公开(公告)号：US4869956A

公开(公告)日：1989-09-26

申请号：US328415

申请日：1989-03-24

Applicant: William G. Bridges ,  Thomas A. Armer

Inventor： William G. Bridges ,  Thomas A. Armer

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B15/08 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: Polymer/copper laminates and a method for their manufacture employing smooth, untreated, wrought-copper and characterized by cohesive and adhesive strength in the resulting laminates.

Abstract translation: 聚合物/铜层压材料及其制造方法采用光滑的未处理的锻造铜，并且在所得的层压板中以粘结和粘合强度为特征。

公开(公告)号：US3437522A

公开(公告)日：1969-04-08

申请号：US3437522D

申请日：1965-02-19

Applicant: SCHJELDAHL CO G T

Inventor： FICK HERBERT J ,  JOHNSON ROGER W

IPC: C09D9/00 ,  C11D7/08 ,  H01B3/44 ,  H05K1/00 ,  H05K1/03 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  B08B3/08

CPC classification number: H01B3/441 ,  C09D9/00 ,  C11D7/08 ,  H05K1/032 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/288 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/0789 ,  Y10S428/901

公开(公告)号：US20230209708A1

公开(公告)日：2023-06-29

申请号：US17927479

申请日：2021-05-24

Applicant: KYOCERA Corporation

Inventor： Chie CHIKARA ,  Tadashi NAGASAWA ,  Satoshi YOSHIURA ,  Satoshi KAJITA ,  Kouji FUJIKAWA

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0373 ,  H05K1/0256 ,  H05K2201/0158

Abstract: An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 3.7×105 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 2.8×105 cpm to 3.2×105 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

公开(公告)号：US20180168032A1

公开(公告)日：2018-06-14

申请号：US15580824

申请日：2016-06-17

Applicant: DST Innovations Limited

Inventor： Anthony Miles ,  Benjamin John Masheder

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  C23F1/30 ,  D06M10/02 ,  D06M11/74 ,  D06M11/83 ,  D06M23/16

CPC classification number: H05K1/0283 ,  C23F1/02 ,  C23F1/30 ,  D06M10/025 ,  D06M11/74 ,  D06M11/83 ,  D06M23/16 ,  D10B2501/00 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/061 ,  H05K3/067 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2203/1461 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: A method of forming a conductive/nonconductive pattern on a conductive particle-coated fabric uses chemical etching techniques to remove specific areas of conductive material from the fabric, producing non-conductive areas where the fabric was exposed to an etching agent, and leaving conductive areas where the conductive coating was protected by an etch-resistant coating.

公开(公告)号：US20180164529A1

公开(公告)日：2018-06-14

申请号：US15317117

申请日：2016-10-28

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: G02B7/02 ,  G02B5/20 ,  G02B3/00 ,  G02B7/00 ,  H04M1/02 ,  H04N5/225 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/48091 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US09942989B2

公开(公告)日：2018-04-10

申请号：US14312222

申请日：2014-06-23

Applicant: ILLINOIS TOOL WORKS, INC.

Inventor： Hongchuan Liao ,  Chris Benson ,  Yong Liang ,  Tom Carlson

IPC: H05K7/00 ,  H05K1/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36

CPC classification number: H05K1/185 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2262/106 ,  B32B2264/02 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/302 ,  B32B2457/04 ,  H05K2201/0137 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0183 ,  Y10T428/31507 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

公开(公告)号：US09906700B2

公开(公告)日：2018-02-27

申请号：US15473609

申请日：2017-03-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  G02B3/00 ,  H05K1/18 ,  G02B7/00 ,  H05K1/02 ,  G02B5/20 ,  G02B7/02 ,  H04M1/02 ,  H01L27/146

CPC classification number: H04N5/2257 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B7/021 ,  H01L27/14625 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US09900979B2

公开(公告)日：2018-02-20

申请号：US15240132

申请日：2016-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hiesang Sohn ,  Chan Kwak ,  Mi Jeong Kim ,  Hyeon Cheol Park ,  Weonho Shin ,  Youngjin Cho

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/14 ,  H05K3/22 ,  C01B31/04

CPC classification number: H05K1/09 ,  C01B31/0484 ,  C01B32/184 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/146 ,  H05K3/22 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/0783 ,  Y02E10/50

Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

公开(公告)号：US09899124B2

公开(公告)日：2018-02-20

申请号：US14416453

申请日：2012-07-23

Applicant: Yaron Grinwald ,  Gideon Amir ,  Rita Reznikov ,  Reut Avigdor ,  Haim Gefen ,  Gil Bar-Haim ,  Mark Sandler ,  Dror Kella

Inventor： Yaron Grinwald ,  Gideon Amir ,  Rita Reznikov ,  Reut Avigdor ,  Haim Gefen ,  Gil Bar-Haim ,  Mark Sandler ,  Dror Kella

IPC: H01B1/24 ,  H05K1/09 ,  B05D5/12 ,  G03G9/08 ,  G03G9/087 ,  C09D7/12 ,  C09D11/106 ,  C09D11/037 ,  C09D11/52

CPC classification number: H01B1/24 ,  B05D5/12 ,  C08L23/0869 ,  C08L33/02 ,  C09D7/70 ,  C09D11/037 ,  C09D11/106 ,  C09D11/52 ,  G03G9/0827 ,  G03G9/08704 ,  G03G9/08733 ,  H05K1/09 ,  H05K2201/0158 ,  H05K2201/0323

Abstract: The present disclosure is drawn to an electrostatic ink composition comprising a resin and an elongate conductive species. Also disclosed herein is a substrate on which is electrostatically printed a conductive trace, wherein the trace comprises a resin and an elongate conductive species. Further disclosed herein is a method of electrophotographic printing an electrostatic ink composition comprising a resin and an elongate conductive species.

公开(公告)号：US20180020138A1

公开(公告)日：2018-01-18

申请号：US15705232

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  H01L21/56 ,  H01L25/065 ,  H01L27/146

CPC classification number: H04N5/2257 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B7/021 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.