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    Battery provided with terminals
    51.
    发明授权
    Battery provided with terminals 有权
    电池提供端子

    公开(公告)号：US07416812B2

    公开(公告)日：2008-08-26

    申请号：US11508840

    申请日：2006-08-24

    Applicant: Akira Kishida

    Inventor： Akira Kishida

    IPC: H01M2/26 ,  H01M10/38 ,  H01M3/18

    CPC classification number: H01M2/1044 ,  H01M2/0222 ,  H01M2/30 ,  H05K1/182 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10856

    Abstract: An electrical apparatus for attaching a battery to a printed circuit board which includes a battery body containing terminals, a portion of each of the terminals defining a fixing portion, a circuit board containing conductive portions and at least one through hole formed therein, wherein the fixing portion of each of the terminals contains at least one engaging portion which lockingly engages the through holes formed in the circuit board or in the vicinity of the through holes and contains a contacting portion which contacts the conductive portion of the circuit board for electrically connecting the battery body to the conductive portion of the circuit board.

    Abstract translation: 一种用于将电池连接到印刷电路板的电气设备，该印刷电路板包括一个包含端子的电池体，每个端子的一部分限定一个固定部分，一个包含导电部分的电路板和形成在其中的至少一个通孔，其中固定 每个端子的部分包含至少一个接合部分，其与形成在电路板中的通孔或通孔附近锁定地接合，并且包含与电路板的导电部分接触的接触部分，用于电连接电池 主体到电路板的导电部分。

    Compliant pin
    52.
    发明申请
    Compliant pin 审中-公开
    符合标准

    公开(公告)号：US20080166928A1

    公开(公告)日：2008-07-10

    申请号：US11651793

    申请日：2007-01-10

    Applicant: Liang Tang

    Inventor： Liang Tang

    IPC: H01R13/42

    CPC classification number: H01R12/585 ,  H01R13/02 ,  H01R43/16 ,  H05K3/308 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10856

    Abstract: A pin for insertion into a hole includes a compliant zone having a first flex-beam and a second flex-beam, the first flex-beam being a predetermined distance from the second flex-beam. The pin further includes a lead-in zone extending from the compliant zone, wherein a width of the lead-in zone narrows to a tip.

    Abstract translation: 用于插入孔中的销包括具有第一弯曲梁和第二柔性梁的柔性区，所述第一柔性梁与第二弯曲梁成预定距离。 销还包括从柔顺区延伸的导入区，其中引入区的宽度变窄到尖端。

    Micro soldered connection
    54.
    发明授权
    Micro soldered connection 有权
    微焊接

    公开(公告)号：US06800545B2

    公开(公告)日：2004-10-05

    申请号：US10261727

    申请日：2002-10-01

    Applicant: Stuart D. Downes

    Inventor： Stuart D. Downes

    IPC: H01L2144

    CPC classification number: H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

    Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

    Abstract translation: 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定延伸的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

    Joint structure of electronic element
    55.
    发明申请
    Joint structure of electronic element 审中-公开
    电子元件接头结构

    公开(公告)号：US20040171315A1

    公开(公告)日：2004-09-02

    申请号：US10746192

    申请日：2003-12-26

    Applicant: Delta Electronics Inc.

    Inventor： Pei-Sheng Liao ,  Jui-Yuan Hsu ,  Bay Shao-Ru Su

    IPC: H01R013/42

    CPC classification number: H01R12/7023 ,  H01R12/7058 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/0311 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2201/10856 ,  H05K2203/167

    Abstract: A joint structure of electronic element for linking circuit board and electronic element is provided. The joint structure of an electronic element for being electrically connected to a circuit board has at least one slot positioned thereon. And, the joint structure of the electronic element includes: at least one terminal which has a curved portion including a deflected angle with a normal line of a plane of the circuit board, wherein when the joint structure of the electronic element is connected with the slot, the terminal produces an elastic stress through suffering a jostle from the slot so as to urge against the slot for forming an electrical connection therebetween.

    Abstract translation: 提供了用于连接电路板和电子元件的电子元件的接合结构。 用于电连接到电路板的电子元件的接合结构具有至少一个位于其上的槽。 并且，电子元件的接合结构包括：至少一个端子，其具有包括与电路板的平面的法线的偏转角度的弯曲部分，其中当电子元件的接合结构与槽 ，终端通过从槽中穿过约束而产生弹性应力，以便推动抵靠槽以在它们之间形成电连接。

    Micro soldered connection
    58.
    发明授权
    Micro soldered connection 有权
    微焊接

    公开(公告)号：US06483041B1

    公开(公告)日：2002-11-19

    申请号：US09438245

    申请日：1999-11-12

    Applicant: Stuart D. Downes

    Inventor： Stuart D. Downes

    IPC: H05K116

    CPC classification number: H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

    Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

    Abstract translation: 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定扩展的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

    I-channel surface-mount connector
    59.
    发明申请
    I-channel surface-mount connector 有权
    I通道表面贴装连接器

    公开(公告)号：US20020137404A1

    公开(公告)日：2002-09-26

    申请号：US10138139

    申请日：2002-05-02

    Inventor： Apurba Roy

    IPC: H01R004/02 ,  H05K003/34 ,  H01R043/02

    CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

    Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

    Abstract translation: 根据本发明，低阻抗表面安装连接器包括具有I形横截面的一定长度的圆柱形杆。 该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。 具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘 的第二。

    Solder-bonding structure and brushless motor having the same
    60.
    发明申请
    Solder-bonding structure and brushless motor having the same 失效
    焊接结构和具有相同的无刷电动机

    公开(公告)号：US20020047504A1

    公开(公告)日：2002-04-25

    申请号：US09920863

    申请日：2001-08-03

    Inventor： Hideyuki Takahashi

    IPC: H02K011/00 ,  H02K005/22

    CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

    Abstract: A bonding portion of a connector terminal includes embossed portions and a slit. Each embossed portion is formed by embossing the bonding portion in a thicknesswise direction of the bonding portion to provide an embossed recess on one of opposed sides of the bonding portion. Each embossed recess communicates opposed open ends of an elongated hole provided in a circuit board with each other when the bonding portion is inserted to a predetermined position in the elongated hole. The slit penetrates through the bonding portion. The slit extends over at least one of the opposed open ends of the elongated hole in the thickensswise direction of the circuit board when the bonding portion is inserted to the predetermined position in the elongated hole.

    Abstract translation: 连接器端子的接合部分包括压花部分和狭缝。 每个压花部分通过在接合部分的厚度方向上压接接合部分而形成，以在接合部分的相对侧之一上提供压花凹部。 当接合部分插入长孔中的预定位置时，每个压花凹槽将设置在电路板中的细长孔的相对开口端彼此连通。 狭缝穿过粘合部分。 当接合部分插入长孔中的预定位置时，狭缝在电路板的厚度方向上延伸到细长孔的相对开口端中的至少一个上。

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