Abstract:
A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
Abstract:
Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.
Abstract:
The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions. It is possible to produce a printed wiring board by using, as a core substrate, a metal-clad laminate containing the insulating substrate. Also, it is possible to produce a semiconductor device by mounting a semiconductor element onto the printed wiring board.
Abstract:
An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.
Abstract:
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).
Abstract:
Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same. The foregoing thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foil, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristics, and drillability, achieves the high density and high reliability of wiring boards required at present, and can be widely used for production of electronic appliances and the like.
Abstract:
An electrical raft 200 comprising electrical conductors 252 embedded in a rigid material are provided to a gas turbine engine. The raft 200 is used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. The electrical raft 200 has an electrical connector 700 embedded therein which is used to connect the electrical raft to an electrical unit, such as an EEC of a gas turbine engine The electrical connector 700 is resiliently biased so as to ensure a reliable electrical connection.
Abstract:
An electrical raft (200) is provided that has electrical conductors (252) embedded in a rigid material (220). The electrical raft is provided with an electrical connector (700). The electrical connector (700) is mounted in the electrical raft (200) at a mounting angle (730). The mounting angle is set such that the electrical conductors (252) can be connected to the electrical connector without having to turn through an angle or a radius of curvature that would subject them to excessive bending stress. Similarly, the mounting angle means that any conductors (766) that may be connected to the electrical connector (700) do not have to turn through an angle or a radius of curvature that would subject them to excessive bending stress. Furthermore, mounting the electrical connector (700) at the mounting angle (730) may allow the assembled electrical raft (200) to be more compact.
Abstract:
A raft assembly for a gas turbine engine is provided. The raft assembly includes a rigid raft formed of a rigid material that has an electrical system and/or a fluid system embedded therein. The raft assembly further includes one or more clamps for mounting tubular members to the raft. The or each clamp has a first clamp block and a second clamp block which, in use, clamp together to grip a tubular member between the blocks. The first block is fixed to the raft. The or each clamp further has a fastener operatively extending between the blocks. The fastener is tightenable to apply a clamping load between the blocks, and releasable to remove the clamping load such that the second block can be moved relative to the first block to allow the tubular member to be received between or removed from between the blocks
Abstract:
An electrical assembly 600 comprising an electrical raft 200 and an electronic unit 300 is provided to a gas turbine engine 10. The electrical raft 200 has electrical conductors 252 embedded in a rigid material 220, which may be a rigid composite material. The electrical conductors 252 are in electrical contact with the electronic unit 300. When the electronic unit 300 is installed, at least a part 310 of it forms a part of a gas-washed surface of the engine 10. The electronic unit 300 is then easily accessible from the engine 10, and potentially complex and/or heavy access doors/panels may not be required.