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    Push-on terminal clip and assembly
    51.
    发明授权
    Push-on terminal clip and assembly 失效
    推式端子夹和组件

    公开(公告)号：US4422128A

    公开(公告)日：1983-12-20

    申请号：US290692

    申请日：1981-08-06

    Applicant: Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

    Inventor： Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

    IPC: H05K3/32 ,  H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/3447 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/34 ,  Y02P70/611

    Abstract: The lead of a T03 style transistor extends through a hole in a printed circuit board. A resilient connector is provided for connecting the transistor lead to a printed circuit conductor in a manner to allow dip soldering but avoiding stress on the lead which might break the glass seal on the transistor package. The connector is a spring clip having a U-shaped portion with a pair of aligned holes in the legs to grip the transistor lead, one of the legs extending into another U-shaped portion which resiliently engages the circuit board conductor when assembled to the transistor lead. The connections are secured by dip soldering to complete the assembly.

    Abstract translation: T03型晶体管的引线延伸穿过印刷电路板中的一个孔。 提供弹性连接器，用于将晶体管引线连接到印刷电路导体，以允许浸焊，但避免引线上的应力，这可能会破坏晶体管封装上的玻璃密封。 连接器是具有U形部分的弹簧夹，其中在腿中具有一对对齐的孔以夹持晶体管引线，其中一个腿延伸到另一个U形部分中，该U形部分在组装到晶体管时弹性地接合电路板导体 铅。 连接通过浸焊固定，以完成组装。

    CONTACT COMPONENT AND SEMICONDUCTOR MODULE
    56.
    发明申请
    CONTACT COMPONENT AND SEMICONDUCTOR MODULE 有权
    联系组件和半导体模块

    公开(公告)号：US20150340333A1

    公开(公告)日：2015-11-26

    申请号：US14817894

    申请日：2015-08-04

    Applicant: FUJI ELECTRIC CO., LTD.

    Inventor： Makoto ISOZAKI

    IPC: H01L23/00

    CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L23/49844 ,  H01L2224/13011 ,  H01L2224/13017 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05K3/3426 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014

    Abstract: A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.

    Abstract translation: 适于焊接到设置在半导体模块的绝缘基板上的金属区域上的接触部件包括：圆筒部; 用于安装外部端子的中空孔; 以及形成在所述圆筒部的下端部并且具有大于所述圆筒部的外径的直径的凸缘。 适于焊接的凸缘的端面包括平坦的底表面和从平坦底表面中的圆柱形部分的内圆周边缘延伸到凸缘的外圆周边缘的凹部。 圆筒部包括在其下端的内侧的切口部。

    Device, apparatus, method and assembly for coupling an electrical component with a circuit board
    58.
    发明申请
    Device, apparatus, method and assembly for coupling an electrical component with a circuit board 有权
    用于将电气部件与电路板耦合的装置，装置，方法和组件

    公开(公告)号：US20060193118A1

    公开(公告)日：2006-08-31

    申请号：US11066877

    申请日：2005-02-25

    Applicant: Mudasir Ahmad ,  Mason Hu ,  Robert Pattison ,  David Popovich

    Inventor： Mudasir Ahmad ,  Mason Hu ,  Robert Pattison ,  David Popovich

    IPC: H05K7/08

    CPC classification number: H05K3/308 ,  H01R12/523 ,  H01R13/187 ,  H05K2201/1059 ,  H05K2201/10916

    Abstract: A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability and reworkability while minimizing wear and the possibility of resizing and damage. The device includes a sleeve for coupling with a component pin, which encloses the pin and further couples to a conductive barrel interconnecting multiple PCB layers. The sleeve conforms upon insertion within the barrel to its contour. A flange at an end of the sleeve deters over-insertion. The coupling so formed can be gas-tight.

    Abstract translation: 描述了一种用于可拆卸地将电气部件与PCB连接的装置，装置和印刷电路板组件，其提供足够的机电能力，对相关加热，部件可移除性，可替换性和可再加工性相对不敏感，同时最小化磨损和调整尺寸和损坏的可能性 。 该装置包括用于与部件销耦合的套筒，其包围销并进一步耦合到互连多个PCB层的导电筒体。 套筒在筒体内插入其轮廓。 套筒末端的凸缘阻止过度插入。 这样形成的联轴器可以是气密的。

    Solder-bearing contacts and method of manufacture thereof and use in connectors
    59.
    发明申请
    Solder-bearing contacts and method of manufacture thereof and use in connectors 有权
    焊接接点及其制造方法，用于连接器

    公开(公告)号：US20050109524A1

    公开(公告)日：2005-05-26

    申请号：US10922789

    申请日：2004-08-19

    Applicant: Joseph Cachina ,  James Zanolli ,  Jack Seidler

    Inventor： Joseph Cachina ,  James Zanolli ,  Jack Seidler

    IPC: H05K3/34 ,  H05K5/00

    CPC classification number: H05K3/3426 ,  H05K2201/10916 ,  H05K2201/10984 ,  Y02P70/613

    Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

    Abstract translation: 在一个方面，提供表面安装触点用于附接到电路板等。 触点包括细长的导电销，其具有第一端和相对的第二端。 预成型的热可再流动材料附接到销的一端，并且导电定位器构件围绕销在其第一和第二端之间并且邻近导电定位构件的位置。 在一个实施例中，定位器构件为圆柱形环的形式，围绕销延伸。

    Solderable electrical connection element with a solder deposit
    60.
    发明申请
    Solderable electrical connection element with a solder deposit 有权

    公开(公告)号：US20020001997A1

    公开(公告)日：2002-01-03

    申请号：US09867819

    申请日：2001-05-31

    Inventor： Bernhard Reul

    IPC: H01R004/24 ,  H01R004/26 ,  H01R011/20

    CPC classification number: H01R43/0235 ,  H01R4/022 ,  H01R4/187 ,  H01R4/2495 ,  H05K3/363 ,  H05K2201/1034 ,  H05K2201/10916 ,  H05K2203/1189

    Abstract: According to the invention, a metal insertion piece (6) is provided in a solderable electrical connection element (1) with a thin support sheet (2), at least one metal conductor (3) and at least one free contact face (5), which may be joined to an associated connection face (11) of another component (12), by means of a soldered joint that can be made using a solder deposit (9), which metal insertion piece (6) passes through the connection element (1) and the support sheet (2) respectively in the region of the contact face (5) and is securely joined to this support sheet, which serves as a base for the solder deposit (9). Preferably, the insertion pieces (6) may be derived from conventional crimp attachments. They may also be used for mechanically fastening both the solder deposit (9) and an electrical conductor to the support sheet (2).

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