中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1281 records (took 0.025 seconds)

    X-RAY OBSCURATION FILM AND RELATED TECHNIQUES
    61.
    发明申请
    X-RAY OBSCURATION FILM AND RELATED TECHNIQUES 有权
    X射线观察膜及相关技术

    公开(公告)号：US20140374627A1

    公开(公告)日：2014-12-25

    申请号：US14325670

    申请日：2014-07-08

    Applicant: Lockheed Martin Corporation

    Inventor： Stephen Gonya ,  Jesse Iannon

    IPC: G21F3/00

    CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

    Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

    Abstract translation: 包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案 检查。 干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。 金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

    ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD
    62.
    发明申请
    ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD 审中-公开
    电动多层印刷电路板

    公开(公告)号：US20140345912A1

    公开(公告)日：2014-11-27

    申请号：US14345436

    申请日：2012-08-17

    Applicant: Bernd Eifer ,  Jakob Tschritter

    Inventor： Bernd Eifer ,  Jakob Tschritter

    IPC: H05K1/02

    CPC classification number: H05K1/0216 ,  H05K1/0224 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09336

    Abstract: The invention relates to an electric multilayer printed circuit board which satisfies the PICMG specification EXP.O, comprising a first signal layer and a second signal layer. The first signal layer comprises at least one first conductive path (33) and a first shielding region. The second signal layer comprises at least one second conductive path (43) and a second shielding region. The at least one first conductive path (33) and the at least one second conductive path (34) can be arranged such that the paths cross in at least one crossing point K. The first conductive path (33) is arranged adjacently to the second shielding region at each point where the first conductive path does not cross a second conductive path (43), and each second conductive path (43) is arranged adjacently to the first shielding region at each point where the second conductive path does not cross a conductive path (33).

    Abstract translation: 本发明涉及一种满足PICMG规范EXP.O的电气多层印刷电路板，包括第一信号层和第二信号层。 第一信号层包括至少一个第一导电路径（33）和第一屏蔽区域。 第二信号层包括至少一个第二导电路径（43）和第二屏蔽区域。 可以布置至少一个第一导电路径（33）和至少一个第二导电路径（34），使得路径在至少一个交叉点K中交叉。第一导电路径（33）被布置成与第二导电路径 在第一导电路径不穿过第二导电路径（43）的每个点处的屏蔽区域，并且每个第二导电路径（43）在第二导电路径不交叉导电的每个点处与第一屏蔽区域相邻布置 路径（33）。

    Shield Film, Shielded Printed Wiring Board, And Method for Manufacturing Shield Film
    63.
    发明申请
    Shield Film, Shielded Printed Wiring Board, And Method for Manufacturing Shield Film 有权
    屏蔽膜，屏蔽印刷线路板，以及制造屏蔽膜的方法

    公开(公告)号：US20140326484A1

    公开(公告)日：2014-11-06

    申请号：US14360609

    申请日：2012-10-12

    Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

    Inventor： Hiroshi Tajima ,  Sirou Yamauchi ,  Kenji Kamino ,  Masahiro Watanabe

    IPC: H05K9/00 ,  H05K1/02

    CPC classification number: H05K9/00 ,  H05K1/0216 ,  H05K3/28 ,  H05K9/0084 ,  H05K9/0088 ,  H05K2201/0715 ,  Y10T29/49226

    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.

    Abstract translation: 为了提供一种屏蔽膜，其能够适当地屏蔽从屏蔽膜的一侧向另一侧前进的电场波，磁场波和电磁波，并且具有良好的透射特性，屏蔽印刷线路板和用于 制造屏蔽膜，以沉积的方式设置厚度为0.5μm至12μm的金属层3和各向异性的仅在厚度方向上导电的各向异性导电粘合剂层4， 磁场波和从屏蔽膜的一侧向另一侧前进的电磁波被适当地屏蔽。

    Connection using conductive vias
    64.
    发明授权
    Connection using conductive vias 有权
    使用导电通孔连接

    公开(公告)号：US08835226B2

    公开(公告)日：2014-09-16

    申请号：US13034787

    申请日：2011-02-25

    Applicant: Thomas Scott Morris ,  Ulrik Riis Madsen ,  Donald Joseph Leahy

    Inventor： Thomas Scott Morris ,  Ulrik Riis Madsen ,  Donald Joseph Leahy

    IPC: H01L21/60 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/552

    CPC classification number: H05K3/4038 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/1461 ,  H05K1/115 ,  H05K3/301 ,  H05K9/0024 ,  H05K2201/0715 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.

    Abstract translation: 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。 接下来，将电磁屏蔽材料施加到待屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。

    X-ray obscuration film and related techniques
    68.
    发明授权
    X-ray obscuration film and related techniques 有权
    X射线遮蔽膜及相关技术

    公开(公告)号：US08772745B1

    公开(公告)日：2014-07-08

    申请号：US13827297

    申请日：2013-03-14

    Applicant: Lockheed Martin Corporation

    Inventor： Stephen Gonya ,  Jesse Iannon

    IPC: B41M3/14

    CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

    Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

    Abstract translation: 包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案 检查。 干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。 金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

    Printed circuit boards including strip-line circuitry and methods of manufacturing same
    69.
    发明授权
    Printed circuit boards including strip-line circuitry and methods of manufacturing same 失效
    印刷电路板包括带状线路电路及其制造方法

    公开(公告)号：US08766104B2

    公开(公告)日：2014-07-01

    申请号：US13352909

    申请日：2012-01-18

    Applicant: Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    Inventor： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

    IPC: H05K1/16 ,  H05K1/18 ,  H05K3/46

    CPC classification number: H05K1/183 ,  H01P3/088 ,  H01P11/003 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/4694 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0969 ,  H05K2203/063 ,  Y10T29/49124

    Abstract: A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers.

    Abstract translation: 多层印刷电路板包括第一层堆叠和耦合到第一层堆叠的第二层堆叠。 第一层堆叠包括第一电绝缘层，第二电绝缘层和设置在第一和第二电绝缘层之间的第一导电层。 第二层包括第三电绝缘层和第二导电层。 第一层堆叠和/或第二层堆叠包括限定从其延伸的空隙的切口区域。 多层印刷电路板还包括与第一层堆叠的第一电绝缘层或第二层堆叠的第三电绝缘层相关联地设置的第一信号层，与第二层堆叠相关联地布置的第二信号层 第一层堆叠的第二电绝缘层，以及至少部分地设置在切除区域内并电耦合到第一和第二信号层的器件。

    Equalizer for loss-compensation of high-frequency signals generated in transmission channels
    70.
    发明授权
    Equalizer for loss-compensation of high-frequency signals generated in transmission channels 失效
    用于在传输通道中产生的高频信号的损耗补偿均衡器

    公开(公告)号：US08760238B2

    公开(公告)日：2014-06-24

    申请号：US13726259

    申请日：2012-12-24

    Applicant: Hon Hai Precision Industry Co., Ltd.

    Inventor： Chien-Hsun Chen ,  Po-Chuan Hsieh

    IPC: H04B3/14

    CPC classification number: H04B3/14 ,  H05K1/0222 ,  H05K1/0234 ,  H05K1/0245 ,  H05K1/025 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10022

    Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.

    Abstract translation: 用于补偿电子通信信号的传输损耗的均衡器包括电路板和补偿模块。 补偿模块包括一对输入引脚，一对输出引脚，第一和第二电阻器，第一和第二通孔以及一对微带。 当由输入引脚接收到由电路板发送的信号时，信号的第一部分从输出引脚直接输出，信号的第二部分被第一电阻反射并传输回输出引脚 输出，信号的第三部分被第二电阻反射并被发送回输出引脚以输出，使得均衡器的输出施加两级补偿。

Patent Agency Ranking