公开(公告)号：US07115673B2

公开(公告)日：2006-10-03

申请号：US10736529

申请日：2003-12-17

Applicant: Amane Mochizuki ,  Takahiro Fukuoka ,  Mitsuhiro Kanada ,  Takayuki Yamamoto ,  Tomohiro Taruno

Inventor： Amane Mochizuki ,  Takahiro Fukuoka ,  Mitsuhiro Kanada ,  Takayuki Yamamoto ,  Tomohiro Taruno

IPC: C08J3/24 ,  C08J9/26 ,  C08J99/00 ,  B32B27/16 ,  B32B27/42

CPC classification number: H05K1/056 ,  G03F7/037 ,  H05K1/024 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/4676 ,  H05K2201/0116 ,  H05K2201/0154 ,  Y10S522/903 ,  Y10S522/915 ,  Y10T428/31721

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract translation: 本发明的感光性树脂组合物2包含聚酰胺酸树脂4，光敏剂，分散在聚酰胺酸树脂4中的分散性化合物3和溶剂。 多孔树脂通过从感光性树脂组合物2中除去溶剂而形成分散性化合物3分散在聚酰胺酸树脂4中的组合物，除去分散性化合物，使组合物多孔，并使多孔感光性树脂 组成。 多孔树脂能够形成精细电路图案并且具有低介电常数，并且当用作电路板的绝缘层时，会带来改善的高频特性。

公开(公告)号：US20060199021A1

公开(公告)日：2006-09-07

申请号：US11430865

申请日：2006-05-10

Applicant: Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

Inventor： Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

IPC: B32B27/00 ,  H01L21/00 ,  C08L83/00 ,  C08G77/00

CPC classification number: C08L83/04 ,  C08G77/045 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/31695 ,  H01L23/5222 ,  H01L2924/0002 ,  H05K1/024 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2203/083 ,  H05K2203/1105 ,  Y10T428/31663 ,  C08L2666/04 ,  H01L2924/00

Abstract: The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer evenly dissolved in (c) an organic solvent; a composition comprising (a) a thermally decomposable polymer, (b) a siloxane oligomer, and (c) an organic solvent in which both of the ingredients (a) and (b) are soluble; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith and then heating the resulting film to condense the siloxane oligomer and remove the thermally decomposable polymer; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith, subsequently conducting a first heating step in which the siloxane oligomer is crosslinked while keeping the thermally decomposable polymer remaining in the film, and then conducting a second heating step in which the thermally decomposable polymer is removed; a low-permittivity film formed by either of the methods for low-permittivity film formation; and an electronic part having the low-permittivity film.

Abstract translation: 本发明提供一种组合物，其包含（a）可热分解的聚合物和（b）均匀溶解于（c）有机溶剂中的硅氧烷低聚物; （a）可热分解的聚合物，（b）硅氧烷低聚物和（c）成分（a）和（b）都可溶的有机溶剂的组合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物施加到基底上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，然后加热所得膜以冷凝硅氧烷低聚物并除去热分解 聚合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物涂布在基材上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，随后进行第一加热步骤，其中硅氧烷低聚物交联同时保持 残留在该膜中的可热分解聚合物，然后进行除去热分解聚合物的第二加热步骤; 通过低介电常数薄膜形成方法之一形成的低介电常数膜; 以及具有低介电常数膜的电子部件。

公开(公告)号：US20060172588A1

公开(公告)日：2006-08-03

申请号：US11345441

申请日：2006-02-01

Applicant: Shu Peng

Inventor： Shu Peng

IPC: H01R12/24

CPC classification number: H05K1/0281 ,  H01R12/52 ,  H01R12/59 ,  H05K3/0058 ,  H05K2201/0116 ,  H05K2201/056 ,  H05K2201/2009

Abstract: An electronic device including a panel, an interface board, a flexible flat cable, and a pad. The panel includes a first connector. The interface board includes a second connector that does not oppositely face the first connector. The flexible flat cable connects the first connector and the second connector, and includes a bend portion. The pad is disposed in the bend portion.

Abstract translation: 一种电子设备，包括面板，接口板，柔性扁平电缆和垫。 面板包括第一连接器。 接口板包括不与第一连接器相对的第二连接器。 柔性扁平电缆连接第一连接器和第二连接器，并且包括弯曲部分。 衬垫设置在弯曲部分中。

公开(公告)号：US20060126217A1

公开(公告)日：2006-06-15

申请号：US11296265

申请日：2005-12-08

Applicant: Sang-Chul Shin ,  Byoung-gyou Choi ,  Jeong-seon Kim ,  Jun-young Lee

Inventor： Sang-Chul Shin ,  Byoung-gyou Choi ,  Jeong-seon Kim ,  Jun-young Lee

IPC: G11B17/00

CPC classification number: H05K1/0272 ,  G11B33/121 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/09063

Abstract: A flexible printed circuit and a bracket structure for the hard disk drive. The flexible printed circuit includes a base layer, a circuit layer provided on the base layer, a cover layer provided on the circuit layer, and a filter layer interposed between the base layer and the circuit layer. Also, the bracket structure includes a flexible printed circuit for driving an actuator, a bracket connected to the flexible printed circuit, and a filter interposed between the flexible printed circuit and the bracket. Thermal asperity caused by fine particles in the hard disk drive is prevented so that performance deterioration of the hard disk drive is prevented and reliability thereof is improved.

Abstract translation: 用于硬盘驱动器的柔性印刷电路和支架结构。 柔性印刷电路包括基底层，设置在基底层上的电路层，设置在电路层上的覆盖层和插入在基底层和电路层之间的滤色层。 此外，支架结构包括用于驱动致动器的柔性印刷电路，连接到柔性印刷电路的支架以及插在柔性印刷电路和支架之间的滤光器。 防止由硬盘驱动器中的微粒导致的热不均匀性，从而防止硬盘驱动器的性能恶化并提高其可靠性。

公开(公告)号：US20050255312A1

公开(公告)日：2005-11-17

申请号：US11122138

申请日：2005-05-04

Applicant: Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

Inventor： Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

IPC: H05K1/09 ,  B32B9/00 ,  B32B15/00 ,  H01B5/14 ,  H01Q1/00 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K3/1283 ,  B82Y30/00 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T428/25 ,  Y10T428/30

Abstract: The present invention provides a conductive material having superior bending property and superior bending resistant property and a method for manufacturing the same. This object is achieved by a conductive material comprising a substrate and a conductive portion formed within the substrate, wherein a change ratio in the electric resistance values before and after a bending resistant property test, in which the conductive portion is bent by 180 degrees and a load of 1 kg/cm2 is imposed on the bent portion for one hour, is set within a range of ±10%.

Abstract translation: 本发明提供具有优异的弯曲性和优异的抗弯曲性的导电材料及其制造方法。 该目的通过包括基板和形成在基板内的导电部分的导电材料来实现，其中导电部分弯曲180度的抗弯曲性试验之前和之后的电阻值的变化率和 在弯曲部分施加1kg / cm 2的负荷1小时，设定在±10％的范围内。

公开(公告)号：US20050238889A1

公开(公告)日：2005-10-27

申请号：US10875050

申请日：2004-06-22

Applicant: Nancy Iwamoto ,  Joseph Kennedy ,  Eal Lee

Inventor： Nancy Iwamoto ,  Joseph Kennedy ,  Eal Lee

IPC: B32B3/26 ,  B32B9/04 ,  C07C13/28 ,  H01L21/31 ,  H01L21/316 ,  H01L21/768 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00

CPC classification number: H01L21/02203 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02205 ,  H01L21/0228 ,  H01L21/02362 ,  H01L21/31695 ,  H01L21/7682 ,  H01L21/76841 ,  H01L2221/1047 ,  H05K1/036 ,  H05K1/162 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2203/1147 ,  Y10T428/249953 ,  Y10T428/31663

Abstract: A layered component is described herein that includes: a substrate; a dielectric material having a plurality of pores, wherein the material is coupled to the substrate; and a self-assembled diffusion blocking material coupled to the dielectric material, wherein the diffusion blocking material is attracted to the dielectric material. A layered component is also described herein that includes: a substrate; a dielectric material having a plurality of pores, wherein the material is coupled to the substrate; and a self-assembled diffusion blocking material coupled to the dielectric material, wherein the diffusion blocking material reacts with the dielectric material. A layered material is described that includes: a) a porous material comprising a porous surface; and b) a layer of blocking material comprising reactive functionalities coupled to the porous surface, wherein the interaction of the reactive functionalities with the porous material forms a diffusion blocking layer. Methods are also described of minimizing the diffusion of metal atoms, reactive etchants or CVD/ALD precursor materials into a material having a plurality of pores are disclosed herein that include: a) providing a precursor material that comprises a carbon-including material; b) providing a solvent carrier solution; c) combining the precursor material and the solvent carrier solution to form a diffusion blocking reactive solution; and d) applying the diffusion blocking reactive solution to the material having a plurality of pores to form a diffusion blocking material.

Abstract translation: 本文描述了一种分层组件，其包括：基底; 具有多个孔的介电材料，其中所述材料耦合到所述基底; 以及耦合到电介质材料的自组装扩散阻挡材料，其中扩散阻挡材料被吸引到电介质材料。 本文还描述了分层组件，其包括：基底; 具有多个孔的介电材料，其中所述材料耦合到所述基底; 以及耦合到所述介电材料的自组装扩散阻挡材料，其中所述扩散阻挡材料与所述电介质材料反应。 描述了层状材料，其包括：a）包含多孔表面的多孔材料; 和b）包含耦合到多孔表面的反应性官能团的阻挡材料层，其中反应性官能团与多孔材料的相互作用形成扩散阻挡层。 还描述了使金属原子，反应性蚀刻剂或CVD / ALD前体材料扩散到具有多个孔的材料中的扩散的方法，其包括：a）提供包含含碳材料的前体材料; b）提供溶剂载体溶液; c）将前体材料和溶剂载体溶液组合以形成扩散阻断反应溶液; 以及d）将扩散阻挡反应性溶液施加到具有多个孔的材料上以形成扩散阻挡材料。

公开(公告)号：US20050226995A1

公开(公告)日：2005-10-13

申请号：US10859205

申请日：2004-06-03

Applicant: Arie Maharshak ,  Nitsan Maharshak ,  Tomer Maharshak

Inventor： Arie Maharshak ,  Nitsan Maharshak ,  Tomer Maharshak

IPC: C23C18/00 ,  H01R12/04 ,  H01R24/00 ,  H01R33/00 ,  H05K1/00 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K1/0287 ,  H05K1/0393 ,  H05K2201/0116 ,  H05K2201/09609 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1572

Abstract: A board that may include for example a first conductive area on a first side and a second conductive area on a second side of such board. The board may be fitted with a plurality of holes that may for example open or end on both such first side and such second side of such board. A conductive material in the form of for example a liquid or gel may be applied or for example painted onto one or both sides of such board so that such material may for example substantially fill some or all of such holes and may establish a connection through which an electric current may pass from for example the first conductive area to the second conductive area. A switch having for example a board with a plurality of holes running through such board from a first side to a second side. A conductive material may for example be applied to such board so that such material substantially fills for example two or more of such holes and may be capable of forming an electrical connection between a conductive area on a first side of such board and a conductive area on a second side of such board. A method of forcing a conductive liquid into a plurality of holes in a board so that the liquid forms for example a connection capable of carrying a current between a conductive area on a first side of such board and a conductive area of a second side of such board.

Abstract translation: 可以包括例如第一侧上的第一导电区域和该板的第二侧上的第二导电区域的板。 板可以装配有多个孔，这些孔可以例如在这种板的这样的第一侧和第二面上打开或结束。 形式为例如液体或凝胶的导电材料可以施加或例如涂在这种板的一侧或两侧上，使得这种材料可以例如基本上填充这些孔的一些或全部，并且可以建立连接，通过该连接 电流可以从例如第一导电区域传递到第二导电区域。 开关具有例如具有从第一侧到第二侧穿过该板的多个孔的板。 例如，可以将导电材料施加到这种板上，使得这种材料基本上填充例如两个或更多个这样的孔，并且可以在这种板的第一面上的导电区域和导电区域之间形成电连接 这样的板的第二面。 将导电液体强制成板中的多个孔的方法，使得液体形成例如能够在这种板的第一面上的导电区域和第二侧的导电区域之间承载电流的连接 板。

公开(公告)号：US20050207114A1

公开(公告)日：2005-09-22

申请号：US10801515

申请日：2004-03-16

Applicant: Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

Inventor： Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

IPC: H05K1/02 ,  H05K3/42 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: A vent assembly (50) for an electronic control module (28) is provided. The vent assembly (50) may be adheringly coupled to a printed circuit board (38). The vent assembly (50) being adapted to prevent the ingress of moisture and permit the egress of certain gases.

Abstract translation: 提供了一种用于电子控制模块（28）的排气组件（50）。 通气组件（50）可以附着地联接到印刷电路板（38）。 排气组件（50）适于防止湿气进入并允许某些气体流出。

公开(公告)号：US20050092478A1

公开(公告)日：2005-05-05

申请号：US10697839

申请日：2003-10-30

Applicant: Vivek Jairazbhoy ,  Mohan Paruchuri

Inventor： Vivek Jairazbhoy ,  Mohan Paruchuri

IPC: F28F13/00 ,  H01L23/373 ,  H01L23/473 ,  H05K1/02 ,  F28F7/00

CPC classification number: H05K1/0206 ,  F28F13/003 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K2201/066 ,  H01L2924/00

Abstract: Further, a system is provided for dissipating heat from a semiconductor module including a semiconductor die and the unitary heat sink. The heat sink comprising a unitary body having both a porous and non-porous portion is provided. The non-porous portion is attached to the semiconductor die and configured to transfer heat to the porous portion for dissipation into the environment. In addition, a method for manufacturing the heat sink is provided.

Abstract translation: 此外，提供了一种用于从包括半导体管芯和整体散热器的半导体模块散热的系统。 提供了包括具有多孔和无孔部分的整体的散热器。 无孔部分附接到半导体管芯并且被配置为将热量传递到多孔部分以便耗散到环境中。 此外，还提供了制造散热器的方法。

公开(公告)号：US06866892B2

公开(公告)日：2005-03-15

申请号：US10607306

申请日：2003-06-27

Applicant: Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

Inventor： Takeshi Suzuki ,  Satoru Tomekawa ,  Yoshihiro Kawakita ,  Yasushi Nakagiri ,  Fumio Echigo

IPC: H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B05D3/12

CPC classification number: H05K1/024 ,  H05K1/036 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

Abstract: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.