Wiring substrate
    51.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号:US08648260B2

    公开(公告)日:2014-02-11

    申请号:US13075838

    申请日:2011-03-30

    Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

    Abstract translation: 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层,包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层,包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层,包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层,包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。

    INSULATING SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
    53.
    发明申请
    INSULATING SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 审中-公开
    绝缘基板,金属层压板,印刷电路板和半导体器件

    公开(公告)号:US20130242520A1

    公开(公告)日:2013-09-19

    申请号:US13885321

    申请日:2011-11-15

    Applicant: Iji Onozuka

    Inventor: Iji Onozuka

    Abstract: The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions. It is possible to produce a printed wiring board by using, as a core substrate, a metal-clad laminate containing the insulating substrate. Also, it is possible to produce a semiconductor device by mounting a semiconductor element onto the printed wiring board.

    Abstract translation: 本发明提供:能够充分地减少或防止半导体器件的负翘曲的绝缘基板或覆金属层压板; 使用绝缘基板或覆金属层压板的印刷线路板; 和半导体器件。 绝缘基板由包括一个或多个纤维基材层和两个或更多个树脂层的层压体的固化产物组成,其中两侧的最外层是树脂层。 纤维基材层中的至少一个相对于基准位置移动到其相对侧的第一侧或第二侧,即绝缘基板的总厚度等于数量的分割位置 的纤维基材层和具有厚度的每个分割区域进一步等分二分。 纤维基材层不向不同方向移动。 可以通过使用包含绝缘基板的覆金属层压板作为芯基板来制造印刷线路板。 此外,可以通过将半导体元件安装到印刷线路板上来制造半导体器件。

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