Abstract:
The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.
Abstract:
The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.
Abstract:
An anisotropic conductive adhesive comprised of electrically conductive polymer particles that has a wide temperature usage range, resists corrosion, and is compressible to increase the surface area of the conductive polymer particles in contact with nearby electrical components. In some embodiments the adhesive is transparent or semi-transparent, enabling visible light inspection and ultraviolet light curing. The conductive polymer particles are available in particle size ranges with much smaller diameters than prior art inorganic conductive particles, enabling denser pitches.
Abstract:
Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.
Abstract:
A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
Abstract:
A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conduct metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
Abstract:
The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.
Abstract:
A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.
Abstract:
An anisotropic conductive film includes: an insulation region having a planer shape and containing an insulating filler at a first content rate; and a plurality of conductive particle holding regions arranged in the insulation region, the conductive particle holding regions holding conductive particles and containing the insulating filler at a second content rate lower than the first content rate, the conductive particle holding regions being arranged discretely in a planar direction of the insulation region. A method of making conductive connection between a first terminal arranged on a first member and a second terminal arranged on a second member includes: preliminarily tacking the anisotropic conductive film to the first member; holding the first and second members such that the first and second terminals face to each other across the preliminarily tacked anisotropic conductive film; pressing the first and second members to each other; and heating the anisotropic conductive film.
Abstract:
An electroconductive tape (10) is characterized in that an adhesive film (3) composed of an adhesive is provided only on the open space between threads of an electroconductive mesh fabric having a metallic coating on the surface, the metallic coating being exposed and not covered by the adhesive film (3) on both surfaces of the electroconductive mesh fabric; thermoplastic synthetic fiber monofilament thread is included in part of the threads of the electroconductive mesh fabric; a value M that is obtained by an Equation (1): M=[(B1+B2)−C]/(B1+B2) is within a range of 0.05 to 0.45 (where B1 is the average diameter of the monofilament in the thickness direction of the electroconductive tape at places other than at the crossing points, B2 is the average diameter of the thread that crosses the monofilament in the thickness direction of the electroconductive tape at places other than at the crossing points, and C is the thickness of the electroconductive tape at the crossing points where the monofilament crosses other thread).