公开(公告)号：US20050224961A1

公开(公告)日：2005-10-13

申请号：US11148890

申请日：2005-06-08

Applicant: Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

Inventor： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

IPC: H01L21/48 ,  H01L23/34 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

Abstract translation: 电子封装和形成方法。 提供具有第一和第二相对表面的导热层。 第一电介质层在加压下被层压在导热层的第一相对表面上，温度在最低温度T 1 1MIN和最高温度T 1MAX之间。 在层压之后，T 1MAX 3将第一介电层的延展性约束至少为D 1。 T 1MAX取决于D 1和在由第一介电层组成的第一电介质材料上。 在加压下将第二电介质层在导热层的第二相对表面上，在最低温度T 2 M 2 N 2和最大温度T 2 MAX之间的温度下层压。 在层压之后，T 2MAX 2将第二介电层的延展性约束为至少D 2。 T 2MAX取决于D 2和在由第二介电层组成的第二电介质材料上。

公开(公告)号：US20050208227A1

公开(公告)日：2005-09-22

申请号：US10983268

申请日：2004-08-11

Applicant: Eric Ries

Inventor： Eric Ries

IPC: C23C4/08 ,  C23C26/00 ,  C23C28/00 ,  H05K1/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K3/285 ,  C23C26/00 ,  H05K1/0259 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0329

Abstract: Tribocharging-reducing conformal coating are provided for a flexible circuit, which reduce tribocharge voltage of a coated flexible circuit to less than about 15V, preferably less than about 10 V. Coating formulations include at least about 1% of a polypyrrole. Flexible circuits having a tribocharge voltage of less than about 15V, preferably less than about a 10V comprise at least one polymeric dielectric substrate, and a conductive layer formed thereon including at least one conductive element such as a trace, bond pad and/or a lead device, and a layer of a conformal coating wherein the conformal coating comprising at least about 1% of a polypyrrole compound.

Abstract translation: 为柔性电路提供减少摩擦减小的保形涂层，其将涂覆的柔性电路的摩擦电压降低至小于约15V，优选小于约10V。涂覆制剂包括至少约1％的聚吡咯。 具有小于约15V，优选小于约10V的摩擦电荷电压的柔性电路包括至少一个聚合物电介质基板，并且其上形成的导电层包括至少一个导电元件，例如迹线，接合焊盘和/或引线 装置和一层保形涂层，其中保形涂层包含至少约1％的聚吡咯化合物。

公开(公告)号：US20050207114A1

公开(公告)日：2005-09-22

申请号：US10801515

申请日：2004-03-16

Applicant: Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

Inventor： Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

IPC: H05K1/02 ,  H05K3/42 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: A vent assembly (50) for an electronic control module (28) is provided. The vent assembly (50) may be adheringly coupled to a printed circuit board (38). The vent assembly (50) being adapted to prevent the ingress of moisture and permit the egress of certain gases.

Abstract translation: 提供了一种用于电子控制模块（28）的排气组件（50）。 通气组件（50）可以附着地联接到印刷电路板（38）。 排气组件（50）适于防止湿气进入并允许某些气体流出。

公开(公告)号：US20040112627A1

公开(公告)日：2004-06-17

申请号：US10311063

申请日：2002-12-13

Inventor： Katsutoshi Yamamoto ,  Hiroyuki Yoshimoto ,  Kazuo Ishiwari ,  Shinichi Yano

IPC: H01B007/00

CPC classification number: H05K1/0373 ,  C08L27/18 ,  C08L2205/02 ,  H01B3/445 ,  H05K1/024 ,  H05K2201/015 ,  H05K2201/0212 ,  C08L2666/04

Abstract: An insulating layer for high frequency signal transmission device having a low dielectric constant, low dielectric dissipation factor and improved end processability, and a material powder thereof are provided. A polytetrafluoroethylene mixed powder for insulation of a product for high-frequency signal transmission, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000null500,000 and a maximum peak temperature of 327null5null C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000null1,000,000 and a maximum peak temperature of 340null7null C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, and the mixed powder has evident peak temperatures of 327null5null C. and 340null7null C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter.

Abstract translation: 提供了具有低介电常数，低介电损耗因数和改进的端加工性的高频信号传输装置的绝缘层及其材料粉末。 一种用于高频信号传输产品绝缘的聚四氟乙烯混合粉末，其通过将低分子量聚四氟乙烯粉末和通过四氟乙烯的乳液聚合获得的高分子量聚四氟乙烯粉末混合而获得，其中低分子量聚四氟乙烯粉末具有数均分子量 分子量为1,000,000±500,000，最大峰值温度为327±5℃，在使用差示扫描量热仪得到的结晶熔融曲线上出现的吸热曲线中，高分子量聚四氟乙烯粉末的数均分子量为4,500,000 在使用差示扫描量热仪获得的结晶熔解曲线上出现的吸热曲线中，最大峰值温度为340±7℃，混合粉末的明显峰值温度为327±5℃，340± 7℃，出现吸热曲线 n通过使用差示扫描量热计获得的结晶熔解曲线。

公开(公告)号：US20040055503A1

公开(公告)日：2004-03-25

申请号：US10253942

申请日：2002-09-23

Inventor： Syed M. Hasan

IPC: C23C018/00 ,  C09K003/00 ,  H01B013/00

CPC classification number: H05K3/381 ,  C23C18/2033 ,  C23C18/2086 ,  C25D5/56 ,  H05K1/034 ,  H05K3/181 ,  H05K3/426 ,  H05K2201/015 ,  Y10S428/901 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A method and solution to activate and metallize the surface of a fluorocarbon material, suitable for circuit boards is disclosed. The surface of fluorocarbon materials is both hydrophobic and oleophobic, and highly inert and repellent to oils, dyes, adhesive and coatings. The method of the present invention makes such fluorocarbon materials wettable with metallizing solutions and chemicals, and also bondable with adhesives and coatings. The method comprises contacting said fluorocarbon surface with a mixture comprising a cyclic amide, a quaternary ammonium compound, a cationic or nonionic surfactant, a glycolether and an organic acid.

Abstract translation: 公开了一种激活和金属化适合于电路板的碳氟化合物材料的表面的方法和解决方案。 氟碳材料的表面是疏水性和疏油性，并且对油，染料，粘合剂和涂料具有高度惰性和驱避性。 本发明的方法使得这种碳氟化合物材料可以用金属化溶液和化学品润湿，并且还可与粘合剂和涂层粘合。 该方法包括使所述碳氟表面与包含环酰胺，季铵化合物，阳离子或非离子表面活性剂，乙二醇醚和有机酸的混合物接触。

公开(公告)号：US20040022012A1

公开(公告)日：2004-02-05

申请号：US10432817

申请日：2003-05-27

Inventor： Katsutoshi Yamamoto ,  Seigo Yamamoto ,  Shinichi Chaen ,  Jun Asano ,  Tomohisa Konishi

IPC: H02B001/00

CPC classification number: H05K1/0366 ,  B32B5/28 ,  B32B27/28 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/065 ,  H05K2203/1105

Abstract: This electrical insulating board 1 comprises a cloth substrate 3 and web layers 5. The web layers 5 made of fluororesin fibers and are stacked on both sides of the cloth substrate 3 and bonded there by entangling. In addition, to at least one side surface of web layers 5, heat treatment at a temperature of melting point of fluororesin fiber or more is applied under pressure.

Abstract translation: 该电绝缘板1包括布基材3和纤维网层5.网状层5由氟树脂纤维制成并堆叠在布基材3的两侧并通过缠结结合在那里。 此外，对于纤维网层5的至少一个侧表面，在加压下施加氟树脂纤维的熔点以上的温度下的热处理。

公开(公告)号：US20020197834A1

公开(公告)日：2002-12-26

申请号：US10161707

申请日：2002-06-05

Inventor： Koji Asakawa ,  Yasuyuki Hotta ,  Shigeru Matake ,  Toshiro Hiraoka

IPC: H01L021/20

CPC classification number: H05K3/10 ,  H05K1/034 ,  H05K3/0002 ,  H05K3/0082 ,  H05K3/107 ,  H05K3/185 ,  H05K3/422 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2203/056 ,  H05K2203/107 ,  H05K2203/1147 ,  Y10T29/49155 ,  Y10T29/49215

Abstract: Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.

Abstract translation: 公开了一种用于制造包括多孔基底，通孔和布线的复合构件的方法。 该方法包括将多孔基底中的第一区域和第二区域暴露于通过掩模的曝光光束，由曝光光束曝光的第二区域不大于第一区域的曝光的50％，曝光光束具有波长 由旋转半径表示的多孔基材的空隙的平均尺寸为1/20至10倍，并且分别通过将导电材料渗透到第一区域和第二区域中而形成通孔和布线。

公开(公告)号：US06417459B1

公开(公告)日：2002-07-09

申请号：US09744997

申请日：2001-02-21

Applicant: Hitoshi Kanzaki ,  Yasuhiko Ichino ,  Toshimitsu Tanii ,  Kouji Ohnishi

Inventor： Hitoshi Kanzaki ,  Yasuhiko Ichino ,  Toshimitsu Tanii ,  Kouji Ohnishi

IPC: H05K100

CPC classification number: D03D15/0011 ,  H05K1/0366 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2475 ,  Y10T442/2951 ,  Y10T442/2992

Abstract: A fluororesin-impregnated adhesive layer 7 such as PFA is formed on one face or both faces of a prepreg 1 in which a fluororesin-impregnated layer 3 such as PTFE is impregnated and held into E-glass cloth 2 that serves as a basic material of the prepreg. The prepreg has a (mass of 30 g/m2 or less, and is woven by filament bundles each of which is configured by 120 or less glass filaments. Copper foil 5 is placed on the fluororesin-impregnated adhesive layer 7 to form a predetermined conductor pattern on the surface, thereby producing a printed circuit board having a thickness of 0.2 mm or less. Therefore, the printed circuit board is excellent in dielectric characteristics, electrical insulation resistance between through holes, and its long-term reliability, and superior also in flexibility. Consequently, the printed circuit board is applicable to any use such as a high-frequency circuit.

Abstract translation: 在预浸料坯1的一面或两面上形成氟树脂浸渍的粘合剂层7，其中将氟树脂浸渍层3如PTFE浸渍并保持在用作基材的E玻璃布2中 预浸料 预浸料坯的质量为30g / m 2以下，由120根以下的玻璃纤维构成的丝束编织，在氟树脂浸渍粘合剂层7上配置铜箔5，形成规定的导体 从而制造厚度为0.2mm以下的印刷电路板，因此印刷电路板的介电特性优良，通孔间绝缘电阻优良，其长期可靠性优异， 因此，印刷电路板适用于高频电路等任何用途。

公开(公告)号：US06315856B1

公开(公告)日：2001-11-13

申请号：US09271912

申请日：1999-03-18

Applicant: Satoru Asagiri ,  Masayoshi Yamaguchi

Inventor： Satoru Asagiri ,  Masayoshi Yamaguchi

IPC: B32B3126

CPC classification number: H05K3/323 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10689 ,  H05K2203/0126 ,  H05K2203/013 ,  Y10T29/4913

Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using anisotropic conductive adhesive comprising a resin-based binder mixed with filler, the electronic component is mounted on the printed circuit board using the anisotropic conductive adhesive which shrinks and cures by heating so as to electrically and mechanically connect the leads and electrodes.

Abstract translation: 在使用包含与填料混合的树脂类粘合剂的各向同性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，将各向同性导电性粘合剂供给到印刷电路板上的电极 通过喷墨式粘合剂涂布装置。 另外，在使用各向同性导电性粘合剂包含导电性高分子材料的情况下，通过将电子部件和电极的引线连接在印刷电路板上而安装电子部件的方法中，各向同性导电性粘合剂通过印刷电路板上的电极供给 喷墨粘合剂涂布装置。 此外，在使用包含与填料混合的树脂类粘合剂的各向异性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，电子部件使用 各向异性导电粘合剂通过加热收缩和固化，以便电和机械地连接引线和电极。

公开(公告)号：US20010018985A1

公开(公告)日：2001-09-06

申请号：US09798897

申请日：2001-03-06

Inventor： Masayuki Kanechika ,  Hideki Urabe ,  Yoshio Kuriyama

IPC: H05K001/03

CPC classification number: H05K1/0242 ,  H05K3/06 ,  H05K3/143 ,  H05K3/146 ,  H05K3/381 ,  H05K3/429 ,  H05K2201/015 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A high-frequency circuit board free from variations in transmission impedance and having the desired characteristics is produced. A surface of a resin substrate is activated to form a roughened surface, and a thin-wall pattern of an electrically conductive metal is formed directly on the roughened surface of the resin substrate.

Abstract translation: 产生不具有传输阻抗变化并且具有期望特性的高频电路板。 激活树脂基板的表面以形成粗糙表面，并且直接在树脂基板的粗糙表面上形成导电金属的薄壁图案。