunity for enhanced thermal performance of the circuit or circuit module to be cooled is provided. In a preferred embodiment, a DIMM is inserted at least in part into a channel of a heat spreader comprised of aluminum which exhibits at least one extension in the shape of a “T” above the circuit module. Some embodiments will exhibit multiple extensions or fins while others may have only a single extension in a variety of configurations. The heat spreader is preferably devised from metallic material with high thermal conductivity and for economic and manufacturability reasons, aluminum is a preferred material choice although where higher demands are encountered, copper and other higher conductivity or non metallic materials may be employed. The heat spreader may be used to improve cooling of circuit modules of a variety of types.

Abstract translation: 散热器设计有一个或多个延伸部，以增加暴露于空气的有效表面积。 无论气流是强制的还是环境的，并且采用优选的高导热性材料，提供了要冷却的电路或电路模块的增强热性能的机会。 在优选实施例中，DIMM至少部分地插入到由铝构成的散热器的通道中，该铝在电路模块上方具有至少一个“T”形延伸部分。 一些实施例将展示多个扩展或鳍，而其他实施例可以在各种配置中仅具有单个扩展。 散热器优选由具有高导热性的金属材料设计，并且出于经济和可制造性的原因，铝是优选的材料选择，尽管遇到更高的要求，但是可以采用铜和其它较高导电性或非金属材料。 散热器可用于改善各种类型的电路模块的冷却。

公开(公告)号：US20060175693A1

公开(公告)日：2006-08-10

申请号：US11051815

申请日：2005-02-04

Applicant: James Cady ,  Paul Goodwin

Inventor： James Cady ,  Paul Goodwin

IPC: H01L23/02

CPC classification number: H01L25/105 ,  H01L23/5387 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: Systems, methods, and apparatus for generating a ball-out matrix configuration for a flex circuit are provided. An exemplary processor implemented method for generating a ball-out matrix configuration for at least one flex circuit includes retrieving a set of ball-out matrix constraints for the flex circuit. The method further includes processing the set of ball-out matrix constraints to generate a ball-out matrix configuration output for the flex circuit.

Abstract translation: 提供了用于产生用于柔性电路的淘汰矩阵配置的系统，方法和装置。 用于生成用于至少一个柔性电路的淘汰矩阵配置的示例性处理器实现方法包括检索用于柔性电路的一组滚出矩阵约束。 该方法还包括处理该组弹出矩阵约束以产生用于柔性电路的失球矩阵配置输出。

公开(公告)号：US20060157842A1

公开(公告)日：2006-07-20

申请号：US11039615

申请日：2005-01-20

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01L23/02

CPC classification number: H05K1/147 ,  H01L23/5387 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

Abstract translation: 两个或多个集成电路堆叠成高密度电路模块。 下部IC倒置。 与集成电路的电连接由沿着模块的下部延伸的柔性电路上的模块触点进行。 在一个实施例中，柔性电路提供与两个CSP集成电路的平衡电连接。 在另一个实施例中，柔性电路提供与两个子模块上的附加柔性电路的相互柔性触点的平衡电连接。 额外的灵活电路提供了进一步平衡的连接到每个子模块中的CSP集成电路。

公开(公告)号：US20060129888A1

公开(公告)日：2006-06-15

申请号：US11332740

申请日：2006-01-13

Applicant: Leland Szewerenko ,  Julian Partridge ,  Wayne Lieberman` ,  Paul Goodwin

Inventor： Leland Szewerenko ,  Julian Partridge ,  Wayne Lieberman` ,  Paul Goodwin

IPC: G06F11/00

CPC classification number: H05K1/0256 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditional or new technologies.

公开(公告)号：US20060091529A1

公开(公告)日：2006-05-04

申请号：US11231418

申请日：2005-09-21

Applicant: James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

公开(公告)号：US20060053345A1

公开(公告)日：2006-03-09

申请号：US11123721

申请日：2005-05-06

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G06F11/00

CPC classification number: H05K1/189 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A thin profile memory module is provided which, in a variety of modes, can supplant traditional DIMM constructions of a variety of types such as, for example, registered and fully-buffered. In preferred modes, a memory module is provided that can meet or exceed the interconnective and capacity requirements for SO-DIMMs yet can simultaneously meet or exceed the profile requirements for such devices. In preferred modes, a flex circuit is populated along each of its first and second major sides with a plurality of array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit and disposed proximal to a long edge area of the flex circuit. A substrate with first and second major sides provides a form for the module. The flex circuit is wrapped about an edge of the substrate to place one set of the insertion contacts along the first side of the substrate and the other set of the insertion contacts along the second side of the substrate while the ICs populated along the second side of the flex circuitry are disposed between the flex circuit and the substrate.

Abstract translation: 提供了薄型存储器模块，其以各种模式可以取代各种类型的传统DIMM构造，例如，已注册和完全缓冲。 在优选模式中，提供可满足或超过SO-DIMM的互连和容量需求的存储器模块，但是可以同时满足或超过这些设备的配置文件要求。 在优选的模式中，柔性电路沿着其第一和第二主要侧面以多个阵列型（CSP）装置填充。 插入触头在柔性电路的第一侧上设置成两组，并且设置在柔性电路的长边缘区域附近。 具有第一和第二主要侧面的基板提供了用于模块的形式。 柔性电路围绕衬底的边缘缠绕，以沿着衬底的第一侧沿着衬底的第一侧放置一组插入触点，并且沿衬底的第二侧放置另一组插入触点，同时沿着衬底的第二侧填充IC 柔性电路设置在柔性电路和基板之间。