公开(公告)号：US20230328433A1

公开(公告)日：2023-10-12

申请号：US17658716

申请日：2022-04-11

Applicant: Infineon Technologies AG

Inventor： Jose Luis Ceballos ,  Hong Chen ,  Fulvio CiCiotti ,  Andreas Wiesbauer

IPC: H04R3/02 ,  H03F3/45 ,  H04R19/04 ,  H04R29/00

CPC classification number: H04R3/02 ,  H03F3/45475 ,  H04R19/04 ,  H04R29/004 ,  H03F2200/03 ,  H04R2201/003

Abstract: A single-ended to differential converter includes a converter input, a first converter output, a second converter output, and an internal node, wherein the first converter output and the second converter output comprise a differential output; a non-inverting amplifier having an input coupled to the converter input, and an output coupled to the first converter output; an inverting amplifier having an input coupled to the first converter output, and an output coupled to the second converter output; a charge pump having a charge pump output capacitor coupled between the second converter output and the internal node; and a feedback capacitor coupled between the first converter output and the internal node.

公开(公告)号：US11780726B2

公开(公告)日：2023-10-10

申请号：US17518350

申请日：2021-11-03

Applicant: Knowles Electronics, LLC

Inventor： Michael Kuntzman ,  Michael Pedersen ,  Faisal Zaman ,  Xin Song ,  Vahid Naderyan

IPC: B81B3/00 ,  H04R7/12

CPC classification number: B81B3/0021 ,  H04R7/125 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0361 ,  B81B2203/04 ,  H04R2201/003

Abstract: A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

公开(公告)号：US20230319485A1

公开(公告)日：2023-10-05

申请号：US18129548

申请日：2023-03-31

Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.

Inventor： Fabian STOPPEL ,  Fabian LOFINK ,  Malte Florian NIEKIEL ,  Bernhard WAGNER

IPC: H04R19/02 ,  H04R7/06 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/02 ,  H04R7/06 ,  H04R7/18 ,  B81B3/0067 ,  H04R2201/003 ,  H04R2440/01 ,  B81B2203/0127

Abstract: Embodiments of the present disclosure describe an MEMS sound transducer having an actuator and a structure surrounding the actuator, wherein the actuator is separated from the surrounding structure by one or several slits. Furthermore, the sound transducer includes at least one first diaphragm arranged on the actuator along at least one of the one or several slits; and at least one second diaphragm arranged on the surrounding structure along the slit of the one or several slits.

公开(公告)号：US20230312335A1

公开(公告)日：2023-10-05

申请号：US18200885

申请日：2023-05-23

Applicant: Soundskrit Inc.

Inventor： Stephane Leahy ,  Wan-Thai Hsu ,  Mohsin Nawaz ,  Carly Stalder ,  Sahil Gupta ,  Meysam Daeichin

IPC: B81B3/00 ,  B81B7/02 ,  H04R19/04

CPC classification number: B81B3/0021 ,  B81B7/02 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0172 ,  B81B2203/056 ,  B81B2203/06 ,  H04R2201/003

Abstract: A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

公开(公告)号：US20230308808A1

公开(公告)日：2023-09-28

申请号：US18190719

申请日：2023-03-27

Applicant: Robert John LITTRELL ,  Ronald GAGNON ,  Karl GROSH

Inventor： Robert John LITTRELL ,  Ronald GAGNON ,  Karl GROSH

IPC: H04R17/02 ,  H04R3/00 ,  H04R3/04

CPC classification number: H04R17/025 ,  H04R3/00 ,  H04R17/02 ,  H04R3/04 ,  H04R2201/003

Abstract: A device comprising: a sensor; and a first circuit configured to detect when an input stimulus to the sensor satisfies one or more detection criteria, and further configured to produce a signal upon detection that causes adjustment of performance of the device; and a second circuit for processing input following detection, wherein the second circuit is configured to increase its power level following detection, relative to a power level of the second circuit prior to detection.

公开(公告)号：US20230300538A1

公开(公告)日：2023-09-21

申请号：US18125605

申请日：2023-03-23

Applicant: Expensify, Inc.

Inventor： David M. Barrett ,  Robert Chen

IPC: H04R19/04 ,  G10L15/22 ,  H04R1/08 ,  H04R1/14 ,  H04R1/10

CPC classification number: H04R19/04 ,  G10L15/22 ,  H04R1/08 ,  H04R1/14 ,  H04R1/1058 ,  H04R2460/13 ,  G10L2015/223 ,  H04R2201/003

Abstract: An interactive system can utilize microtechnology (e.g., a micro-electromechanical system (MEMS)), such as miniaturized microphone (e.g., a bone-conducting microphone), audio output device, microprocessor, and signal conversion and propagation means to create a personal area network (PAN) for a user. The system can include a voice input device (e.g., worn on one or more teeth of the user) that outputs a near-field magnetic induction (NFMI) signal based on a whisper input by the user. The NFMI signal is either detected by the user's mobile device, or converted into a wireless signal (e.g., a Bluetooth RF signal) detectable by the user's mobile device, for receiving voice commands (e.g., to provide personal assistant services) via a designated application running on the mobile device.

公开(公告)号：US11765533B2

公开(公告)日：2023-09-19

申请号：US17120169

申请日：2020-12-13

Applicant: Guanghua Wu ,  Xingshuo Lan ,  Zhixiong Xiao

Inventor： Guanghua Wu ,  Xingshuo Lan ,  Zhixiong Xiao

IPC: H04R19/04 ,  H04R31/00

CPC classification number: H04R31/00 ,  H04R19/04 ,  H04R2201/003 ,  H04R2410/03

Abstract: The present invention provides a capacitive microphone such as a MEMS microphone with two capacitors. The signal output from the first capacitor is additive inverse of that from the second capacitor, and a total signal output is a difference between the two outputs. In at least one of the two capacitors, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed capacitor plate, instead of moving toward/from the fixed plate. The squeeze film damping, and the noise are substantially avoided, and the performances of the microphone is significantly improved.

公开(公告)号：US11760624B2

公开(公告)日：2023-09-19

申请号：US17749378

申请日：2022-05-20

Applicant: Sonion Nederland B.V.

Inventor： Raymond Mogelin ,  Dion Ivo de Roo ,  Frederik Cornelis Blom ,  Alwin Fransen ,  Pavlo Mulyar ,  Peter Christiaan Post

IPC: B81B3/00 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04

CPC classification number: B81B3/007 ,  B81B3/0045 ,  H04R19/005 ,  H04R19/01 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2201/0264 ,  H04R2201/003

Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

公开(公告)号：US20230283963A1

公开(公告)日：2023-09-07

申请号：US18176598

申请日：2023-03-01

Applicant: Skyworks Solutions, Inc.

Inventor： Guofeng Chen ,  Rakesh Kumar ,  You Qian ,  Michael Jon Wurtz ,  Humberto Campanella-Pineda

IPC: H04R17/02 ,  H04R1/04 ,  H04R1/08 ,  H04R3/00

CPC classification number: H04R17/02 ,  H04R1/04 ,  H04R1/086 ,  H04R3/00 ,  H04R2201/003

Abstract: A piezoelectric microelectromechanical system microphone assembly comprises a carrier substrate including one of a through-hole or a recess, and a package including a microelectromechanical system die having a piezoelectric microelectromechanical system microphone mounted on a microphone substrate and a lid, at least a portion of the package disposed within the one of the through-hole or recess.

公开(公告)号：US11750980B2

公开(公告)日：2023-09-05

申请号：US17815249

申请日：2022-07-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wen Cheng ,  Chun Yin Tsai ,  Chia-Hua Chu

IPC: H04R17/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R17/02 ,  B81B3/0021 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R2201/003

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern having first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region. The via pattern further includes second lines extending from the anchored region of the membrane toward the central region of the membrane. Each of the second lines includes a length less than a length of each of the first lines.