公开(公告)号：US07851921B2

公开(公告)日：2010-12-14

申请号：US11830505

申请日：2007-07-30

Applicant: Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

Inventor： Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

IPC: H01L23/48

CPC classification number: H05K3/305 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H05K1/0262 ,  H05K1/056 ,  H05K1/141 ,  H05K1/183 ,  H05K3/107 ,  H05K3/4614 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/49155

Abstract: To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Abstract translation: 为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。 装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部的第二导电层（包括导电部）和形成在基底的顶部的第三导电层 的基地。 这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。 第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

公开(公告)号：US20100308451A1

公开(公告)日：2010-12-09

申请号：US12792096

申请日：2010-06-02

Applicant: Kotaro Kodani

Inventor： Kotaro Kodani

IPC: H01L23/498 ,  H05K1/11 ,  H01L23/04 ,  C25D5/02

CPC classification number: H05K1/09 ,  H01L23/055 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2203/0361 ,  H05K2203/1476 ,  H01L2224/0401

Abstract: There is provided a wiring substrate. The wiring substrate includes: an insulating layer; first electrode pads having first exposed surfaces, the first exposed surfaces being exposed from the insulating layer; and second electrode pads having second exposed surfaces, the second exposed surfaces being exposed from the insulating layer. There is a level difference between the first exposed surfaces and the second exposed surfaces.

Abstract translation: 提供了布线基板。 布线基板包括：绝缘层; 第一电极焊盘具有第一暴露表面，第一暴露表面从绝缘层露出; 第二电极焊盘具有第二暴露表面，第二暴露表面从绝缘层露出。 在第一暴露表面和第二暴露表面之间存在水平差。

公开(公告)号：US07847470B2

公开(公告)日：2010-12-07

申请号：US11904526

申请日：2007-09-26

Applicant: Tomotaka Kuroda

Inventor： Tomotaka Kuroda

IPC: H01L41/047 ,  H01L41/053

CPC classification number: H05K1/144 ,  H05K3/301 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10083 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10871

Abstract: To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.

Abstract translation: 提供高可靠的表面安装振荡器，焊料不会从振荡器的热量泄漏出来。 基板印刷电路板具有位于第一表面上的端子，第二表面上是与第一表面相对的凹面，金属支柱固定在凹面上，副印刷电路板具有由金属支柱支撑的压电振动器， 基板印刷板，覆盖金属支柱和副印刷板的盖板。

公开(公告)号：US20100299920A1

公开(公告)日：2010-12-02

申请号：US12856168

申请日：2010-08-13

Applicant: Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

Inventor： Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

IPC: H05K3/10

CPC classification number: H05K3/305 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H05K1/0262 ,  H05K1/056 ,  H05K1/141 ,  H05K1/183 ,  H05K3/107 ,  H05K3/4614 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/49155

Abstract: To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Abstract translation: 为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。 装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部上的第二导电层（包括导电部）和形成在基底的顶部的第三导电层 的基地。 这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。 第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

公开(公告)号：US07825340B2

公开(公告)日：2010-11-02

申请号：US12193492

申请日：2008-08-18

Applicant: Hitoshi Kashio

Inventor： Hitoshi Kashio

IPC: H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/112 ,  H05K3/0017 ,  H05K3/064 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/0554

Abstract: In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.

Abstract translation: 在本发明的一个实施例中，双面布线板的连接装置包括由第一侧导电层和第一侧连接导电层构成的第一侧连接接地部分和第二侧连接接地部分 由第二侧导电层构成; 所述第一侧连接接地部和所述第二侧连接用接地部在各自的中央部彼此面对，并且将绝缘基板夹在其间; 与第一侧连接接地部的周缘部和第二侧连接接地部的周缘部对应地形成基板孔; 并且第一侧连接接地部分的周边端部和第二侧连接接地部分的周边端部经由基板孔相互连接。

公开(公告)号：US20100165185A1

公开(公告)日：2010-07-01

申请号：US12719942

申请日：2010-03-09

Applicant: FU-YEN TSENG

Inventor： FU-YEN TSENG

IPC: H04N5/225 ,  H05K1/11

CPC classification number: H05K1/111 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract translation: 电路板组件包括电路板和至少一个电气元件。 电路板包括包括支撑表面的电介质基底和形成在支撑表面上的至少一个连接部分。 所述至少一个电气元件经由连接介质电连接到所述至少一个连接部件。 至少一个排气孔延伸穿过连接部分和电介质基板。 至少一个排气孔构造成从连接介质排出空气。

公开(公告)号：US07745736B2

公开(公告)日：2010-06-29

申请号：US11341445

申请日：2006-01-30

Applicant: Kenta Ogawa ,  Jun Tsukano ,  Takehiko Maeda ,  Tadanori Shimoto ,  Shintaro Yamamichi ,  Kazuhiro Baba

Inventor： Kenta Ogawa ,  Jun Tsukano ,  Takehiko Maeda ,  Tadanori Shimoto ,  Shintaro Yamamichi ,  Kazuhiro Baba

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/205 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/107 ,  H05K3/4682 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0384 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.

Abstract translation: 互连基板设置有在底面具有下沉部分的基底绝缘膜，设置在凹陷部分中的第一互连，形成在基底绝缘膜中的通孔，以及连接到第一互连件的第二互连 通过所述通孔内的导体，并形成在所述基底绝缘膜的顶表面上，其中所述互连衬底包括由所述第一互连形成的第一互连图案，所述第一互连图案至少包括沿着与第一互连正交的第二方向延伸的线状图案 第一方向和翘曲控制图案，其设置在基底绝缘膜的底面的下沉部分中，并且形成为抑制互连基板朝向底部绝缘膜两侧的底侧的翘曲 第一个方向

公开(公告)号：US07738258B2

公开(公告)日：2010-06-15

申请号：US11391375

申请日：2006-03-29

Applicant: Masaki Ohno ,  Masanori Tamaki

Inventor： Masaki Ohno ,  Masanori Tamaki

IPC: H05K7/00

CPC classification number: H05K1/114 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30. When the IC chip 70 generates heat, since pads 41 are positioned away from the center, a large shearing stress is applied to the portions at which pads 41 are joined to the interposer 60 in comparison to the portions at which pads 43 are joined to the interposer 60. Here, pads 41 are formed at substantially flat wiring portions and thus when joined to the interposer 60 by means of solder bumps 51, voids and angled portions, at which stress tends to concentrate, are not formed in the interiors of solder bumps 51. The joining reliability is thus high.

Abstract translation: 通过将IC芯片70通过高刚性的插入件60电连接到形成在积聚层30的最上表面上的外部焊盘41和内部焊盘43来制备半导体安装板80.当IC芯片70 产生热量，因为焊盘41位于远离中心的位置，与衬垫43接合到插入器60的部分相比，大的剪切应力施加到焊盘41接合到插入件60的部分。这里， 焊盘41形成在基本上平坦的布线部分处，因此当通过焊料凸块51接合到插入件60时，不会在焊料凸块51的内部形成空隙和倾斜部分，其中应力趋于集中。连接可靠性 因此高。

公开(公告)号：US20100096171A1

公开(公告)日：2010-04-22

申请号：US12320366

申请日：2009-01-23

Applicant: Seok Kyu Lee ,  Jae Joon Lee ,  Ki Hwan Kim

Inventor： Seok Kyu Lee ,  Jae Joon Lee ,  Ki Hwan Kim

IPC: H05K1/09 ,  B32B38/10 ,  H05K1/11

CPC classification number: H05K3/3484 ,  H05K3/244 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2203/0152 ,  H05K2203/0338 ,  H05K2203/043

Abstract: Disclosed herein is a printed circuit board having round solder bumps and a method of manufacturing the same. The solder bump is configured to have a round connecting surface in contact with a pad, and thus have an increased contact area with respect to the pad, thus improving connection reliability. The solder bumps have uniform heights.

Abstract translation: 这里公开了具有圆形焊料凸块的印刷电路板及其制造方法。 焊料凸块被构造成具有与焊盘接触的圆形连接表面，因此相对于焊盘具有增加的接触面积，从而提高连接可靠性。 焊料凸点具有均匀的高度。

公开(公告)号：US20100065322A1

公开(公告)日：2010-03-18

申请号：US12557847

申请日：2009-09-11

Applicant: Michiro Ogawa ,  Kazuhiro Kobayashi ,  Kentaro Kaneko

Inventor： Michiro Ogawa ,  Kazuhiro Kobayashi ,  Kentaro Kaneko

IPC: H05K1/02 ,  B32B38/00

CPC classification number: H05K3/188 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/113 ,  H05K3/205 ,  H05K3/244 ,  H05K3/282 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2203/0361 ,  Y10T29/4916 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

Abstract translation: 布线板包括从最外绝缘层的开口部分露出的焊盘。 焊盘包括：第一金属层，其表面从布线板露出; 第二金属层，设置在第一金属层上，由有效防止基板内的通孔内的金属扩散入第一金属层的材料形成; 以及设置在第二金属层和通孔之间的第三金属层，并且由比第二金属层更难被氧化的材料形成。 第三金属层的厚度相对较厚，优选选择为第二金属层的厚度的三倍以上。 第三金属层的侧表面和要连接通孔的第三金属层的表面被粗糙化。