公开(公告)号：US20140036116A1

公开(公告)日：2014-02-06

申请号：US13727454

申请日：2012-12-26

Applicant: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： SHU-SHENG PENG ,  WEN-CHANG CHEN ,  LI-MIN LIU ,  YU-TSAN CHENG ,  WEN-HSIUNG CHEN ,  SHIN-WEN CHEN ,  YONG LI

IPC: H04N5/335 ,  H05K1/02

CPC classification number: H04N5/335 ,  H04N5/2257 ,  H05K1/0215 ,  H05K1/0277 ,  H05K1/189 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.

Abstract translation: 柔性印刷电路板（FPCB）组件包括FPCB，电介质层，加强件和导电粘合剂层。 FPCB包括位于FPCB的表面上的表面和导电层。 导电层包括电路部分和连接到电路部分的接地部分。 电路部分被电介质层完全覆盖，并且接地部分暴露在电介质层的外部。 导电粘合剂位于加强件上，并包括第一粘合部分和第二粘合部分。 第二粘合部分的厚度大于第一粘附部分。 第二粘附部分和第一粘合部分之间的厚度差基本上等于介电层的厚度。 第一粘附部分粘附到电介质层，第二粘附部分粘附到接地部分。

公开(公告)号：US08604347B2

公开(公告)日：2013-12-10

申请号：US13075895

申请日：2011-03-30

Applicant: Hiroshi Kobayashi ,  Satoshi Emoto ,  Masayuki Kitajima ,  Toru Okada

Inventor： Hiroshi Kobayashi ,  Satoshi Emoto ,  Masayuki Kitajima ,  Toru Okada

IPC: H05K1/03 ,  H05K7/00 ,  H01L23/58

CPC classification number: H05K3/3436 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2009 ,  Y02P70/613

Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Abstract translation: 公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。 板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。 在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部 形成为与其中一个凹口成形其轮廓。

公开(公告)号：US20130296650A1

公开(公告)日：2013-11-07

申请号：US13936265

申请日：2013-07-08

Applicant: GIVEN IMAGING LTD.

Inventor： Zvika GILAD ,  Semion Khait ,  Chen Mann ,  Nathan Rubin

IPC: A61B1/04

CPC classification number: A61B1/041 ,  A61B1/051 ,  A61B5/6861 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10037 ,  H05K2201/10121 ,  H05K2201/2009 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/5313

Abstract: A flexible circuit board for being inserted into an in-vivo imaging device is provided. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope. An in-vivo imaging device which may enclose such a full-flexible circuit board is also provided.

Abstract translation: 提供了用于插入到体内成像装置中的柔性电路板。 柔性电路板可以包括通过柔性连接单元彼此连接的多个柔性安装单元。 灵活的安装单元可以能够以适于被包括在体内成像装置中的尺寸设置在其上的电气部件，该体内成像装置可插入体腔，例如胶囊型内窥镜。 还提供了可以包围这种全柔性电路板的体内成像装置。

公开(公告)号：US20130156442A1

公开(公告)日：2013-06-20

申请号：US13766908

申请日：2013-02-14

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Jing Hui Mu

IPC: H04B10/40 ,  B29D11/00

CPC classification number: H04B10/40 ,  B29D11/00 ,  G02B6/4201 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/042 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/2009 ,  Y10T29/49826

Abstract: A parallel optical transceiver module is provided that uses a folded flex circuit arrangement that reduces the footprint of the transceiver module while also providing the module with improved heat dissipation characteristics. In addition, the manner in which components are mounted on the flex circuit facilitates assembly of the module, reducing the overall cost of the module while improving manufacturing yield.

Abstract translation: 提供了一种并行光收发器模块，其使用折叠的柔性电路装置，其减小了收发器模块的占地面积，同时还为模块提供改进的散热特性。 另外，组件安装在柔性电路上的方式便于模块的组装，从而降低了模块的整体成本，同时提高了制造成品率。

公开(公告)号：US20130153283A1

公开(公告)日：2013-06-20

申请号：US13628317

申请日：2012-09-27

Applicant: Hosiden Corporation

Inventor： Hayato Kondo

IPC: H01B7/04

CPC classification number: H01B7/04 ,  H05K1/0225 ,  H05K1/0253 ,  H05K1/118 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: A plurality of linear conductors arranged in parallel with each other are covered from the upper and lower sides thereof by first and second insulator layers. On the upper side of the first insulator layer, a first adjustment material layer is formed with forming a predetermined gap relative to an end of the flat cable. And, at this gap, a reinforcement plate is provided. A shield member is provided for covering the upper side of the reinforcement plate and a portion of the upper side of the first adjustment material layer. From the upper side of the shield member to the upper side of the first adjustment material layer, a first shield layer is provided in such a manner to expose the upper side of the portion of the shield member where the reinforcement plate is present. A second insulator layer is configured to expose the conductors at the end of the flat cable. The shield member includes an impedance adjusting arrangement.

Abstract translation: 由彼此平行布置的多个线状导体由其上侧和下侧由第一和第二绝缘体层覆盖。 在第一绝缘体层的上侧，形成有相对于扁平电缆的端部形成预定间隙的第一调整材料层。 并且，在该间隙，设置有加强板。 设置有用于覆盖加强板的上侧和第一调整材料层的上侧的一部分的屏蔽构件。 从屏蔽部件的上侧到第一调整材料层的上侧，设置第一屏蔽层，以露出屏蔽部件的存在加强板的部分的上侧。 第二绝缘体层被配置为在扁平电缆的端部露出导体。 屏蔽构件包括阻抗调节装置。

公开(公告)号：US20130122749A1

公开(公告)日：2013-05-16

申请号：US13533754

申请日：2012-06-26

Applicant: Kiyomi Muro

Inventor： Kiyomi Muro

IPC: H01R24/60

CPC classification number: H04N5/64 ,  H05K1/0393 ,  H05K1/117 ,  H05K3/4691 ,  H05K2201/09727 ,  H05K2201/2009

Abstract: According to one embodiment, an electronic apparatus includes a housing, a connector, and a component connected to the connector. The component includes a first and third electrically conductive portion on a first surface, a second electrically conductive portion on a second surface, and a first and second cover portions. The second electrically conductive portion is connected to the first electrically conductive portion. The third electrically conductive portion is kept in contact with a terminal of the connector, and connected to the second electrically conductive portion. The first and second cover portions cover at least a part of the first and second electrically conductive portion.

Abstract translation: 根据一个实施例，电子设备包括壳体，连接器和连接到连接器的部件。 该部件包括在第一表面上的第一和第三导电部分，在第二表面上的第二导电部分，以及第一和第二盖部分。 第二导电部分连接到第一导电部分。 第三导电部分与连接器的端子保持接触，并连接到第二导电部分。 第一和第二盖部分覆盖第一和第二导电部分的至少一部分。

公开(公告)号：US20130072049A1

公开(公告)日：2013-03-21

申请号：US13624526

申请日：2012-09-21

Applicant: Panasonic Corporation

Inventor： Daisuke SATO ,  Mitsuru IIDA ,  Hiroshi IWANO ,  Tadahiro YAMAJI

IPC: H01R13/64 ,  H01R43/20

CPC classification number: H01R4/58 ,  H01R12/7052 ,  H01R12/771 ,  H01R12/79 ,  H05K1/117 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167 ,  Y10T29/49208

Abstract: In a connector assembly 1, male and female terminals 13 and 23 are positioned by inserting guide protrusions 15 into hole portions 25. Each of the guide protrusions 15 includes: a positioning portion 15a positioning male terminals 13 and female terminals 23; and a temporary positioning portion 15b which is smaller in diameter than the positioning portion 15a and is provided on the positioning portion 15a. The temporary positioning portion 15b is inserted through the hole portions 25 for temporary positioning of the male and female connectors 10 and 20 before the positioning portion 15a is inserted through the hole portions 25.

Abstract translation: 在连接器组件1中，通过将引导突起15插入到孔部25中来定位阳，阴端子13和23。每个引导突起15包括：定位部分15a，定位阳端子13和阴端子23; 以及直径比定位部15a小的临时定位部15b，并且设置在定位部15a上。 临时定位部分15b插入穿过孔部分25，用于在定位部分15a插入孔部分25之前临时定位阴连接器10和20。

公开(公告)号：US20130016289A1

公开(公告)日：2013-01-17

申请号：US13435389

申请日：2012-03-30

Applicant: Shinya HAYASHIYAMA ,  Noboru NISHIDA ,  Makoto TANAKA

Inventor： Shinya HAYASHIYAMA ,  Noboru NISHIDA ,  Makoto TANAKA

IPC: H04N5/655 ,  H05K7/00

CPC classification number: H04N5/655 ,  G06F1/20 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/2009 ,  Y02P70/613

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board, a component, and a reinforcing portion. The circuit board is in the housing and includes a first surface and a second surface opposite to the first surface. The component is on the first surface of the circuit board and includes a corner. The reinforcing portion is on the second surface of the circuit board and corresponds to the corner of the component.

Abstract translation: 根据一个实施例，电子设备包括壳体，电路板，部件和加强部分。 电路板在壳体中，并且包括与第一表面相对的第一表面和第二表面。 该部件位于电路板的第一表面上并且包括一个角部。 加强部分位于电路板的第二表面上并对应于部件的角部。

公开(公告)号：US20120326203A1

公开(公告)日：2012-12-27

申请号：US13603096

申请日：2012-09-04

Applicant: Kyong Jun KIM

Inventor： Kyong Jun KIM

IPC: H01L33/62

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

公开(公告)号：US08330054B2

公开(公告)日：2012-12-11

申请号：US12771500

申请日：2010-04-30

Applicant: Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

Inventor： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

IPC: H05K1/16

CPC classification number: G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

Abstract translation: 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个