公开(公告)号：US20040238923A1

公开(公告)日：2004-12-02

申请号：US10797971

申请日：2004-03-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Te-Haw Lee ,  Kaun-I Cheng ,  Yueh-Chiung Chang ,  Shih-Yao Liu ,  Kun-Ming Huang

IPC: H01L023/495

CPC classification number: H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A surface-mount-enhanced lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein a dam bar structure between any two neighboring lead frames of a lead frame module plate is formed with an indentation and at least a solder metal layer is applied on the bottom surface of the lead frame and the indentation. A singulation process is performed along the indentation to separate the lead frame module plate mounted with semiconductor chips and package body into a plurality of packages. Therefore, the indentation and the solder metal layer applied thereon can provide solder paste improved wettability and increased solder surface, while the semiconductor package with the lead frame is mounted on an external device via a surface-mount-technology, so as to prevent problems of signal transmission owing to separation of solder joint from solder open.

Abstract translation: 提出了一种表面贴装增强引线框架和一种用于制造具有引线框架的半导体封装件的方法，其中引线框架模块板的任何两个相邻引线框架之间的阻挡坝结构形成有凹陷，并且至少形成焊料 金属层被施加在引线框架的底面和压痕上。 沿着压痕执行单个处理以将安装有半导体芯片和封装体的引线框模块板分离成多个封装。 因此，通过表面安装技术将引线框架的半导体封装安装在外部装置上，因此，施加在其上的凹陷和焊料金属层可以提供焊膏改善的润湿性和增加的焊接表面，以防止 由于焊点与焊料的分离而引起的信号传输。

公开(公告)号：US20040113248A1

公开(公告)日：2004-06-17

申请号：US10730119

申请日：2003-12-09

Inventor： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

IPC: H01L021/66

CPC classification number: H01L24/49 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

Abstract translation: 提供了具有增强的可靠性的半导体器件，其具有安装多个半导体芯片的散热器，与半导体芯片电连接的多个内部引线，用于树脂模制多个半导体芯片和多个内部引线的成型体， 用于提供半导体芯片的各个电极和对应于其的内部引线之间的电连接的多根电线，以及连接到内部引线并暴露在模制体外部的宽的外部引线。 在位于模制体外部的外引线的各个部分中形成多个狭缝，以在外引线被抽取的方向上纵向延伸。 这实现了在安装MOSFET之后通过热应力等放置在外引线上的引线应力的降低，从而提高了MOSFET的可靠性。

公开(公告)号：US20030137036A1

公开(公告)日：2003-07-24

申请号：US10213760

申请日：2002-08-07

Inventor： Terence Quintin Collier

IPC: H01L023/02

CPC classification number: H01L24/83 ,  H01L23/49541 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a 3D bond. As disclosed, the layers may comprise leads, dice, bond pads, or other substantially planar semiconductor package surfaces.

Abstract translation: 公开了半导体封装和方法，其结合在含铅和非铅性多层封装的层中使用通孔。 通孔提供层之间的流体连通，使得结合材料在用于形成3D结合的层之间流动。 如所公开的，这些层可以包括引线，裸片，接合焊盘或其它基本上平面的半导体封装表面。

公开(公告)号：US06469907B1

公开(公告)日：2002-10-22

申请号：US09694540

申请日：2000-10-23

Applicant: Alex Faveluke ,  Walt Noll

Inventor： Alex Faveluke ,  Walt Noll

IPC: H05K702

CPC classification number: H05K5/065 ,  H05K1/144 ,  H05K1/147 ,  H05K3/202 ,  H05K3/361 ,  H05K3/4691 ,  H05K7/1417 ,  H05K7/1432 ,  H05K2201/09145 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2203/167

Abstract: Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is employed to fix or partially fix the location of the circuit board in the package. For this purpose, one of the power lead frame and the circuit board includes a male portion and the other of the power lead frame and the circuit board includes a complementary female portion for mechanically coupling the circuit board and the lead frame.

Abstract translation: 电源电路封装。 电路板和电源引线框架一起封装在模块中。 除了提供与电源电路的电连接之外，引线框还用于将电路板的位置固定或部分固定在封装中。 为此，电源引线框架和电路板中的一个包括阳部分，并且电源引线框架和电路板中的另一个包括用于机械地耦合电路板和引线框架的互补阴部分。

公开(公告)号：US06462424B1

公开(公告)日：2002-10-08

申请号：US09705735

申请日：2000-11-06

Applicant: Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

Inventor： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

IPC: H01L2348

CPC classification number: H01L23/49551 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

Abstract translation: 一种制造半导体器件的方法包括：器件本体产生步骤，电耦合引线和半导体芯片，并且通过用树脂封装封装半导体芯片来制造器件本体，使得引线的一部分从树脂封装件露出， 珩磨步骤，至少使用抛光溶液进行珩磨处理，所述抛光溶液至少相对于粘附在从树脂封装暴露的引线部分上的树脂闪光，蚀刻步骤，通过执行形成在引线上形成的不想要的堆叠层结构 在珩磨步骤之后的蚀刻工艺和镀层步骤，在蚀刻步骤之后对引线进行电镀处理以形成由软接合材料制成的镀层。 除了树脂闪光之外，珩磨步骤除去一部分不想要的堆叠层结构。

公开(公告)号：US6040623A

公开(公告)日：2000-03-21

申请号：US795056

申请日：1997-02-05

Applicant: Min Yu Chan ,  Jing Sua Goh

Inventor： Min Yu Chan ,  Jing Sua Goh

IPC: H01L23/495 ,  H05K1/02 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/49541 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Abstract translation: 一种用于半导体器件（12）的引线（10），包括带状部分（14），所述带状部分包括连接到所述半导体器件（12）的第一基本上水平的部分（18），大致垂直部分（20），连接到所述第一基本水平 以及连接到大致垂直部分（20）的第二基本上水平的部分（22），其中至少一个孔（16）设置在带状部分（14）中。 一种提供用于将半导体器件（12）连接到表面（24）的电触点的方法，包括以下步骤：从半导体器件（12）延伸至少一个引线（10）并对引线（10）进行开槽。

公开(公告)号：US5915994A

公开(公告)日：1999-06-29

申请号：US999262

申请日：1997-12-29

Applicant: Yoshitaka Sumida

Inventor： Yoshitaka Sumida

IPC: G11B7/26 ,  H01R43/02 ,  H05K1/18 ,  H05K3/34 ,  H01R13/66

CPC classification number: H05K3/3426 ,  H01R12/58 ,  H05K1/18 ,  H01R43/0256 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A wiring structure comprises a connector and an electromagnetic relay mounted on a printed circuit board. Connector terminals extend respectively to lead terminals of the electromagnetic relay. Through holes formed respectively through distal end portions of the connector terminals and, are aligned respectively with through holes in the printed circuit board in an overlying manner, and each of the lead terminals of the electromagnetic relay is passed through the associated mating pair of aligned through holes, and is fixed thereto by soldering.

Abstract translation: 布线结构包括安装在印刷电路板上的连接器和电磁继电器。 连接器端子分别延伸到电磁继电器的引线端子。 分别通过连接器端子的远端部分形成的通孔，并且分别与印刷电路板中的通孔对齐，电磁继电器的每个引线端子通过相关联的配对对 孔，并通过焊接固定。

公开(公告)号：US4736273A

公开(公告)日：1988-04-05

申请号：US911590

申请日：1986-09-25

Applicant: Bernard M. G. Vertongen ,  Andre M. Papoular

Inventor： Bernard M. G. Vertongen ,  Andre M. Papoular

IPC: H01L23/28 ,  H01L23/29 ,  H01L23/32 ,  H01L23/40 ,  H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K3/341 ,  H01L23/49562 ,  H01L24/97 ,  H05K2201/10166 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K3/305 ,  H05K3/3426 ,  H05K3/3468 ,  Y02P70/613

Abstract: A power semiconductor device for surface mounting includes an isolating body, a thermal dissipator and electrical connection pins. The pins and legs of the thermal dissipator extend in the direction of the lower surface of the body. During a surface mounting operation of the device on a substrate, a quantity of solder is enclosed by a capillary effect under the major part of the plate. Thus, a good electrical and thermal contact is obtained with a metallization of the substrate.

Abstract translation: 用于表面安装的功率半导体器件包括隔离体，散热器和电连接引脚。 散热器的销和脚沿主体的下表面方向延伸。 在器件在基片上进行表面贴装操作期间，焊盘的主要部分被毛细管作用所包围。 因此，通过衬底的金属化获得良好的电和热接触。

公开(公告)号：US4626963A

公开(公告)日：1986-12-02

申请号：US705498

申请日：1985-02-28

Applicant: Walter F. Speer

Inventor： Walter F. Speer

IPC: H05K3/34 ,  H05K9/00 ,  H05K5/04

CPC classification number: H05K3/3468 ,  H05K9/0039 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K3/3447 ,  Y10S174/35

Abstract: An apparatus is disclosed for wave soldering a printed circuit board having an RF shield member mounted on the component side of the board with tabs extending beyond the electrical conductor side of the printed circuit board. Holes provided in the shield tabs allow the solder wave to pass through the tab to reach contact pads immediately behind the tab and also to reduce splash back and excessive build up of the solder caused by the solder wave striking the tab. Use of the apparatus eliminates costly and time consuming hand soldering operations for the RF shield member.

Abstract translation: 公开了一种用于波导焊接印刷电路板的装置，该印刷电路板具有安装在板的部件侧上的RF屏蔽部件，其突出部延伸超过印刷电路板的电导体侧。 设置在屏蔽接头中的孔允许焊波通过突片以到达接头后面的接触垫，并且还减少由焊波引起的突起引起的反弹和焊料过度堆积。 使用该装置消除了RF屏蔽构件的昂贵且耗时的手工焊接操作。

公开(公告)号：US09155200B2

公开(公告)日：2015-10-06

申请号：US13926069

申请日：2013-06-25

Applicant: Interplex Industries, Inc.

Inventor： Jack Seidler

IPC: H01R9/00 ,  H05K3/00 ,  B23K35/02 ,  H01R43/02 ,  H05K3/34 ,  H01R12/57 ,  H01R12/70

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。