公开(公告)号：US09437467B2

公开(公告)日：2016-09-06

申请号：US14253502

申请日：2014-04-15

Applicant: Rudolph Technologies, Inc.

Inventor： Troy Palm ,  Kevin J. Barr ,  Ralph P. Sowden ,  Matthew M. Laberge ,  Andrey Monjoseph ,  Brian Delsey ,  Emily Nordick ,  Richard Sobotka ,  Chetan Suresh

IPC: H01L21/68 ,  H01L21/677

CPC classification number: H01L21/68 ,  H01L21/67775

Abstract: A loadport for handling film frames is disclosed. The loadport is modular and substantially compatible with applicable standards regarding modular equipment. In particular, the load port is substantially interchangeable with loadports not adapted for handling film frames. The loadport has a compact shuttle for moving film frames and flexible alignment mechanisms for aligning film frames and cassettes of different configurations.

Abstract translation: 公开了一种用于处理胶卷框的装载口。 负载端口是模块化的，并且与模块化设备的适用标准基本兼容。 特别地，负载端口与不适于处理胶片框架的装载端口基本上可互换。 装载端口具有用于移动胶片框架的紧凑型梭子和用于对准不同配置的胶片框架和胶卷盒的柔性对准机构。

公开(公告)号：US20160238378A1

公开(公告)日：2016-08-18

申请号：US15142864

申请日：2016-04-29

Applicant: Rudolph Technologies, Inc.

Inventor： David S. Marx ,  David L. Grant

IPC: G01B11/22 ,  G01B11/06

CPC classification number: G01B11/22 ,  G01B11/0633 ,  G01B11/0675 ,  G01B2210/56

Abstract: A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).

Abstract translation: 一种用于直接测量包括蚀刻表面（82）和非蚀刻表面（84）的晶片（80）上的高纵横比蚀刻特征的深度的系统（10）。 系统（10）利用红外反射计（12），在优选实施例中，扫描激光器（14），光纤循环器（16），光电检测器（22）和组合准直仪（18）和物镜（20） ）。 从物镜（20），产生被施加到晶片（80）的未蚀刻表面（84）的聚焦入射光（23）。 从晶片（80）产生的反射光（25）通过反射计（12）处理并被施加到产生相应的数字数据信号（29）的ADC（24）。 数字数据信号（29）被应用于与软件（32）组合的计算机（30），其测量在显示器（34）上被观看的蚀刻特征的深度。

公开(公告)号：US20150277239A1

公开(公告)日：2015-10-01

申请号：US14433233

申请日：2013-10-02

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： James H. Greer ,  Michael H. Valois ,  J. Casey Donaher

IPC: G03F7/20

CPC classification number: G03F7/2026 ,  G03F7/2022 ,  G03F7/70066 ,  G03F7/70216 ,  G03F7/707 ,  G03F7/70733

Abstract: An apparatus (1100) for protecting at least a portion of a peripheral region of a photoresist-coated surface of a substrate from light exposure. The apparatus includes two or more movable blades (1102) and a drive assembly (1112, 1114) operably coupled to the movable blades. In response to at least one first drive force generated by the drive assembly, the movable blades translate such that the movable blades are disposed above at least a portion of the peripheral region. In response to at least one second drive force generated by the drive assembly, the movable blades translate such that the movable blades are not disposed above a portion of the peripheral region.

Abstract translation: 一种用于保护基材的光致抗蚀剂涂覆表面的外围区域的至少一部分的光暴露的装置（1100）。 该装置包括可操作地联接到可动叶片的两个或更多个可动刀片（1102）和驱动组件（1112,1114）。 响应于由驱动组件产生的至少一个第一驱动力，可移动刀片平移，使得可动刀片设置在周边区域的至少一部分上方。 响应于由驱动组件产生的至少一个第二驱动力，可移动刀片平移，使得可动刀片不设置在周边区域的一部分上方。

公开(公告)号：US09062859B2

公开(公告)日：2015-06-23

申请号：US13868710

申请日：2013-04-23

Applicant: Rudolph Technologies, Inc.

Inventor： Christopher Voges ,  Ajay Pai ,  Antony Ravi Philip ,  Tuan D. Le

IPC: F21V13/02 ,  G01N21/95

CPC classification number: F21V13/02 ,  G01N21/9503

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract translation: 公开了晶片边缘检查方法，其中成像装置捕获晶片边缘的至少一个图像。 可以分析至少一个图像以便识别边缘珠去除线。 具有扩散器的照明系统可以进一步用于拍摄图像。

公开(公告)号：US20140021970A1

公开(公告)日：2014-01-23

申请号：US13921057

申请日：2013-06-18

Applicant: Rudolph Technologies, Inc.

Inventor： Eric Endres ,  John T. Strom ,  Christian Kuwasaki ,  Christopher McLaughlin

IPC: G01R35/00

CPC classification number: G01R35/00 ,  G01R31/2846 ,  G01R31/2891

Abstract: A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.

Abstract translation: 在实际的晶圆测试电池条件下评估晶圆测试探针卡的系统和方法将晶圆测试电池组件集成到探针卡检测和分析过程中。 公开的实施例可以在探针卡检查和分析过程期间利用现有和/或修改的晶片测试单元组件，例如头板，测试头，信号传递系统和操纵器来模拟晶片测试单元动态。