公开(公告)号：US20090051369A1

公开(公告)日：2009-02-26

申请号：US11842914

申请日：2007-08-21

Applicant: Lior Kogut ,  Ming-Hau Tung ,  Sauri Gudlavalleti

Inventor： Lior Kogut ,  Ming-Hau Tung ,  Sauri Gudlavalleti

IPC: G01R27/26 ,  G01J3/46 ,  G02B5/08 ,  G06F19/00 ,  G01N27/00

CPC classification number: G02B26/0841 ,  B81B2201/047 ,  B81C99/0045 ,  G02B26/001

Abstract: A MEMS test device comprises a flexible beam spaced apart from an optical stack. The MEMS test device includes a reflective layer and a partially reflective layer, such that a change in the position of the MEMS test device can be observed without the use of an external interferometer. The flexible beam may be cantilevered or fixed at each end. The flexible beam may include a shoe suspended from the side of the beam facing the optical stack, to provide a fixed contact area. An array of MEMS test devices may be used to determine compliance, or to calculate adhesion forces.

Abstract translation: MEMS测试装置包括与光学堆叠间隔开的柔性梁。 MEMS测试装置包括反射层和部分反射层，使得可以在不使用外部干涉仪的情况下观察MEMS测试装置的位置的改变。 柔性梁可以在每一端悬臂或固定。 柔性梁可以包括从面向光学堆叠的梁的侧面悬挂的鞋，以提供固定的接触面积。 可以使用一系列MEMS测试装置来确定柔量，或计算附着力。

公开(公告)号：US20090025427A1

公开(公告)日：2009-01-29

申请号：US11839690

申请日：2007-08-16

Applicant: Ching-Cherng Sun ,  Shih-Hsin Ma ,  Tsung-Xian Lee

Inventor： Ching-Cherng Sun ,  Shih-Hsin Ma ,  Tsung-Xian Lee

IPC: C03B23/023

CPC classification number: B81C99/0085 ,  B81B2201/047

Abstract: A manufacturing method for micro components includes the steps of manufacturing a large component by molding and shaping a thermally contractible material; heating and cooling the large component, such that the size of the large component can be reduced by the contraction of the material to form a reduced component; duplicating the reduced component to obtain a mold; and manufacturing a further reduced component by the molding and shaping process of the mold. The manufacturing method simply requires the processes of duplicating the component, contracting the material with an equal contraction ratio, and preparing the mold, and thus the manufacturing method is simple, easy and fast. The method can overcome the shortcomings of the prior art, of which the precision and the freedom for the external design of the micro components cannot be controlled easily.

Abstract translation: 微型部件的制造方法包括以下步骤：通过模制和成形热收缩材料来制造大部件; 加热和冷却大部件，使得可以通过材料的收缩来减小大部件的尺寸以形成减少的部件; 复制还原组分以获得模具; 并通过模具的成型和成型工艺制造进一步减少的部件。 制造方法简单地要求复制部件，以等收缩比收缩材料，制备模具的过程，因此制造方法简单，容易和快速。 该方法可以克服现有技术的缺点，其中微组件的外部设计的精度和自由度不能容易地被控制。

公开(公告)号：US20090021884A1

公开(公告)日：2009-01-22

申请号：US12237681

申请日：2008-09-25

Applicant: Shunji Nakamura

Inventor： Shunji Nakamura

IPC: H02N2/04 ,  G02B26/08 ,  G01P15/00

CPC classification number: B81B3/0059 ,  B81B2201/018 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058

Abstract: A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

Abstract translation: 可移动装置同时能够将尺寸减小到亚微米级，更高的速度操作，简化的生产过程，低成本和更高的可靠性。 一种可移动装置，其具有底部电极和固定在基板上的基本导电层，碳纳米管的弹性轴，其底端固定在基本导电层上并竖立起来，顶部结构包括顶部电极， 底部电极并固定到弹性轴的顶端，其中当在底部电极和顶部电极之间施加电压时，顶部电极在弹性轴的弹性变形的允许范围内相对于底部电极移位。

公开(公告)号：US07476950B2

公开(公告)日：2009-01-13

申请号：US11352200

申请日：2006-02-13

Applicant: Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

Inventor： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

IPC: H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/058

Abstract: A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional joint. The first comb-tooth electrode includes a plurality of first electrode teeth each having a first conductor, an insulator and a second conductor laminated in the direction of the oscillating motion, where the first conductor and the second conductor are electrically connected with each other. The second comb-tooth electrode includes a plurality of second electrode teeth caused not to face the second conductor but to face the first conductor of the first electrode teeth during non-operation. The second electrode teeth are longer than the first conductor in the direction of the oscillating motion.

公开(公告)号：US07448273B2

公开(公告)日：2008-11-11

申请号：US10990178

申请日：2004-11-16

Applicant: Thomas W. Ives

Inventor： Thomas W. Ives

IPC: G01N9/18 ,  G11B23/00

CPC classification number: B81B3/0083 ,  B81B2201/0292 ,  B81B2201/047 ,  B81C2201/0157 ,  B82Y10/00 ,  G02B5/12 ,  G02B26/0833 ,  G11B9/1427 ,  G11B9/1481

Abstract: A low mass device is disclosed. The low mass device includes a body member defining a surface and a retroreflective pattern formed in the surface of the body member.

Abstract translation: 公开了一种低质量装置。 低质量装置包括限定表面的本体构件和形成在主体构件的表面中的回射图案。

公开(公告)号：US20080268620A1

公开(公告)日：2008-10-30

申请号：US12173739

申请日：2008-07-15

Applicant: Philip D. Floyd

Inventor： Philip D. Floyd

IPC: H01L21/20

CPC classification number: H01L27/0248 ,  B81B7/0012 ,  B81B2201/047 ,  G02B26/001

Abstract: A MEMS device such as an interferometric modulator includes an integrated ESD protection element capable of shunting to ground an excess current carried by an electrical conductor in the MEMS device. The protection element may be a diode and may be formed by depositing a plurality of doped semiconductor layers over the substrate on which the MEMS device is formed.

Abstract translation: 诸如干涉式调制器之类的MEMS器件包括集成的ESD保护元件，其能够将由MEMS器件中的电导体携带的过剩电流分流到地。 保护元件可以是二极管，并且可以通过在其上形成MEMS器件的衬底上沉积多个掺杂半导体层来形成。

公开(公告)号：US07441134B2

公开(公告)日：2008-10-21

申请号：US11533495

申请日：2006-09-20

Applicant: Arthur Piehl ,  James R. Przybyla ,  Adam L Ghozeil ,  Eric T. Martin

Inventor： Arthur Piehl ,  James R. Przybyla ,  Adam L Ghozeil ,  Eric T. Martin

IPC: G02B26/00 ,  G06F1/03

CPC classification number: G09G3/3466 ,  B81B3/0008 ,  B81B2201/047 ,  G02B1/11 ,  G02B26/001 ,  G09G2300/06

Abstract: An electronic device of an embodiment of the invention is disclosed that at least partially displays a pixel of a display image. The device includes a first reflector and a second reflector defining an optical cavity therebetween that is selective of a visible wavelength at an intensity. The device includes a mechanism to allow optical properties of the cavity to be varied such that the visible wavelength and/or the intensity are variably selectable in correspondence with the pixel of the displayable image. The device also includes one or more transparent deposited films, one or more absorbing layers, an integral micro-lens, and/or one or more anti-stiction bumps. The deposited films are over one of the reflectors, for self-packaging of the device. The absorbing layers are over one of the reflectors, to reduce undesired reflections. The integral micro-lens is over one of the reflectors, and the anti-stiction bumps are between the reflectors.

公开(公告)号：US20080239429A1

公开(公告)日：2008-10-02

申请号：US12058812

申请日：2008-03-31

Applicant: Thilo SANDNER

Inventor： Thilo SANDNER

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  B81B3/0021 ,  B81B2201/047 ,  B81B2203/058

Abstract: In a method of fabricating a micromechanical structure, first, a deflectably supported two-dimensional structure is formed in a substrate and, then, is arranged in a package such that an integrated micromanipulator is arranged between the package and the two-dimensional structure so as to effect a deflection of the two-dimensional structure out of a plane of the substrate.

Abstract translation: 在制造微机械结构的方法中，首先，在衬底中形成可偏转地支撑的二维结构，然后将其布置在封装中，使得集成显微操纵器布置在封装和二维结构之间，以便 以使二维结构偏离衬底的平面。

公开(公告)号：US07429334B2

公开(公告)日：2008-09-30

申请号：US11090778

申请日：2005-03-25

Applicant: Ming-Hau Tung ,  Manish Kothari ,  William J. Cummings

Inventor： Ming-Hau Tung ,  Manish Kothari ,  William J. Cummings

IPC: B29D11/00

CPC classification number: B81C1/00174 ,  B81B2201/047 ,  B81B2203/0181 ,  B81C1/00182 ,  B81C2201/0109 ,  G02B26/001

Abstract: Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

Abstract translation: 用于制造诸如干涉式调制器的MEMS器件的方法包括选择性地去除材料的牺牲部分以形成内部空腔，留下材料的剩余部分以形成柱状结构。 该材料可以被毯式沉积并选择性地改变以限定相对于其余部分可选择性地移除的牺牲部分。 或者，材料层可以横向凹入远离覆盖层中的开口。 这些方法可用于制造未释放和释放的干涉式调制器。

公开(公告)号：US20080226929A1

公开(公告)日：2008-09-18

申请号：US12128469

申请日：2008-05-28

Applicant: Wonsuk Chung ,  Steve Zee ,  Teruo Sasagawa

Inventor： Wonsuk Chung ,  Steve Zee ,  Teruo Sasagawa

IPC: B32B15/04

CPC classification number: B81C1/00801 ,  B81B2201/047 ,  B81C2201/014 ,  G02B26/001 ,  Y10T428/31678

Abstract: The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and/or template layer. The etch stop layer may include silicon-rich silicon nitride.

Abstract translation: 通过在牺牲层和电极之间采用蚀刻停止层来改善诸如干涉式调制器之类的MEMS器件的制造。 蚀刻停止可以减少对牺牲层和电极的不希望的过蚀刻。 蚀刻停止层也可以用作阻挡层，缓冲层和/或模板层。 蚀刻停止层可以包括富硅的氮化硅。