公开(公告)号：US5371324A

公开(公告)日：1994-12-06

申请号：US980700

申请日：1992-11-24

Applicant: Toshiaki Kanno ,  Hidenori Yamanashi ,  Tsuneyuki Horiike

Inventor： Toshiaki Kanno ,  Hidenori Yamanashi ,  Tsuneyuki Horiike

IPC: H01B5/02 ,  H01B7/00 ,  H01B7/08 ,  H05K1/00 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K1/09 ,  H01B7/0018 ,  H01B7/0838 ,  H05K1/0393 ,  H05K2201/0323 ,  H05K2201/0391 ,  H05K3/281

Abstract: A ribbon cable which is light weight, noncorrosive and exhibits excellent electrical conductivity properties. The cable includes a plurality of conductors, each composed of exfoliated graphite, which are arranged to extend parallel to each other and are sheathed with an electrical insulative material molded of a synthetic resin. In another embodiment, a conductor composed of exfoliated graphite and metallic conductors, each having an elongated rectangular cross-sectional shape, are arranged to extend parallel to each other. The conductors are sandwiched between opposing sheets of synthetic resin which are adhered to each other.

Abstract translation: 带状电缆重量轻，不腐蚀，表现出优异的导电性能。 电缆包括多个导体，每个导体由剥离的石墨组成，它们被布置为彼此平行地延伸并且用合成树脂模制的电绝缘材料包覆。 在另一个实施例中，由具有细长矩形横截面形状的由剥离石墨和金属导体组成的导体被布置为彼此平行地延伸。 导体夹在彼此粘附的相对的合成树脂片之间。

公开(公告)号：US4484038A

公开(公告)日：1984-11-20

申请号：US445694

申请日：1982-12-01

Applicant: William E. Dorman ,  Gary Brown

Inventor： William E. Dorman ,  Gary Brown

IPC: H01H13/702 ,  H01H13/703 ,  H01H13/785 ,  H05K1/00 ,  H05K1/09 ,  H01H13/70

CPC classification number: H01H13/785 ,  H01H13/702 ,  H05K1/09 ,  H01H13/703 ,  H01H2201/018 ,  H01H2201/024 ,  H01H2207/004 ,  H01H2207/04 ,  H01H2209/038 ,  H01H2209/06 ,  H01H2209/082 ,  H01H2213/01 ,  H01H2229/004 ,  H01H2229/012 ,  H01H2229/028 ,  H01H2231/004 ,  H05K1/0393 ,  H05K1/095 ,  H05K2201/0317 ,  H05K2201/0391

Abstract: A flexible membrane touch panel switch having contacts comprised of a first set of thin conductive metal film strips formed on a first layer, and of a second set of thin conductive metal film strips orthogonal to the first set and formed on a second layer, the second layer being spaced apart from and selectively movable into contact with the first layer, the panel further having silver conductive leads formed on each of the layers, each lead being integrally affixed at one end to, in electrical contact with, and extending from one of the strips for connection to external circuitry.

Abstract translation: 一种柔性膜触摸面板开关，其具有由形成在第一层上的第一组薄导电金属薄膜带和与第一组垂直并形成在第二层上的第二组薄导电金属薄膜条构成的触点，第二组 层与第一层间隔开并且选择性地可移动地与第一层接触，该面板还具有形成在每个层上的银导电引线，每个引线一端固定在一个端部上， 用于连接到外部电路的条。

公开(公告)号：US11832395B2

公开(公告)日：2023-11-28

申请号：US17132472

申请日：2020-12-23

Applicant: LANDA LABS (2012) LTD

Inventor： Benzion Landa ,  Naomi Elfassy ,  Stanislav Thygelbaum

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K7/02 ,  H05K7/06 ,  H01L21/48 ,  H01L31/20 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0392 ,  B41M5/44 ,  B41M5/392 ,  B41M5/395 ,  B41M1/12 ,  H05K3/34 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

公开(公告)号：US10017133B2

公开(公告)日：2018-07-10

申请号：US15355149

申请日：2016-11-18

Applicant: YAZAKI CORPORATION

Inventor： Mitsunori Tsunoda ,  Gaku Ito ,  Tomoaki Sasaki ,  Shuji Kimura ,  Taku Furuta ,  Shoichi Nomura

IPC: B60R16/02 ,  H05K3/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/04 ,  H05K3/24

CPC classification number: B60R16/02 ,  B60R16/0215 ,  H05K1/0265 ,  H05K1/0284 ,  H05K1/181 ,  H05K3/043 ,  H05K3/045 ,  H05K3/125 ,  H05K3/247 ,  H05K3/26 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/0545

Abstract: An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.

公开(公告)号：US20180103544A1

公开(公告)日：2018-04-12

申请号：US15287563

申请日：2016-10-06

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey ,  Andrew L. Fassler

IPC: H05K1/03 ,  C09D183/04 ,  C09D5/24 ,  C08K7/00 ,  C08K3/08 ,  H01L23/538 ,  G06F1/16 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0393 ,  C08K3/08 ,  C08K7/00 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/011 ,  C09D5/24 ,  C09D183/04 ,  G06F1/1669 ,  H01L23/5386 ,  H01L23/5387 ,  H05K1/028 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/148 ,  H05K3/0014 ,  H05K3/285 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0391 ,  H05K2203/0776

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

公开(公告)号：US09942990B2

公开(公告)日：2018-04-10

申请号：US15245361

申请日：2016-08-24

Applicant: International Business Machines Corporation

Inventor： Brian L. Carlson ,  John R. Dangler ,  Roger S. Krabbenhoft ,  Kevin A. Splittstoesser

IPC: H05K3/02 ,  H05K3/26 ,  H01P3/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K1/09 ,  H05K3/38 ,  H05K3/06 ,  H05K1/03

CPC classification number: H05K3/26 ,  H01P3/02 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/06 ,  H05K3/064 ,  H05K3/382 ,  H05K3/46 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0391 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

公开(公告)号：US09833802B2

公开(公告)日：2017-12-05

申请号：US14736040

申请日：2015-06-10

Applicant: PULSE FINLAND OY

Inventor： Esa Kalistaja ,  Elli Galla ,  Dan Kuehler ,  Winthrop Childers

IPC: H05K1/00 ,  B05B12/04 ,  H05K3/12 ,  B05B17/04 ,  B05D1/28 ,  H05K1/11 ,  H05K3/14

CPC classification number: B05B12/04 ,  B05B17/04 ,  B05D1/28 ,  H05K1/111 ,  H05K3/12 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0245 ,  H05K2201/0391 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2203/1366 ,  H05K2203/1476

Abstract: A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.

公开(公告)号：US09814137B2

公开(公告)日：2017-11-07

申请号：US15135638

申请日：2016-04-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota Asai

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K3/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10

CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/038 ,  H05K1/09 ,  H05K3/108 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/099 ,  H05K2201/09909

Abstract: A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

公开(公告)号：US09795031B2

公开(公告)日：2017-10-17

申请号：US14763074

申请日：2014-12-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Song Song ,  Kazuyoshi Nagayama

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  G02F1/1345

CPC classification number: H05K1/0393 ,  G02F1/13452 ,  H05K1/0248 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K2201/0391 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

公开(公告)号：US20170188456A1

公开(公告)日：2017-06-29

申请号：US15133352

申请日：2016-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjin CHO ,  Hyeon Cheol PARK ,  Kwanghee KIM ,  Weonho SHIN ,  Daejin YANG

IPC: H05K1/09 ,  H01L51/52 ,  G06F3/047 ,  H05K1/02

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/047 ,  G06F2203/04102 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01B1/16 ,  H01L51/5206 ,  H01L51/5234 ,  H01L2251/301 ,  H01L2251/5338 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/0379 ,  H05K2201/0391 ,  H05K2201/09681 ,  H05K2201/10128

Abstract: A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.