公开(公告)号：US20120009394A1

公开(公告)日：2012-01-12

申请号：US12831404

申请日：2010-07-07

Applicant: Jui-Hung CHENG

Inventor： Jui-Hung CHENG

IPC: B32B3/10 ,  B32B3/02 ,  B05D5/06 ,  B32B37/02 ,  B44C1/22

CPC classification number: B32B37/1292 ,  B32B2310/0806 ,  B32B2457/14 ,  C09J5/00 ,  C09J2201/28 ,  C09J2203/326 ,  H01L27/14618 ,  H01L27/14632 ,  H01L2924/0002 ,  Y10T428/24793 ,  Y10T428/24802 ,  H01L2924/00

Abstract: A bonding method and a bonding substrate are provided. The bonding substrate is applied to a silicon wafer having the same shape. The bonding method includes the following steps. Firstly, the optical glass substrate is processed to form a first alignment mark. Then, an adhesive layer is coated on a surface of the optical glass substrate. The adhesive layer on the surface of the optical glass substrate is partially removed, thereby defining an adhesive structure. According to the first alignment mark of the optical glass substrate and a second first alignment mark of the silicon wafer, alignment between the optical glass substrate and the silicon wafer is performed. Afterwards, the optical glass substrate and the silicon wafer are bonded together through the adhesive structure.

Abstract translation: 提供接合方法和接合基板。 将接合基板施加到具有相同形状的硅晶片。 接合方法包括以下步骤。 首先，对光学玻璃基板进行处理，形成第一对准标记。 然后，在光学玻璃基板的表面上涂布粘合剂层。 部分去除光学玻璃基板表面上的粘合层，从而限定粘合剂结构。 根据光学玻璃基板的第一对准标记和硅晶片的第二第一对准标记，进行光学玻璃基板与硅晶片的对准。 之后，光学玻璃基板和硅晶片通过粘合剂结构结合在一起。

公开(公告)号：US08084124B2

公开(公告)日：2011-12-27

申请号：US12775099

申请日：2010-05-06

Applicant: Michael Hannington

Inventor： Michael Hannington

IPC: B32B7/12 ,  D02G3/00

CPC classification number: C09J7/38 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/32 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2902

Abstract: This invention relates to an adhesive article which provides air egress. Air egress is provided by supplying a route, such as areas of no initial adhesion for the air to flow out from under the construction. The invention relates to an adhesive article comprising a facestock having a front surface and a back surface, a continuous layer of adhesive having an upper surface and a lower surface wherein the upper surface of the adhesive layer is adhered to the back surface of the facestock, and a plurality of spaced-apart non-adhesive material which is in contact with the lower surface of the adhesive layer. These articles have usefulness as industrial graphics images, as well as decorative coverings, etc. The articles provide air egress and optionally repositionability and slideability.

Abstract translation: 本发明涉及提供空气出口的粘合剂制品。 通过提供路径来提供空气出口，例如没有初始粘合的区域，空气从建筑物外部流出。 本发明涉及一种粘合制品，其包括具有前表面和后表面的面材，具有上表面和下表面的连续粘合剂层，其中粘合剂层的上表面粘附到面材的后表面， 以及与粘合剂层的下表面接触的多个间隔开的非粘合材料。 这些文章作为工业图形图像以及装饰性覆盖物等具有有用性。该制品提供空气出口和可选地重新定位和可滑动性。

公开(公告)号：US20110281084A1

公开(公告)日：2011-11-17

申请号：US12780700

申请日：2010-05-14

Applicant: Tim Ashwell

Inventor： Tim Ashwell

IPC: C09J7/02

CPC classification number: C09J7/20 ,  C09J2201/28 ,  Y10T428/24802

Abstract: A medical adhesive tape in which a number of bare spots are provided through the tape to vary the strength of the bond of the tape to a surface. The number of bare spots as well as their size and location can be varied to modify the adhesive strength with which the tape is held onto the patient.

Abstract translation: 一种医用胶带，其中通过带提供多个裸点以改变胶带与表面的粘结强度。 可以改变裸点的数量以及它们的尺寸和位置以改变将带固定在患者身上的粘合强度。

公开(公告)号：US20110214798A1

公开(公告)日：2011-09-08

申请号：US13102900

申请日：2011-05-06

Applicant: Norman C. Tracy ,  Charles R. Cornman ,  Zosimo D. Pamaran

Inventor： Norman C. Tracy ,  Charles R. Cornman ,  Zosimo D. Pamaran

IPC: E04F13/076 ,  B32B7/06 ,  B32B7/12 ,  B32B38/18

CPC classification number: E04F15/02155 ,  C09J7/21 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  C09J2400/143 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2467/006 ,  E04F13/0887 ,  E04F15/02188 ,  E04F15/187 ,  Y10T156/1031 ,  Y10T428/1414 ,  Y10T428/1476

Abstract: The tile installation system provides a system for installing an architectural covering material to a substrate surface utilizing a plurality of release sheets where each release sheet has a top side surface and a bottom side surface. A plurality of discrete adhesive substrate portions are positioned on the top side surface of the release sheet, wherein the top side surface of the release sheet has a stronger bonding affinity with the plurality of adhesive substrate portions than the bottom side surface.

Abstract translation: 瓦片安装系统提供了一种用于使用多个释放片材将建筑覆盖材料安装到基板表面的系统，其中每个隔离片具有顶侧表面和底侧表面。 多个离散的粘合剂基材部分位于剥离片的顶侧表面上，其中剥离片的顶侧表面与多个粘合剂基底部分的粘合亲和力比底侧表面强。

公开(公告)号：US20110189928A1

公开(公告)日：2011-08-04

申请号：US13050325

申请日：2011-03-17

Applicant: Hee Min SHIN ,  Cheol Ho JOH ,  Eun Hye DO ,  Ji Eun KIM ,  Kyu Won LEE

Inventor： Hee Min SHIN ,  Cheol Ho JOH ,  Eun Hye DO ,  Ji Eun KIM ,  Kyu Won LEE

IPC: B24B1/00 ,  B32B3/14 ,  C09J7/02

CPC classification number: H01L21/6835 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67005 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17 ,  Y10T428/215

Abstract: A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region.

Abstract translation: 提出了一种晶片安装带，晶片处理设备和使用晶片安装带用于晶片间隔操作的相关方法。 晶片安装带包括带体，第一粘合构件和第二粘合构件。 带体具有第一区域，第二区域和第三区域。 带体的第一区域用于设置在晶片上。 带体的第二区域沿着第一区域的周边限定。 带体的第三区域沿着第二区域的周边限定。 第一粘合剂是构件设置在第一区域。 第二粘合构件设置在第三区域。

公开(公告)号：US20110064916A1

公开(公告)日：2011-03-17

申请号：US12988415

申请日：2009-04-09

Applicant: Audrey A. Sherman ,  Jayshree Seth ,  Wendi J. Winkler

Inventor： Audrey A. Sherman ,  Jayshree Seth ,  Wendi J. Winkler

IPC: B32B38/10 ,  B29C37/02 ,  B32B3/10 ,  B32B37/12

CPC classification number: C09J7/0253 ,  B32B7/12 ,  B32B27/06 ,  B32B37/12 ,  B32B38/0004 ,  B32B38/06 ,  B32B38/10 ,  B32B2307/40 ,  B32B2367/00 ,  C09J7/203 ,  C09J7/22 ,  C09J7/255 ,  C09J7/38 ,  C09J133/00 ,  C09J133/08 ,  C09J2201/16 ,  C09J2201/28 ,  C09J2201/606 ,  C09J2203/334 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2467/005 ,  C09J2483/005 ,  Y10T156/10 ,  Y10T428/24612

Abstract: Methods of making cut adhesive articles are described. The methods involve: providing a crosslinked pressure sensitive adhesive layer disposed on a substrate, embossing a surface of the crosslinked pressure sensitive adhesive layer to form a microstructured crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and die cutting the microstructured crosslinked pressure sensitive adhesive layer.

Abstract translation: 描述制造切割粘合剂制品的方法。 所述方法包括：提供设置在基材上的交联压敏粘合剂层，对交联的压敏粘合剂层的表面进行压花以形成具有微结构化粘合剂表面的微结构交联压敏粘合剂层，并模切微结构交联压敏粘合剂 层。

公开(公告)号：US07892649B2

公开(公告)日：2011-02-22

申请号：US11222450

申请日：2005-09-08

Applicant: Audrey A. Sherman ,  Mieczyslaw H. Mazurek ,  Wendi J. Winkler ,  Erica J. Draheim ,  Larry A. Meixner

Inventor： Audrey A. Sherman ,  Mieczyslaw H. Mazurek ,  Wendi J. Winkler ,  Erica J. Draheim ,  Larry A. Meixner

IPC: B32B7/10

CPC classification number: C09J183/10 ,  C09J7/38 ,  C09J183/08 ,  C09J2201/28 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2483/00 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/31612 ,  Y10T428/31663

Abstract: An adhesive article comprising a first substrate having thereon an adhesive layer, wherein the adhesive layer comprises a cured adhesive composition of a multifunctional ethylenically unsaturated siloxane polymer; and the first substrate comprises a polymer film, paper, a metal film, glass, ceramic, or a combination thereof; and wherein the adhesive layer has a microstructured surface that is substantiously continuous, and wherein the microstructured surface forms an array or pattern. The adhesive article is used to make laminated articles that spontaneously wet, and when applied to a substrate, remain removable or repositionable, even after long periods of time. The adhesive composition may be used in transfer adhesive films, and in laminated articles suitable for use in optical applications.

Abstract translation: 一种粘合剂制品，包括其上具有粘合剂层的第一基材，其中所述粘合剂层包含多官能烯属不饱和硅氧烷聚合物的固化粘合剂组合物; 并且第一基板包括聚合物膜，纸，金属膜，玻璃，陶瓷或其组合; 并且其中所述粘合剂层具有非常连续的微结构化表面，并且其中所述微结构化表面形成阵列或图案。 粘合剂制品用于制造自发润湿的层压制品，并且当施加到基材上时，即使在长时间之后仍然可以移除或重新定位。 粘合剂组合物可用于转移粘合剂膜和适用于光学应用的层压制品中。

公开(公告)号：US20110014462A1

公开(公告)日：2011-01-20

申请号：US12922991

申请日：2009-03-17

Applicant: Toshimitsu Kanda

Inventor： Toshimitsu Kanda

IPC: B32B7/14

CPC classification number: C09J7/0207 ,  C09J7/38 ,  C09J2201/28 ,  G09F21/00 ,  G09F21/04 ,  G09F21/048 ,  Y10T428/28

Abstract: The easily applicable adhesive sheet of the invention is characterized by having a base sheet, and an adhesive layer which is provided on the base sheet and which has, in a surface portion thereof, a plurality of air passages having grooves opening on an end edge portion of the base sheet, wherein each air passage includes therein numerous island-like protrusions whose tops are flush with the surface of the adhesive layer, and the island-like protrusions are arranged such that such that any circle inscribed in the grooves defined by side walls of the air passage and those of the protrusions has a diameter of 5 to 90 μm at the level of the surface of the adhesive layer. The invention provides an easily applicable adhesive sheet which is smoothly applied to an adherend without formation of “blisters,” and which exhibits excellent appearance after application thereof to the adherend.

Abstract translation: 本发明的易粘合片的特征在于具有基片和粘合层，该粘合层设置在基片上，并且在其表面部分具有多个空气通道，所述多个空气通道具有在端部边缘部分上开口的凹槽 其中每个空气通道包括许多岛状突起，其顶部与粘合剂层的表面齐平，并且岛状突起被布置成使得内嵌在由侧壁限定的凹槽中的任何圆 的空气通道和突起的直径在粘合剂层的表面的水平处具有5至90μm的直径。 本发明提供了一种易于使用的粘合片，其平滑地施加到被粘物而不形成“起泡”，并且在施加到被粘物之后表现出优异的外观。

公开(公告)号：US20110014411A1

公开(公告)日：2011-01-20

申请号：US12922881

申请日：2009-03-17

Applicant: Shinji Hagiwara ,  Toshimitsu Kanda

Inventor： Shinji Hagiwara ,  Toshimitsu Kanda

IPC: C09J7/02 ,  B32B33/00 ,  B32B3/30 ,  B32B7/06

CPC classification number: C09J7/38 ,  C09J2201/28 ,  Y10T428/1476 ,  Y10T428/2457 ,  Y10T428/24612

Abstract: The present invention disclose a pressure-sensitive adhesive sheet having the adhesive layer on at least one surface of the substrate, characterized in that in particular the above adhesive layer has a number of trunk-like grooves which lead to the end of the above sheet, and a number of branch-like grooves with closed terminals which branch from the trunk-like grooves. This structure provides effects in that it can be applied easily and smoothly without retaining air when adhering to an adherend and additionally the appearance of the pressure-sensitive adhesive sheet is not damaged after adhering.

Abstract translation: 本发明公开了一种在基材的至少一个表面上具有粘合剂层的压敏粘合片，其特征在于，特别地，上述粘合剂层具有导致上述片材末端的多个躯干状凹槽， 以及多个具有从躯干状槽分支的封闭端子的分支状沟槽。 这种结构提供了这样的效果，即，当粘合到被粘物上时，可以容易且顺利地使用而不会留空，另外粘合后的粘合片的外观也不会受损。

公开(公告)号：US07857937B2

公开(公告)日：2010-12-28

申请号：US11950774

申请日：2007-12-05

Applicant: Laura Dellevigne ,  Jeffrey T. Sloat

Inventor： Laura Dellevigne ,  Jeffrey T. Sloat

IPC: B65C3/08

CPC classification number: C09J5/06 ,  C08G18/10 ,  C08G2170/20 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/40 ,  C09J2203/334 ,  C09J2475/00 ,  G09F3/10 ,  C08G18/307

Abstract: A process for affixing an insulating label to a container involves applying a thermoplastic hot-melt adhesive to a first edge of the label and applying a thermoplastic hot-melt adhesive and a thermosetting adhesive to a second edge of the label. The insulating label is applied to a container, and provides improved heat resistance, thereby reducing occurrences of delamination during subsequent heating of the container.

Abstract translation: 用于将绝缘标签固定到容器的方法包括将热塑性热熔粘合剂施加到标签的第一边缘，并将热塑性热熔粘合剂和热固性粘合剂施加到标签的第二边缘。 绝缘标签被施加到容器上，并且提供改善的耐热性，从而减少随后加热容器期间的分层现象。