公开(公告)号：US06741085B1

公开(公告)日：2004-05-25

申请号：US08994799

申请日：1997-12-19

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC: G01R3102

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level burn-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

Abstract translation: 多个接触元件，例如接触凸起或包括单片和复合互连元件的独立弹簧触点，安装到相对较小的瓦片衬底上，该衬底又安装并连接到相对较大的电子部件衬底，由此填充 电子部件具有多个接触元件，同时避免了必须直接在电子部件上产生接触元件。 相对较大的电子部件适当地是探针卡组件的空间变压器部件。 以这种方式，可以一次对整个半导体晶片进行压力连接，以提供晶片级老化等。 焊接球，z轴导电粘合剂或柔性连接适用于在瓦片基片和电子部件之间进行电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置瓦片以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。 公开了用于将瓷砖的规定的x-y和z轴对准维持在相对较大的衬底上的技术。

公开(公告)号：US06739878B1

公开(公告)日：2004-05-25

申请号：US10385364

申请日：2003-03-10

Applicant: Alfiero Balzano

Inventor： Alfiero Balzano

IPC: H01R1200

CPC classification number: H05K3/365 ,  H01R12/7047 ,  H01R12/714 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/1031 ,  H05K2203/167 ,  Y02P70/611

Abstract: Pressure point contact for interconnecting electronic circuits wherein one component includes a flexible cable having a plurality of conductive strips with each strip terminating in contact pads having outwardly projecting pressure point contact mounds that protrude through a layer covering the strips with electrically insulated material. The other component of the interconnecting circuit includes a plurality of conductive contact elements placed on the exposed surface of a printed circuit board, LCD or other planar surface. A pressure plate is arcuate shaped and is employed for applying pressure to the backside of the flexible cable in order to force the contact mounds into pressure engagement with the contact elements on the planar surface. To provide equal application of pressure, a flat compression stabilizer plate is placed between the arcuate pressure plate and the backside of the cable. A pressure applicator is employed for applying equal pressure via the pressure plate serving as a compression stabilizer for equalizing the application pressure to the backside of the flexible cable so that pressure is evenly distributed as pressure is applied. Alternately, the contact elements on the planar surface may include raised receptacles for registering with and insertably receiving the pressure point contact mounds.

Abstract translation: 用于互连电子电路的压力点接触，其中一个部件包括具有多个导电条带的柔性电缆，每个条带终止于具有向外突出的压力点接触凸块的接触焊盘，所述接触焊盘通过电绝缘材料覆盖所述条带而突出。 互连电路的另一部件包括放置在印刷电路板，LCD或其它平面表面的暴露表面上的多个导电接触元件。 压板是弓形的，并且用于向柔性电缆的背面施加压力，以便迫使接触丘与平坦表面上的接触元件进行压力接合。 为了提供相同的压力施加，扁平压缩稳定板被放置在弧形压板和电缆的背面之间。 使用压力施加器通过用作压缩稳定器的压力板施加相等的压力，以将施加压力均衡到柔性电缆的背面，使得在施加压力时压力均匀分布。 或者，平面表面上的接触元件可以包括凸起的接收器，用于与压力点接触凸起配准并可插入地接收。

公开(公告)号：US06692269B2

公开(公告)日：2004-02-17

申请号：US09737410

申请日：2000-12-15

Applicant: Apurba Roy ,  Milivoje Slobodan Brkovic

Inventor： Apurba Roy ,  Milivoje Slobodan Brkovic

IPC: H01R1200

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/09954 ,  H05K2201/10303 ,  H05K2201/1031 ,  Y02P70/611

Abstract: In accordance with the invention, a circuit module is provided with a plurality of dual capacity connector pads, each pad holding a miniature surface mount connector and/or a connection pin. The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount or pin to the same region of the circuit board.

Abstract translation: 根据本发明，电路模块设置有多个双电容连接器焊盘，每个焊盘保持微型表面安装连接器和/或连接引脚。 优选的I通道表面安装连接器足够小，使得模块可以通过表面安装或引脚连接到电路板的相同区域。

公开(公告)号：US20030222667A1

公开(公告)日：2003-12-04

申请号：US10458875

申请日：2003-06-10

Applicant: FormFactor, Inc.

Inventor： Igor Y. Khandros JR. ,  A. Nicholas Sporck ,  Benjamin N. Eldridge JR.

IPC: G01R031/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US06624648B2

公开(公告)日：2003-09-23

申请号：US10011335

申请日：2001-12-05

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R3102

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07378 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of the probe card, and for determining what adjustments to make, are disclosed.

Abstract translation: 探针卡组件包括探针卡，空间变换器和设置在空间变压器和探针卡之间的插入器。 公开了用于调整空间变换器的取向而不改变探针卡的取向以及用于确定进行什么调整的适当机构。

公开(公告)号：US06599156B2

公开(公告)日：2003-07-29

申请号：US10247443

申请日：2002-09-19

Applicant: John Pereira ,  Manuel Machado ,  Stephen Antaya

Inventor： John Pereira ,  Manuel Machado ,  Stephen Antaya

IPC: H01R410

CPC classification number: H05B3/84 ,  H01R4/02 ,  H01R4/028 ,  H01R4/58 ,  H01R12/57 ,  H01R13/20 ,  H01R13/207 ,  H01R13/213 ,  H01R13/639 ,  H01R43/0235 ,  H01R43/0256 ,  H01R43/0263 ,  H05B2203/016 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49217 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

公开(公告)号：US20030017756A1

公开(公告)日：2003-01-23

申请号：US10247443

申请日：2002-09-19

Applicant: Antaya Technologies Corporation

Inventor： John Pereira ,  Manuel Machado ,  Stephen Antaya

IPC: H01R004/02

CPC classification number: H05B3/84 ,  H01R4/02 ,  H01R4/028 ,  H01R4/58 ,  H01R12/57 ,  H01R13/20 ,  H01R13/207 ,  H01R13/213 ,  H01R13/639 ,  H01R43/0235 ,  H01R43/0256 ,  H01R43/0263 ,  H05B2203/016 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49217 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

公开(公告)号：US20020076952A1

公开(公告)日：2002-06-20

申请号：US09991420

申请日：2001-11-16

Applicant: di/dt, Inc.

Inventor： Apurba Roy

IPC: H01R012/00

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  H01L2924/00

Abstract: In accordance with the invention, an I-channel surface mount connector comprising a length of cylindrical rod having a generally I-shaped cross section is improved by providing an extended mounting flange. When a first circuit device is connected to a second circuit device with the extended flange extending outward of the first device, the flange can extend beyond the periphery of the first device. This extension has the advantage that the solder bond between the flange and the second device can be easily inspected from above using visual inspection equipment.

Abstract translation: 根据本发明，通过提供一个延伸的安装凸缘，改进了包括具有大致I形截面的圆柱形杆的长度的I通道表面安装连接器。 当第一电路装置连接到具有从第一装置向外延伸的延伸法兰的第二电路装置时，凸缘可以延伸超出第一装置的周边。 该扩展的优点在于，可以使用目视检查设备从上方容易地检查凸缘和第二装置之间的焊接接合。

公开(公告)号：US20020076951A1

公开(公告)日：2002-06-20

申请号：US09737303

申请日：2000-12-15

Applicant: di/dt, Inc.

Inventor： Apurba Roy

IPC: H01R012/00

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

公开(公告)号：US20020062989A1

公开(公告)日：2002-05-30

申请号：US09951785

申请日：2001-09-13

Inventor： Hideo Yumi

IPC: H05K007/06

CPC classification number: H05K3/341 ,  H01R4/64 ,  H01R12/57 ,  H01R13/24 ,  H01R43/0256 ,  H05K1/0215 ,  H05K2201/09663 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.