公开(公告)号：US08188829B2

公开(公告)日：2012-05-29

申请号：US12640041

申请日：2009-12-17

Applicant: Wataru Nakahori ,  Masaki Kan ,  Atsushi Yakuwa

Inventor： Wataru Nakahori ,  Masaki Kan ,  Atsushi Yakuwa

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/26 ,  H01F27/30 ,  H02M3/00 ,  H02M5/16

CPC classification number: H01F27/2804 ,  H01F27/22 ,  H01F27/306 ,  H05K1/144 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063

Abstract: A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 100 comprises a first coil substrate 110 having a primary transformer coil part 41; a second coil substrate 120, disposed on the first coil substrate 110, having a secondary transformer coil part 42; and a transformer core 130 for magnetically connecting the transformer coil parts 41, 42 to each other. The coil substrates 110, 120 are disposed on each other while being shifted from each other such that the transformer coil parts 41, 42 overlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates 110, 120. The transformer coil parts 41, 42 have a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substrates 110, 120 in the transmission direction A.

Abstract translation: 提供了增强散热并完全固定安装区域的线圈基板结构。 线圈基板结构100包括具有初级变压器线圈部分41的第一线圈基板110; 设置在第一线圈基板110上的具有次级变压器线圈部分42的第二线圈基板120; 以及用于将变压器线圈部分41,42彼此磁连接的变压器铁芯130。 线圈基板110,120彼此相对设置，使得变压器线圈部分41,42在基板厚度方向上看时彼此重叠。 这可以增加线圈基板110,120的散热面积。变压器线圈部件41,42具有比基板厚度方向所见的与透射方向A相交的方向B的宽度窄的透射方向A的宽度 。 这可以减小线圈基板110,120在传输方向A上的多层面积。

公开(公告)号：US08085545B2

公开(公告)日：2011-12-27

申请号：US12453720

申请日：2009-05-20

Applicant: Eun-Seok Song

Inventor： Eun-Seok Song

IPC: H05K7/00

CPC classification number: H05K1/0233 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/086 ,  H05K2201/09718 ,  H05K2201/09781 ,  H01L2924/00

Abstract: A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one electromagnetic wave inducing member may be provided to an electronic device to induce an electromagnetic wave applied to the electronic device. The electromagnetic wave filtering member may be provided to the electronic device to filter the electromagnetic wave induced by the at least one electromagnetic wave inducing member. Thus, the electromagnetic wave filtering member may remove the electromagnetic wave concentrated on the at least one electromagnetic wave inducing member, so that the electromagnetic wave applied to the electronic device may be effectively removed. As a result, circuits in the electronic device may be protected from the EMI.

Abstract translation: 用于阻挡电磁干扰（EMI）的结构可以包括至少一个电磁波感应构件和电磁波滤波构件。 可以将至少一个电磁波感应构件提供给电子设备以引起施加到电子设备的电磁波。 电磁波滤波构件可以设置在电子设备中，以对由至少一个电磁波诱导构件所引起的电磁波进行滤波。 因此，电磁波滤波构件可以去除集中在至少一个电磁波感应构件上的电磁波，从而可以有效地去除施加到电子装置的电磁波。 因此，可以保护电子设备中的电路不受EMI影响。

公开(公告)号：US20110266043A1

公开(公告)日：2011-11-03

申请号：US12986458

申请日：2011-01-07

Applicant: Takeshi UESUGI ,  Daisuke Fujisaki

Inventor： Takeshi UESUGI ,  Daisuke Fujisaki

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/086 ,  H05K2201/09181 ,  Y02P70/611

Abstract: It is an object of the invention to provide a substrate which allows visual confirmation of the joint state and improvement of reliability of the joint between the components and the substrate to be mounted. The substrate is configured to mount a component having a planer terminal and include a land subjected to solder joint with respect to the terminal of the component.A substrate includes notched portions formed by notching parts of the lands in the direction away from an end surface forming the space. The each land on the substrate includes a first land formed on the substrate and a second land formed of an end surface of the notched portion in the direction of thickness of the substrate. Therefore, visibility of parts of terminals of components is secured utilizing penetration of the notched portions at the time of soldering, so that the joint state of soldering can be visually confirmed.

Abstract translation: 本发明的目的是提供一种基板，其允许目视确认接合状态，并提高部件和要安装的基板之间的接头的可靠性。 基板被构造成安装具有平面端子的部件，并且包括相对于部件的端子经受焊接接头的台面。 衬底包括通过在远离形成空间的端面的方向上切割焊盘的部分而形成的切口部分。 衬底上的每个焊盘包括形成在衬底上的第一焊盘和沿着衬底的厚度方向由凹口部分的端面形成的第二焊盘。 因此，利用焊接时的切口部的穿透来确保部件的端子的可见性，从而能够目视确认焊接的接合状态。

公开(公告)号：US08031127B2

公开(公告)日：2011-10-04

申请号：US12280456

申请日：2007-03-28

Applicant: Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

Inventor： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

IPC: H01Q7/08

CPC classification number: G06K19/0723 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q1/2208 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/117 ,  H05K1/144 ,  H05K1/16 ,  H05K2201/086 ,  H05K2201/09309

Abstract: The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).

Abstract translation: 具有天线的半导体存储器模块包括具有连接端子（17）的布线板（11），该连接端子（17）与控制半导体元件（16）连接并布置在暴露于外壳（15）的表面的位置处，以及端子电极 （18），用于与控制半导体元件（16）连接并布置在外壳（15）中的天线连接; 安装在所述布线板（11）一侧的半导体存储元件（12）。 以及沿其外周形成在布线板（11）的另一侧的环状天线（13）和天线端子电极（20），布线基板（11）包括至少一个磁性体层（14） ）和用于天线连接的端子电极（18）与天线端子电极（20）连接。

公开(公告)号：US08018309B2

公开(公告)日：2011-09-13

申请号：US12256949

申请日：2008-10-23

Applicant: Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

Inventor： Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

IPC: H01F38/12

CPC classification number: H05K1/18 ,  H01L2924/0002 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10371 ,  Y10T29/4902 ,  H01L2924/00

Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.

Abstract translation: 为了提高具有能够辐射能量的暴露表面的功率器件的效率，在暴露表面和导电层之间设置屏蔽层。 屏蔽层使能量的至少一部分被引导回功率器件，从而基本上防止能量在导电层中引起涡流。 导电层由金属箔制成，以符合电磁能量泄漏规定。

公开(公告)号：US20110198723A1

公开(公告)日：2011-08-18

申请号：US13095317

申请日：2011-04-27

Applicant: Todd B. Myers ,  Nicholas R. Watts ,  Eric C. Palmer ,  Jui Min Lim

Inventor： Todd B. Myers ,  Nicholas R. Watts ,  Eric C. Palmer ,  Jui Min Lim

IPC: H01L29/92

CPC classification number: H01L21/76897 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/64 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/1902 ,  H05K1/115 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/06 ,  H05K3/4053 ,  H05K3/421 ,  H05K2201/086 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09663 ,  H05K2201/09763 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/09981 ,  Y10S257/916 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Abstract translation: 形成与通孔相关的器件的方法包括形成开口或通孔，并在通孔内形成至少一对导电通路。 还公开了一种在其中具有一对导电路径的通孔。

公开(公告)号：US20110140824A1

公开(公告)日：2011-06-16

申请号：US12705840

申请日：2010-02-15

Applicant: Wolfgang HERHOLD

Inventor： Wolfgang HERHOLD

IPC: H01F5/00

CPC classification number: H01F27/2804 ,  H01F2027/2809 ,  H05K1/0256 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/086

Abstract: A planar transformer suitable for intrinsically safe electronic circuits with a core, a first printed circuit board and a second printed circuit board. The first printed circuit board has a first winding and the second printed circuit board has a second winding. The planar transformer can be produced at a low cost and is compact, but is still suitable for connection to intrinsically safe operating circuits is implemented by at least one gap being asymmetrically split on the first printed circuit board and the second printed circuit board.

Abstract translation: 一种适用于具有芯的本安电子电路的平面变压器，第一印刷电路板和第二印刷电路板。 第一印刷电路板具有第一绕组，第二印刷电路板具有第二绕组。 平面变压器可以以低成本生产并且紧凑，但仍然适合于连接到本质安全的操作电路，通过在第一印刷电路板和第二印刷电路板上非对称地分开的至少一个间隙来实现。

公开(公告)号：US07940531B2

公开(公告)日：2011-05-10

申请号：US12622169

申请日：2009-11-19

Applicant: Mitsuhiro Watanabe

Inventor： Mitsuhiro Watanabe

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01F2027/2809 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/19103 ,  H01L2924/19105 ,  H02M3/00 ,  H02M3/155 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/10015 ,  H01L2924/00

Abstract: A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil.

Abstract translation: 一种DC-DC转换器，包括具有通过连接多条导体线构成的层叠线圈的软磁性多层基板和包括开关装置和控制电路的半导体集成电路装置， 磁性，多层基板; 该半导体集成电路器件包括输入端子，输出端子，用于控制开关器件的导通/截止的第一控制端子，用于可变地控制输出电压的第二控制端子和多个接地端子; 所述软磁性多层基板包括形成在第一主表面上的第一外部端子，形成在第一主表面上和/或附近层上的第一连接线，形成在多层基板的侧表面之间的第二连接线 和层叠线圈的周边，第二外部端子形成在第二主面上; 并且所述半导体集成电路器件的端子连接到所述多层衬底上的所述第一外部端子，所述第一外部端子的至少一部分通过所述第一和第二连接线电连接到所述第二外部端子，并且所述输入或 输出端子经由层叠线圈与第二外部端子连接。

公开(公告)号：US20110018136A1

公开(公告)日：2011-01-27

申请号：US12751308

申请日：2010-03-31

Applicant: SARAH S. BEDAIR ,  BRIAN MORGAN ,  CHRISTOPHER D. MEYER

Inventor： SARAH S. BEDAIR ,  BRIAN MORGAN ,  CHRISTOPHER D. MEYER

IPC: H01L29/66 ,  H05K3/10 ,  B82Y25/00

CPC classification number: H05K3/1258 ,  H05K1/16 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2203/105 ,  Y10T29/49002

Abstract: A method of forming at least one electronic device on a substrate comprising creating a depository and an attached capillary; providing a liquid containing particles in the range 1 nanometer to 1 millimeter for deposit into the depository; the liquid flowing into the at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; whereby the agglomerate is used to form a part of the at least one electronic device. An microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate formed by at least one wall, a capillary channel coupled to said depository adapted to be filled with liquid comprising nanoparticles by capillary action, whereby as the liquid evaporates, an agglomerate forms in the capillary channel having a substantially uniform distribution of the particles.

Abstract translation: 一种在衬底上形成至少一个电子器件的方法，包括形成存放器和附着的毛细管; 提供含有1纳米至1毫米范围内的颗粒的液体沉积到储存库中; 所述液体通过毛细管作用流入所述至少一个毛细管; 蒸发液体，使得颗粒形成从至少一个毛细管的末端开始的附聚物，其中颗粒在附聚物内具有基本均匀的分布; 由此所述附聚物用于形成所述至少一个电子装置的一部分。 一种微电子集成电路器件，包括衬底; 耦合到由至少一个壁形成的所述基底的储存器，耦合到所述储存器的毛细通道，其适于通过毛细管作用填充包含纳米颗粒的液体，由此当液体蒸发时，在毛细通道中形成具有基本均匀分布的附聚物 的颗粒。

公开(公告)号：US20110017501A1

公开(公告)日：2011-01-27

申请号：US12935662

申请日：2009-03-26

Applicant: Tadahiro Ohmi ,  Akinobu Teramoto ,  Masayuki Ishizuka ,  Nobuhiro Hidaka ,  Yasushi Shirakata

Inventor： Tadahiro Ohmi ,  Akinobu Teramoto ,  Masayuki Ishizuka ,  Nobuhiro Hidaka ,  Yasushi Shirakata

IPC: H05K1/00 ,  B32B5/16 ,  B32B5/00 ,  B05D7/00 ,  B05D3/12

CPC classification number: H05K1/0373 ,  B22F1/02 ,  B22F2998/00 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/26 ,  H01F1/37 ,  H05K1/0233 ,  H05K1/024 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/086 ,  Y10T428/24 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  B22F3/16

Abstract: This invention provides a composite material useful for size reduction of electronic components and circuit boards mounted on electronic equipment and exhibiting a low magnetic loss (tan δ), and a manufacturing method thereof. The composite material contains an insulating material and particulates dispersed in this insulating material, the particulates being previously coated with an insulating material having substantially the same composition as that of the coating insulating material. The particulates consist of an organic or inorganic substance and preferably have a flat shape. The insulating material may be an insulating material commonly used in the field of electronic components. The composite material of the invention is preferably manufactured by a manufacturing method in which the particulates are previously coated with an insulating material and dispersed in an insulating material having substantially the same composition as that of the coating insulating material. The composite material of the invention can be applied as a material for circuit boards and/or electronic components to realize further reduction in size and power consumption of information and telecommunication equipment in a frequency band of several hundred MHz to 1 GHz.

Abstract translation: 本发明提供一种复合材料及其制造方法，该复合材料可用于安装在电子设备上的电子部件和电路板的尺寸减小并且具有低的磁损耗（tanδ）。 复合材料包含绝缘材料和分散在该绝缘材料中的微粒，预先用绝缘材料涂覆颗粒，该绝缘材料具有与涂层绝缘材料基本相同的组成。 微粒由有机或无机物构成，优选具有平坦的形状。 绝缘材料可以是电子部件领域中常用的绝缘材料。 本发明的复合材料优选通过制造方法制造，其中颗粒预先用绝缘材料涂覆并分散在具有与涂层绝缘材料基本相同的组成的绝缘材料中。 本发明的复合材料可以用作电路板和/或电子部件的材料，以实现在数百MHz至1GHz的频带内的信息和电信设备的尺寸和功耗的进一步减小。