公开(公告)号：US20010002330A1

公开(公告)日：2001-05-31

申请号：US09768112

申请日：2001-01-23

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L021/44 ,  H01L021/46 ,  H01L021/50 ,  H01L023/48

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

公开(公告)号：US06177729B1

公开(公告)日：2001-01-23

申请号：US09303290

申请日：1999-04-03

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2348

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US6042894A

公开(公告)日：2000-03-28

申请号：US890342

申请日：1997-07-09

Applicant: Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

Inventor： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

IPC: C08J5/00 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24 ,  H05K3/10 ,  H05K3/32 ,  C08J7/04 ,  B05D5/00 ,  B05D1/36

CPC classification number: H01R13/2414 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H05K3/102

Abstract: An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Abstract translation: 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘着层并且填充与导电颗粒之间的粘合材料不相容的成膜树脂而产生的各向同性导电树脂薄膜材料仅通过该导电颗粒在膜厚度方向上具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。

公开(公告)号：US5770305A

公开(公告)日：1998-06-23

申请号：US534445

申请日：1995-09-27

Applicant: Shinji Terasaka

Inventor： Shinji Terasaka

IPC: G02F1/1345 ,  H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01R11/01 ,  H05K3/32 ,  H05K3/38 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01L2224/29499 ,  H01L2224/83101 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  Y10S428/901 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/2998 ,  Y10T428/31511

Abstract: In an anisotropic conductive film, ultraresilient alloy particles, playing the role of conductive particles, are dispersed in a resin. With this configuration, the ACF reduces line defects to occur on a liquid crystal display panel and attributable thereto to one-tenth.

Abstract translation: 在各向异性导电膜中，发挥导电粒子的作用的超微细合金粒子分散在树脂中。 采用这种结构，ACF减少了在液晶显示面板上发生的线缺陷，并将其归因于十分之一。

公开(公告)号：US5120665A

公开(公告)日：1992-06-09

申请号：US671472

申请日：1991-03-19

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC: H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US4999460A

公开(公告)日：1991-03-12

申请号：US432135

申请日：1989-11-06

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R4/04 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/323 ,  H05K3/361

Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接第一和第二电子部件的导电连接结构，每个具有以小间距布置的多个连接端子。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US4740657A

公开(公告)日：1988-04-26

申请号：US13904

申请日：1987-02-12

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

IPC: H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  H01B1/16 ,  H01R43/00

CPC classification number: H01R4/04 ,  H01B1/22 ,  H05K3/323 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  H05K3/361 ,  Y10T29/49194

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

公开(公告)号：US11937372B2

公开(公告)日：2024-03-19

申请号：US17357060

申请日：2021-06-24

Applicant: YALE UNIVERSITY

Inventor： Rebecca Kramer-Bottiglio ,  Shanliangzi Liu ,  Dylan Shah ,  Lina Mercedes Sanchez Botero

IPC: H01B1/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0393 ,  H01B1/02 ,  H05K1/0283 ,  H05K3/4635 ,  H05K2201/0233

Abstract: A biphasic composition comprises a quantity of liquid GaIn and a plurality of solid particles of Ga2O3 suspended in the quantity of liquid GaIn, the Ga2O3 particles having a median particle size between 8 μm and 25 μm, wherein the volumetric ratio of solid particles of Ga2O3 to liquid GaIn is between 0.4 and 0.7. A method of making a biphasic composition of GaIn, a method of making a stretchable circuit board assembly, and a stretchable circuit board assembly are also described.

公开(公告)号：US20160327826A1

公开(公告)日：2016-11-10

申请号：US15112263

申请日：2015-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: G02F1/1345 ,  H01L23/544 ,  H01L23/00 ,  H05K3/32 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01B1/22 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/1426 ,  H01L2924/381 ,  H05K1/181 ,  H05K3/323 ,  H05K3/325 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10734 ,  H05K2203/166 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/066 ,  H01L2924/01006 ,  H01L2924/069 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/06 ,  H01L2924/0615

Abstract: Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body including an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent containing conductive particles; wherein the conductive particles are regularly arranged; and wherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.

Abstract translation: 确保电子部件与电路基板的布线中的间距减小的电路基板与电子部件的电极之间的导通，并防止电子部件的电极端子之间的短路。 一种连接体，包括通过含有导电颗粒的各向异性导电粘合剂连接到电路基板的电子部件; 其中导电颗粒是规则排列的; 并且其中所述导电颗粒的粒径为所述电子部件的连接电极的高度的1/2或更小。

公开(公告)号：US20150208509A1

公开(公告)日：2015-07-23

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/14

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Abstract translation: 公开了一种部件安装结构，包括具有多个第一电极的第一物体，具有第二电极的电子部件的第二物体，将多个第一电极和对应的第二电极彼此接合的接合部，以及树脂 - 加强部分。 接头部分具有包括第一金属和树脂颗粒中的至少一个的芯，以及具有低熔点的第一金属和第二金属的金属间化合物层。 在第一和第二电极之间的部分中，树脂增强部分包括包括芯和金属间化合物的颗粒物质。 包含在该部分中的颗粒物质的量为0.1〜10体积％。