公开(公告)号：US20190287892A1

公开(公告)日：2019-09-19

申请号：US15924697

申请日：2018-03-19

Applicant: TactoTek Oy

Inventor： Jarmo SÄÄSKI ,  Mikko HEIKKINEN ,  Tero HEIKKINEN ,  Mika PAANI ,  Jan TILLONEN ,  Ronald HAAG

IPC: H01L23/522 ,  H01L23/50 ,  H01L25/065 ,  H01L23/14 ,  H05K3/46

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US10251278B2

公开(公告)日：2019-04-02

申请号：US16123479

申请日：2018-09-06

Applicant: TACTOTEK OY

Inventor： Mikko Heikkinen ,  Jarmo Saaski

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/12 ,  H05K3/32 ,  H05K3/28

Abstract: A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity.

公开(公告)号：US20190064431A1

公开(公告)日：2019-02-28

申请号：US16155956

申请日：2018-10-10

Applicant: Tactotek Oy

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20190042030A1

公开(公告)日：2019-02-07

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo SAASKI ,  Jarkko TORVINEN ,  Pasi RAAPPANA ,  Mikko HEIKKINEN

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US20180295712A1

公开(公告)日：2018-10-11

申请号：US15811889

申请日：2017-11-14

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo Saaski

IPC: H05K1/02 ,  H05K3/12 ,  H05K3/28 ,  H05K1/11 ,  H05K3/40

Abstract: A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.

公开(公告)号：US09990455B1

公开(公告)日：2018-06-05

申请号：US15840549

申请日：2017-12-13

Applicant: TactoTek Oy

Inventor： Hasse Sinivaara ,  Tuomas Heikkilä ,  Antti Keränen

IPC: G06F17/50 ,  G05B19/4099

CPC classification number: G06F17/5072 ,  G05B19/4099 ,  G05B2219/45031 ,  G06F17/5018 ,  G06F17/5081 ,  G06F2217/02 ,  G06F2217/04 ,  G06F2217/06 ,  G06F2217/12

Abstract: An electronic arrangement for facilitating circuit layout design in connection with three-dimensional (3D) target designs, the arrangement including at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and other data. The at least one processor being configured, in accordance with the stored instructions, to cause: obtaining and storing information in a data repository hosted by the memory, receiving design input characterizing 3D target design to be produced from a substrate, determining a mapping between locations of the 3D target design and the substrate, and establishing and providing digital output comprising human and/or machine readable instructions indicative of the mapping to a receiving entity, such as a manufacturing equipment, e.g. printing, electronics assembly and/or forming equipment.

公开(公告)号：US09945700B2

公开(公告)日：2018-04-17

申请号：US15082059

申请日：2016-03-28

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: G01D11/28 ,  F21V23/04 ,  F21K9/60 ,  H01H13/83

CPC classification number: G01D11/28 ,  F21K9/60 ,  F21V23/04 ,  H01H13/83 ,  H01H2219/028 ,  H01H2219/039 ,  H01H2219/056 ,  H01H2219/06

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

公开(公告)号：US09915556B2

公开(公告)日：2018-03-13

申请号：US15082059

申请日：2016-03-28

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: G01D11/28 ,  F21V23/04 ,  F21K9/60 ,  H01H13/83

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20160345437A1

公开(公告)日：2016-11-24

申请号：US15158645

申请日：2016-05-19

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko TORVINEN

IPC: H05K1/18 ,  H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H05K1/02 ,  H01L31/02

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device

Abstract translation: 一种用于电子设备的多层结构，其具有用于容纳电子设备（204）的柔性基底膜（202）。 设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述 在所述至少一个电子部件（204）的顶部上的所述基底膜（202），所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）用热塑性材料（208）包覆成型。 本发明还涉及一种用于制造电子设备的多层结构的方法