公开(公告)号：US20090097220A1

公开(公告)日：2009-04-16

申请号：US12010749

申请日：2008-01-29

Applicant: Young-Mi Lee ,  Suk-Chang Hong ,  Yong-Bin Lee ,  Chin-Kwan Kim

Inventor： Young-Mi Lee ,  Suk-Chang Hong ,  Yong-Bin Lee ,  Chin-Kwan Kim

IPC: H05K1/02

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05567 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/00012

Abstract: A printed circuit board is disclosed. The printed circuit board, which has at least one pad on which a solder ball is to be placed, includes a solder resist that covers a surface of the printed circuit board, an opening part that exposes the pad and supports the solder ball, and an extended portion formed in a perimeter of the opening part that allows an underfill to flow in between the printed circuit board and the solder ball. With this printed circuit board, the underfill can be filled in more readily between the printed circuit board and the solder balls, when mounting a component on the printed circuit board.

Abstract translation: 公开了印刷电路板。 具有至少一个其上要放置焊球的焊盘的印刷电路板包括覆盖印刷电路板的表面的阻焊剂，露出焊盘并支撑焊球的开口部分，以及 延伸部分形成在开口部分的周边，允许底部填充物在印刷电路板和焊球之间流动。 使用该印刷电路板，当将部件安装在印刷电路板上时，底部填充物可以更容易地填充在印刷电路板和焊球之间。

公开(公告)号：US20090041981A1

公开(公告)日：2009-02-12

申请号：US12188663

申请日：2008-08-08

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: B32B3/24 ,  H05K3/00

CPC classification number: H05K3/3473 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/0401 ,  H01L2224/05563 ,  H01L2224/05571 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13109 ,  H01L2924/0002 ,  H01L2924/01327 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0989 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A packaging substrate having an electrical connection structure and a method for fabricating the same are provided. The packaging substrate have a substrate body with a plurality of conductive pads on a surface thereof; a solder mask layer disposed on the substrate body with a plurality of openings corresponding to the conductive pads, the size of each of the openings being larger than each of the conductive pads; and electroplated solder bumps for covering the conductive pads to provide better bond strength and reliability.

Abstract translation: 提供具有电连接结构的封装基板及其制造方法。 封装基板具有在其表面上具有多个导电焊盘的基板主体; 焊接掩模层，其设置在所述基板主体上，具有对应于所述导电焊盘的多个开口，每个所述开口的尺寸大于每个所述导电焊盘; 以及用于覆盖导电焊盘的电镀焊料凸块，以提供更好的粘合强度和可靠性。

公开(公告)号：US20090032294A1

公开(公告)日：2009-02-05

申请号：US12122014

申请日：2008-05-16

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H05K1/09

CPC classification number: H05K3/3473 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/05671 ,  H01L2224/13109 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0989 ,  H05K2203/043 ,  H05K2203/0542 ,  H01L2924/00014

Abstract: Provided is a circuit board including: a circuit board body with at least one surface having a plurality of electrically connecting pads; an insulating protection layer formed on the circuit board body and formed with an opening corresponding in position to one of the electrically connecting pads, being larger than the electrically connecting pad, and not being in contact with the periphery of the electrically connecting pad; and a soldering material formed on, and confined to, the electrically connecting pad; thus allowing an electrically conductive element limited in the opening formed in the insulating protection layer to be fabricated from the soldering material by a reflow process with a view to forming a fine-pitch electrically connecting structure.

Abstract translation: 提供一种电路板，包括：具有至少一个具有多个电连接焊盘的表面的电路板主体; 绝缘保护层，形成在所述电路板主体上，并且形成有与所述电连接焊盘中的一个对应的开口，大于所述电连接焊盘，并且不与所述电连接焊盘的周边接触; 以及形成在所述电连接焊盘上并限制于所述电连接焊盘的焊接材料; 从而允许在绝缘保护层中形成的开口中限制的导电元件通过回流工艺由焊接材料制成，以形成细间距电连接结构。

公开(公告)号：US20080280397A1

公开(公告)日：2008-11-13

申请号：US11760048

申请日：2007-06-08

Applicant: Seong Cheol KIM ,  Myung Geun PARK

Inventor： Seong Cheol KIM ,  Myung Geun PARK

IPC: H01L21/60 ,  H01L21/44

CPC classification number: H05K3/0052 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/0989 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A strip level substrate is manufactured by: applying solder resist on a substrate including a plurality of unit substrate divided by a scribe line; and patterning the applied solder resist to expose an electrode terminal and a ball land in each unit substrate, wherein the patterning of the solder resist is performed to be removed together with a solder resist part applied on the scribe line in order to reduce an early warpage of the strip level substrate.

Abstract translation: 通过以下步骤制造带状平面基板：将阻焊剂涂覆在包含由划线划分的多个单位基板的基板上; 以及对所施加的阻焊剂进行图案化，以暴露每个单位基板中的电极端子和球状区域，其中执行阻焊剂的图案化以与施加在划线上的阻焊剂部件一起去除以减少早期翘曲 的带状基底。

公开(公告)号：US07429799B1

公开(公告)日：2008-09-30

申请号：US11190596

申请日：2005-07-27

Applicant: Akito Yoshida ,  Mahmoud Dreiza

Inventor： Akito Yoshida ,  Mahmoud Dreiza

IPC: H01L23/48 ,  H01L23/28

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/1433 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor device has a substrate and an encapsulation area on a first surface of the substrate. A first plurality of metal lands is on the first surface of the substrate around a periphery of the encapsulation area. Solder mask covers portions of the first plurality of metal lands closest to the encapsulation area. Remaining portions of the first plurality of metal lands are exposed areas having no solder mask.

Abstract translation: 半导体器件在衬底的第一表面上具有衬底和封装区域。 第一多个金属焊盘位于衬底周围的封装区域的第一表面上。 焊接掩模覆盖最靠近封装区域的第一多个金属焊盘的部分。 第一多个金属焊盘的剩余部分是没有焊接掩模的暴露区域。

公开(公告)号：US20080224325A1

公开(公告)日：2008-09-18

申请号：US12047811

申请日：2008-03-13

Applicant: Takao NISHIMURA ,  Yoshikazu KUMAGAYA

Inventor： Takao NISHIMURA ,  Yoshikazu KUMAGAYA

IPC: H01L23/12 ,  H05K7/14

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0594 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patters.

Abstract translation: 电路板包括主表面，其中电子部件以正面朝下的方式安装，使得具有多个外部连接端子的电子部件的表面面向布线板的主表面，电子部件固定到布线 用粘合剂板; 形成在安装有电子部件的主表面上的绝缘层; 形成在所述绝缘层中的开口部，使得多个相邻布线图案共同且部分地开放，所述相邻布线图形具有连接所述电子部件的电极的电极; 其特征在于，位于所述布线基板的中心侧的所述开口部的外周沿着所述布线图案的延伸方向在倾斜方向形成。

公开(公告)号：US20080199988A1

公开(公告)日：2008-08-21

申请号：US12033653

申请日：2008-02-19

Applicant: Chizuko Ito ,  Mutsumi Masumoto

Inventor： Chizuko Ito ,  Mutsumi Masumoto

IPC: H01L21/58 ,  H05K3/10

CPC classification number: H05K1/111 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/1148 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2203/0278 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49151 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The objective of the present invention is to offer a method for forming a conductive pattern on a substrate and solder protrusions on the conductive pattern. The pitch of the conductive pattern corresponds to the pitch of electrodes on a semiconductor chip.

Abstract translation: 本发明的目的是提供一种在衬底上形成导电图案并在导电图案上形成焊料突起的方法。 导电图案的间距对应于半导体芯片上的电极间距。

公开(公告)号：US20080187720A1

公开(公告)日：2008-08-07

申请号：US11956041

申请日：2007-12-13

Applicant: Hyung Dae KIM

Inventor： Hyung Dae KIM

IPC: B32B3/30

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/118 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K2201/0989 ,  Y10T428/2457

Abstract: Provided is a wave-shaped coating structure comprising an S/R coating layer coated on TAB/COF. The S/R coating layer is provided with a plurality of recesses for making the edge of the layer to be wave-shaped. The width of the recess is 1-10 units of lead. The shape of the recess is rectangle, trapezoid, U-shape or V-shape.

Abstract translation: 提供了包含涂覆在TAB / COF上的S / R涂层的波形涂层结构。 S / R涂层设置有多个凹槽，用于使该层的边缘成波浪形。 凹槽的宽度为1-10单位的铅。 凹槽的形状为矩形，梯形，U形，V形。

公开(公告)号：US20080173472A1

公开(公告)日：2008-07-24

申请号：US11829029

申请日：2007-07-26

Applicant: Minoru Takizawa ,  Kazuhiko Nagao ,  Kiyokazu Ishizaki ,  Kuniyasu Hosoda

Inventor： Minoru Takizawa ,  Kazuhiko Nagao ,  Kiyokazu Ishizaki ,  Kuniyasu Hosoda

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/2036 ,  Y10T29/49144

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist

Abstract translation: 根据一个实施例，印刷电路板包括印刷线路板，其包括通孔部分，包括部件主体的电子部件和插入到要与其电连接的通孔部分中的引线部件，设置在其周围并分离的金属部件 从通孔部分和至少设置在金属构件周围的阻焊剂，至少部分组件安装在阻焊层上

公开(公告)号：US20080157389A1

公开(公告)日：2008-07-03

申请号：US11968035

申请日：2007-12-31

Applicant: Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

Inventor： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

IPC: H01L23/48 ,  H05K7/02

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.

Abstract translation: 提供了用于安装它的半导体封装和模块印刷电路板（PCB）。 半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。 第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。 第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。 第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。 在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。