公开(公告)号：US20060062976A1

公开(公告)日：2006-03-23

申请号：US10995826

申请日：2004-11-24

Applicant: Seung Sohn ,  Hyo Shin

Inventor： Seung Sohn ,  Hyo Shin

IPC: B32B3/00 ,  B32B5/16

CPC classification number: B32B7/04 ,  H05K1/0233 ,  H05K1/024 ,  H05K1/162 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09309 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/256

Abstract: A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.

Abstract translation: 提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。 本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。 印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。 因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。

公开(公告)号：US20040235996A1

公开(公告)日：2004-11-25

申请号：US10444603

申请日：2003-05-23

Inventor： Jayesh Shah ,  Paul Morganelli ,  David Peard

IPC: C08L001/00

CPC classification number: C08K3/04 ,  C08J9/32 ,  C08J2203/22 ,  C08J2207/02 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/305 ,  H05K2201/0254 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A thermoplastic or thermosetting B-stageable or pre-formed film underfill encapsulant composition that is used in the application of electronic components to substrates. The composition comprises a resin system comprising thermoplastic or thermally curable resin, an expandable microsphere, a solvent, and optionally a catalyst. Various other additives, such as adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant may be dried or B-staged to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.

Abstract translation: 用于将电子部件应用于基材的热塑性或热固性B阶或预成型薄膜底部填充密封剂组合物。 该组合物包括包含热塑性或热可固化树脂，可膨胀微球，溶剂和任选的催化剂的树脂体系。 还可以根据需要添加各种其它添加剂，例如粘合促进剂，流动添加剂和流变改性剂。 底部填充密封剂可以被干燥或分级以在基材或组分上提供光滑和非粘性的涂层。 在替代实施例中，底部填充密封剂是预成形膜。 在两个实施方案中，可膨胀填充材料在施加较高温度时膨胀以在组件的所需部分中形成闭孔泡沫结构。

公开(公告)号：US20040048965A1

公开(公告)日：2004-03-11

申请号：US10649950

申请日：2003-08-28

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08K003/26 ,  C08K003/34 ,  C08K003/40 ,  C08K003/04

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula null1null, 1 wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2以上的整数，并且还含有至少一种选自具有 重均分子量为5000以上的填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度，低介电常数和介电损耗角正切的固化物。

公开(公告)号：US06419981B1

公开(公告)日：2002-07-16

申请号：US09620524

申请日：2000-07-20

Applicant: Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

Inventor： Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

IPC: B05D302

CPC classification number: B05D3/02 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: Methods for inhibiting abrasive wear of a fiber strand comprising at least one glass fiber by sliding contact with surface asperities of a solid object, comprising (a) applying a composition to at least a portion of a surface of at least one glass fiber of a glass fiber strand; (b) at least partially drying the composition to form a sized glass fiber strand having a residue of the composition upon at least a portion of the surface of the at least one class fiber; and (c) sliding at least a portion of the glass fiber strand to contact surface asperities of a solid object, the surface asperities having a hardness value which is greater than a hardness value of the at least one glass fiber, such that abrasive wear of the at least one glass fiber of the glass fiber strand by contact with the surface asperities of the solid object is inhibited by the inorganic solid lubricant particles.

Abstract translation: 通过与固体物体的表面粗糙度滑动接触来抑制包含至少一种玻璃纤维的纤维束的磨损磨损的方法，包括（a）将组合物施加到玻璃的至少一个玻璃纤维的至少一部分表面上 纤维束; （b）至少部分地干燥所述组合物以在所述至少一种类纤维的表面的至少一部分上形成具有所述组合物残基的尺寸的玻璃纤维线; 和（c）将所述玻璃纤维线的至少一部分滑动以接触固体物体的粗糙度，所述表面粗糙度的硬度值大于所述至少一种玻璃纤维的硬度值，使得所述玻璃纤维线的磨损 通过与固体物体的表面粗糙度接触的玻璃纤维线束的至少一个玻璃纤维被无机固体润滑剂颗粒抑制。

公开(公告)号：US06391082B1

公开(公告)日：2002-05-21

申请号：US09345813

申请日：1999-07-02

Applicant: Richard A. Holl

Inventor： Richard A. Holl

IPC: C22C105

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：US20020038582A1

公开(公告)日：2002-04-04

申请号：US09345813

申请日：1999-07-02

Inventor： RICHARD A. HOLL

IPC: C22C029/00

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5279895A

公开(公告)日：1994-01-18

申请号：US858511

申请日：1992-03-27

Applicant: Kenji Ogasawara ,  Keiko Kashihara ,  Shingo Yoshioka

Inventor： Kenji Ogasawara ,  Keiko Kashihara ,  Shingo Yoshioka

IPC: B32B27/04 ,  B32B27/18 ,  C08J5/24 ,  C08J9/32 ,  C08K7/16 ,  C08K7/28 ,  C08K9/00 ,  C08K9/04 ,  C08L101/00 ,  H01B3/30 ,  H05K1/03 ,  B32B3/26 ,  C08G73/10

CPC classification number: C08J5/24 ,  C08J9/32 ,  H01B3/306 ,  H05K1/0373 ,  C08J2379/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/068 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/252 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A polyimide composition is prepared with a polyimide containing minute hollow spherules made of a glass of a hydroxyl group content and having less than 0.5 mg/m.sup.2. A multilayer substrate for printed-wiring is prepared with this polyimide composition. The substrate possesses a low dielectric constant, dielectric dissipation factor and thermal expansion coefficient.

Abstract translation: 用聚酰亚胺制备聚酰亚胺组合物，该聚酰亚胺含有由羟基含量的玻璃制成的小于0.5mg / m 2的微小中空球。 用该聚酰亚胺组合物制备印刷线路用多层基片。 该基片具有低介电常数，介电损耗因子和热膨胀系数。

公开(公告)号：US5183972A

公开(公告)日：1993-02-02

申请号：US650137

申请日：1991-02-04

Applicant: Diana C. Duane ,  Eric L. Zilley ,  Robert C. Jordan

Inventor： Diana C. Duane ,  Eric L. Zilley ,  Robert C. Jordan

IPC: H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46

CPC classification number: H01L23/49866 ,  H01L23/145 ,  H01L23/5383 ,  H05K3/4647 ,  H05K3/4682 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/0254 ,  H05K2201/096 ,  H05K2203/0733 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/388

Abstract: A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

Abstract translation: 采用铜/环氧树脂结构制造的高密度高性能电路。 该电路非常适合于集成电路互连设备。 含芴环氧树脂可用于获得与铜/聚酰亚胺结构相比的某些材料和加工优点。 电路结构位于可以是陶瓷的衬底，诸如硅的半导体，或有利地，固化的环氧树脂。

公开(公告)号：US4634603A

公开(公告)日：1987-01-06

申请号：US725848

申请日：1985-04-22

Applicant: Alder R. Gruss ,  Theodore A. Shapiro

Inventor： Alder R. Gruss ,  Theodore A. Shapiro

IPC: B05D1/34 ,  B05D3/12 ,  B24C1/00 ,  H05K3/26 ,  H05K3/28 ,  B05D1/06

CPC classification number: H05K3/284 ,  B05D1/34 ,  B05D3/12 ,  B24C1/00 ,  H05K3/26 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2203/025 ,  H05K2203/1366

Abstract: A method of abrading and simultaneously coating at least one surface of an article, particularly a circuit board assembly. The method comprises introducing abrasive particles into the compressed gas supply of a spray gun. The resulting gas stream with entrained abrasive particles is transported to and emitted from at least one spray nozzle of the spray gun where it is directed to the surface of the article with a film-forming coating composition stream also directed to and emitted from at least one nozzle of the spray gun. The abrasive particles can be simultaneously sprayed along with the optional coating composition onto the surface (these abrasive particles being microballoons in the case of a circuit board assembly). The surface is abraded while the coating is being applied. The resulting coating is substantially free of abrasive articles and has good adherence to the surface. The abrasive-containing compressed gas stream cleans and abrades the surface of the article, thereby preparing the surface to receive a coating.

Abstract translation: 一种研磨并同时涂覆制品，特别是电路板组件的至少一个表面的方法。 该方法包括将磨料颗粒引入喷枪的压缩气体供应。 所得到的带有夹带的磨料颗粒的气流被运送到喷枪的至少一个喷雾喷嘴并从喷枪的喷射喷嘴喷射出去，在喷射喷嘴的喷嘴处被引导到制品的表面，成膜涂料组合物流也被引导至至少一个 喷枪喷嘴。 研磨颗粒可以与任选的涂料组合物同时喷射到表面上（在电路板组件的情况下，这些磨料颗粒是微球）。 涂层时表面磨损。 所得到的涂层基本上不含磨料制品，并具有良好的表面附着性。 含磨料的压缩气流清洗并磨损制品的表面，由此制备表面以接收涂层。