公开(公告)号：US09386696B2

公开(公告)日：2016-07-05

申请号：US14136004

申请日：2013-12-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichiro Banba ,  Yutaka Fukuda

IPC: H05K1/11 ,  H05K1/16 ,  G01R1/20 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46 ,  G01R3/00

CPC classification number: H05K1/115 ,  G01R1/203 ,  G01R3/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0269

Abstract: A multilayer ceramic substrate includes a ceramic element body including a plurality of stacked ceramic layers, a resistor including a resistance film disposed between the ceramic layers, and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film. The resistance film and the lead via conductor both contain, for example, Ni and Cu that constitute an alloy resistive material. A concentration of the Ni component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom.

Abstract translation: 多层陶瓷基板包括陶瓷元件体，该陶瓷元件体包括多个堆叠的陶瓷层，包括设置在陶瓷层之间的电阻膜的电阻器和在厚度方向上贯穿陶瓷层的引线通孔导体，并在第一端部连接到 电阻膜。 电阻膜和引线通孔导体都包含例如构成合金电阻材料的Ni和Cu。 导线通孔导体中的Ni成分的浓度在与电阻膜连接的第一端部具有比较高的梯度结构，并且从第一端部向与其相反的第二端部逐渐减小。

公开(公告)号：US09293384B2

公开(公告)日：2016-03-22

申请号：US13522218

申请日：2011-01-13

Applicant: Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

Inventor： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC: H01L23/15 ,  H05K7/20 ,  H05K1/00 ,  B32B33/00 ,  H01L23/13 ,  H01L35/32 ,  C04B35/587 ,  C04B37/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

Abstract translation: 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。

公开(公告)号：US20150296613A1

公开(公告)日：2015-10-15

申请号：US14646065

申请日：2013-11-13

Applicant: KYOCERA CORPORATION

Inventor： Takeshi Matsui ,  Katsura Hayashi

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09036

Abstract: According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.

Abstract translation: 根据本发明的一个方面，布线板包括无机绝缘层和设置在无机绝缘层的一个主表面的一部分上的导电层。 无机绝缘层的一个主表面的一部分包括在平面图中至少部分为圆形的多个第一凹部。 导电层的一部分进入多个第一凹部。 根据本发明的一个方面，可以获得能够减少导电层的断开并因此具有优异的电可靠性的布线基板。

公开(公告)号：US20150277629A1

公开(公告)日：2015-10-01

申请号：US14672221

申请日：2015-03-29

Applicant: TPK Universal Solutions Limited

Inventor： Kuo-Feng Kao ,  Sung-Chien Huang ,  Wee-Hong Leong ,  Shiang-Ting Wu

IPC: G06F3/044

CPC classification number: G06F3/044 ,  C09J9/02 ,  H03K17/962 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0269

Abstract: A capacitive touch-sensitive device includes a sensor electrode layer, a signal trace layer, a flexible circuit board and an electrically-conductive adhesive layer. The sensor electrode layer includes electrically isolated sensor lines. The signal trace layer includes electrically isolated signal lines, each having an outer terminal portion coupled to a respective one of the sensor lines. The flexible circuit board has isolated mutually bonding pads, each corresponding to the outer terminal portion. The electrically-conductive adhesive layer includes a plurality of zones, each having a first adhesive matrix and first conductors dispersed therein. The first conductors bridge the outer terminal portion to the bonding pad.

Abstract translation: 电容式触敏装置包括传感器电极层，信号迹线层，柔性电路板和导电粘合剂层。 传感器电极层包括电隔离的传感器线。 信号迹线层包括电隔离的信号线，每条信号线都具有耦合到相应传感器线之一的外部端子部分。 柔性电路板具有隔离的相互接合的焊盘，每个对应于外部端子部分。 导电粘合剂层包括多个区域，每个区域具有分散在其中的第一粘合剂基质和第一导体。 第一导体将外部端子部分桥接到接合焊盘。

公开(公告)号：US20150116964A1

公开(公告)日：2015-04-30

申请号：US14588614

申请日：2015-01-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoru Noda

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0347 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2203/0126 ,  H05K2203/0465 ,  H05K2203/085 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y02P70/611

Abstract: A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

Abstract translation: 嵌入部件的基板包括基板部分，嵌入式电子部件和树脂部分。 基板部分在内主表面上具有内电极。 嵌入式电子部件具有端子电极，并且通过粘附到各个端子电极和各个内部电极的焊接圆角安装到基板部分。 树脂部分堆叠在基板部分上，嵌入的电子部件被嵌入其中。 树脂部分包括无填料添加层和填料添加层。 无填料添加层从内主表面延伸至允许至少覆盖焊料圆角的高度。 填料添加层含有无机填料并且从与无填料添加层的界面延伸至至少允许嵌入式电子部件被覆盖的高度。

公开(公告)号：US20140353021A1

公开(公告)日：2014-12-04

申请号：US14285733

申请日：2014-05-23

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Hidetoshi YUGAWA

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09854 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/1476

Abstract: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

Abstract translation: 布线基板10具有：下布线导体1，层叠在下布线导体1上的上绝缘层2，底面是下布线导体1的通路孔5;以及与下布线 导体1并填充通孔5; 并且上绝缘层2包括顺序地层叠在下布线导体1上的第一树脂层2a和第二树脂层2b，通孔5在两个树脂之间的边界内的内壁的整个圆周上具有环形槽5a 层2a和2b，通孔导体3填充槽5。

公开(公告)号：US20140226290A1

公开(公告)日：2014-08-14

申请号：US14348428

申请日：2012-09-29

Applicant: KYOCERA CORPORATION

Inventor： Katsura Hayashi

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15321 ,  H05K1/056 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wiring substrate for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure including an electronic component mounted on the wiring substrate or the component embedded substrate. The wiring substrate includes a metal plate, and a wiring layer including a plurality of insulating layers and a conductive layer arranged on the plurality of insulating layers arranged on at least one principal surface of the metal plate. The plurality of insulating layers includes a first insulating layer to contact the principal surface of the metal plate and has a larger thermal expansion rate in the planar direction than the metal plate and a second insulating layer which is laminated on the first insulating layer to contact the first insulating layer and has smaller thermal expansion rate in the planar direction than the metal plate.

Abstract translation: 一种用于提高与电子部件的连接可靠性的布线基板，将嵌入部件结合到布线基板中的部件嵌入式基板，以及包括安装在布线基板或部件嵌入基板上的电子部件的封装结构。 布线基板包括金属板和布置层，该布线层包括布置在金属板的至少一个主表面上的多个绝缘层上的多个绝缘层和导电层。 多个绝缘层包括与金属板的主表面接触并且在平面方向上具有比金属板更大的热膨胀率的第一绝缘层和层压在第一绝缘层上以接触第二绝缘层的第二绝缘层 第一绝缘层，并且在平面方向上比金属板具有较小的热膨胀率。

公开(公告)号：US20140071639A1

公开(公告)日：2014-03-13

申请号：US13990378

申请日：2012-12-25

Applicant: Kazuhiko Honjo ,  Akito Iwasaki

Inventor： Kazuhiko Honjo ,  Akito Iwasaki

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/382 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2203/0307 ,  Y10T29/49165

Abstract: A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region.

Abstract translation: 柔性布线板包括电绝缘基材，其包括具有弯曲性的不可压缩构件和具有弯曲性的热固性构件; 形成有绝缘基材的第一布线和第二布线; 以及穿过电绝缘基材的通孔导体，并且将第一布线和第二布线彼此电连接。 通孔导体包括树脂部分和金属部分。 金属部分包括主要由Cu组成的第一金属区域; 主要由Sn-Cu合金构成的第二金属区域; 和主要由Bi组成的第三金属区域。 第二金属区域大于第一金属区域，大于第三金属区域。

公开(公告)号：US07887905B2

公开(公告)日：2011-02-15

申请号：US12324006

申请日：2008-11-26

Applicant: Beom Joon Cho ,  Jong Myeon Lee

Inventor： Beom Joon Cho ,  Jong Myeon Lee

IPC: B32B9/00

CPC classification number: B32B18/00 ,  C04B38/0022 ,  C04B2111/00844 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/252 ,  C04B35/10 ,  C04B38/0054 ,  C04B38/0675 ,  C04B38/068

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract translation: 提供了一种约束绿色，其包括第一约束层，其具有设置在陶瓷层叠体的顶表面和底表面中的一个上的表面，第一约束层包含第一无机粉末; 以及第二约束层，其设置在所述第一约束层的顶部并且包含第二无机粉末和飞灰。 约束生片用于确保陶瓷层压体的收缩较小，并改善脱脂特性。

公开(公告)号：US20090218123A1

公开(公告)日：2009-09-03

申请号：US12466604

申请日：2009-05-15

Applicant: Issey Yamamoto ,  Akihiko Kamada

Inventor： Issey Yamamoto ,  Akihiko Kamada

IPC: H01R12/06

CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K3/12 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/09781

Abstract: A multilayer interconnection board includes a plurality of laminated ceramic layers. Wiring electrodes are disposed on principal surfaces of the ceramic layers, and dot patterns are arranged around the wiring electrodes. The dot patterns are arranged such that the density distribution thereof is varied such that the ratio of the presence of the dot patterns in the vicinity of the wiring electrode is relatively large and the ratio of the presence is reduced as the distance from the wiring electrode increases.

Abstract translation: 多层互连板包括多个层压陶瓷层。 布线电极设置在陶瓷层的主表面上，并且点阵图形布置在布线电极周围。 点图案被布置为使得其密度分布变化，使得布线电极附近的点图案的存在比例相对较大，并且随着与布线电极的距离增加而存在的比例降低 。