公开(公告)号：US5288944A

公开(公告)日：1994-02-22

申请号：US079192

申请日：1993-06-17

Applicant: Lance A. Bronson ,  Scott P. Moore ,  John A. Shriver, III

Inventor： Lance A. Bronson ,  Scott P. Moore ,  John A. Shriver, III

IPC: H01L23/00 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H05K3/28 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01L23/49811 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/49894 ,  H01L23/562 ,  H05K3/3405 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K3/284 ,  H05K3/3421 ,  Y10T29/49146

Abstract: A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

Abstract translation: 公开了一种陶瓷芯片载体，其优选地包括具有电路化表面的陶瓷基板，安装在电路化表面上的至少一个半导体芯片以及与电路化表面上的接触焊盘机械和电连接的至少一个引脚。 引脚和接触焊盘之间的每个机械/电连接包括常规焊接连接。 此外，每个这样的焊接连接至少部分地封装在包括环氧树脂的材料中，该环氧树脂相对于焊料连接来选择，以使得焊料连接能够承受标准的热疲劳试验。

公开(公告)号：US5162971A

公开(公告)日：1992-11-10

申请号：US495425

申请日：1990-03-19

Applicant: Teruhiro Sato ,  Tomio Wada ,  Mikio Kobayashi

Inventor： Teruhiro Sato ,  Tomio Wada ,  Mikio Kobayashi

IPC: H01L25/16 ,  H05K1/02 ,  H05K1/05 ,  H05K3/34 ,  H05K5/00

CPC classification number: H01L25/165 ,  H05K3/3405 ,  H05K5/0091 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/05 ,  H05K2201/1034 ,  H05K2201/10371 ,  H05K2201/10924 ,  H05K3/3447

Abstract: A high-density circuit module has a box shaped shielding case made from a plate blank which is bent to provide the shield case. A printed wiring board is placed on the bottom surface portion of the shielding case, and a plurality of electronic components are soldered to conductor lands of the printed wiring board. A plurality of externally connected leads are soldered to connection lands of the printed wiring board. A process for producing the high-density circuit module includes the steps of placing the printed wiring board on the blank, then soldering the electronic components and leads to the printed wiring board and then bending the blank to provide the shielding case. The plurality of externally connected leads are formed from a plurality of leads which are originally integrally connected to the bottom surface portion of the shielding case, by separating the plurality of leads form the bottom surface portion of the shielding case. A high-density circuit module having a small number of parts and a simple structure is easily manufactured.

Abstract translation: 高密度电路模块具有由板坯制成的箱形屏蔽壳体，其被弯曲以提供屏蔽壳体。 印刷线路板被放置在屏蔽壳体的底面部分上，并且多个电子部件被焊接到印刷电路板的导体焊盘。 多个外部连接的引线焊接到印刷电路板的连接焊盘。 制造高密度电路模块的方法包括以下步骤：将印刷线路板放置在坯料上，然后将电子元件焊接到印刷线路板上，然后弯曲坯料以提供屏蔽壳。 多个外部连接的引线由原来一体地连接到屏蔽壳体的底面部分的多个引线形成，通过将多根引线分离成屏蔽壳体的底面部分。 容易制造具有少量部件和简单结构的高密度电路模块。

公开(公告)号：US5081764A

公开(公告)日：1992-01-21

申请号：US563320

申请日：1990-07-26

Applicant: Jiro Utunomiya ,  Saburo Iida ,  Hitosi Sibuya ,  Kazunori Kusaba ,  Isao Narumi

Inventor： Jiro Utunomiya ,  Saburo Iida ,  Hitosi Sibuya ,  Kazunori Kusaba ,  Isao Narumi

IPC: H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01R12/55 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49894 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K3/3421 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49179

Abstract: A multiple-terminal unit comprises a first and a second group of teeth extending from one edge of a band-shaped. The teeth in the first group and the second group are bent at different positions so that their stem parts are staggered. In another aspect of the invention, the part at which a terminal and wiring pattern on a substrate a fixed by resin, preferably thixotropic resin.

公开(公告)号：US4985747A

公开(公告)日：1991-01-15

申请号：US361658

申请日：1989-06-02

Applicant: Jiro Utunomiya ,  Saburo Iida ,  Hitosi Sibuya ,  Kazunori Kusaba ,  Isao Narumi

Inventor： Jiro Utunomiya ,  Saburo Iida ,  Hitosi Sibuya ,  Kazunori Kusaba ,  Isao Narumi

IPC: H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01R12/55 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49894 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K3/3421 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49179

Abstract: A multiple-terminal unit comprises a first and a second group of teeth extending from one edge of a band-shaped. The teeth in the first group and the second group are bent at different positions so that their stem parts are staggered. In another aspect of the invention, the part at which a terminal and wiring pattern on a substrate a fixed by resin, preferably thixotropic resin.

公开(公告)号：US4979903A

公开(公告)日：1990-12-25

申请号：US428835

申请日：1989-10-30

Applicant: Jacques P. Gosselin

Inventor： Jacques P. Gosselin

IPC: H01R12/72 ,  H01R13/405 ,  H05K3/34

CPC classification number: H01R12/721 ,  H05K3/3405 ,  H01R13/405 ,  H05K2201/1034 ,  H05K2201/10878 ,  H05K2203/167

Abstract: A contact element and contact element assembly of electrically conducting material, intended, in particular, for surface mounting at a connecting area near the edge of a circuit substrate comprising an opening or recess. The contact element has a flat base face which in the mounted state of the contact element is situated completely or partially opposite the connecting area. The contact element also has at least one positioning device which projects from the flat base face and extends into the opening or recess of the substrate the contact element is mounted to the positioning device may be a positioning finger which fits freely into the opening or recess, or a positioning finger which acts on the substrate in a manner such that a retaining force is provided for keeping the contact element in position.

公开(公告)号：US4626478A

公开(公告)日：1986-12-02

申请号：US592220

申请日：1984-03-22

Applicant: Herman F. van Dyk Soerewyn

Inventor： Herman F. van Dyk Soerewyn

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/80 ,  H01L21/4853 ,  H01L21/4878 ,  H01L23/49548 ,  H05K3/3405 ,  H05K3/3426 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K3/3421 ,  Y02P70/613 ,  Y10S428/929 ,  Y10T428/12361 ,  Y10T428/1241 ,  Y10T428/12493

Abstract: Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.

Abstract translation: 间隔元件整体形成在电子电路器件部件的导电界面的组成表面上，用于在表面之间提供均匀的厚度的焊料或其它接合膜。 界面可以是诸如在引线和衬底接触焊盘之间限定的那些的导电接口，以及诸如在散热器和衬底之间限定的那些导热接口。 当组件被压在一起时，任何合适的间隔件可以使组件表面保持选定的距离，例如边缘和角部凸缘，凸起凹坑，环形突起，柄脚等等。 公开了一种用于形成环形突起的工具，其有利地用于比较厚的电子电路器件部件和具有相对较硬层的层压电子电路器件部件。

公开(公告)号：US4400762A

公开(公告)日：1983-08-23

申请号：US392921

申请日：1982-06-28

Applicant: John E. Bartley ,  Orville R. Penrod

Inventor： John E. Bartley ,  Orville R. Penrod

IPC: H01L25/16 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H05K1/16

CPC classification number: H05K3/3405 ,  H01L25/165 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/0306 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/1034 ,  H05K3/403

Abstract: An electrical circuit device having a ceramic substrate including a thick or thin film circuit on at least one surface thereof and an intersecting edge surface which may support termination leads anchored thereto and further retained by solder deposited upon an edge termination coating. The termination coating underlying the solder extends over the edge defined by the intersecting surfaces. The component resides in form of the substrate to include an indented area in the form of a notch or a groove which intersects both adjoining surfaces to provide a means of receiving edge termination material, so as to insure a continuous and non-interrupted deposit of the material to complete the electrical circuit between the leads and the respective circuit components of the circuit defined on the said one substrate surface.

Abstract translation: 一种电路装置，其具有陶瓷基板，该陶瓷基板在其至少一个表面上包括厚薄膜电路和交叉的边缘表面，所述相交的边缘表面可以支撑锚定在其上的终止引线，并进一步由沉积在边缘终止涂层上的焊料保持。 焊料下方的端接涂层在由交叉表面限定的边缘上延伸。 该部件以基板的形式存在，以包括凹口形式的凹陷区域或与两个相邻表面相交的凹槽，以提供接收边缘终端材料的装置，以便确保连续和非中断的沉积 完成引线之间的电路的材料和限定在所述一个衬底表面上的电路的各个电路部件。

公开(公告)号：US4139726A

公开(公告)日：1979-02-13

申请号：US869538

申请日：1978-01-16

Applicant: Orville R. Penrod ,  Richard R. Fellows, Jr.

Inventor： Orville R. Penrod ,  Richard R. Fellows, Jr.

IPC: H05K3/34 ,  H05K7/10 ,  H05K5/06

CPC classification number: H05K7/103 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10424 ,  H05K3/3421 ,  Y10T29/49142

Abstract: A packaged microcircuit includes a housing of insulating material having a plurality of apertures which extend from the interior of the housing to the outside. A metallized lead connection surface is formed on a wall of each aperture. A microcircuit having a plurality of terminals is disposed in the interior of the housing with each of its terminals aligned with a respective aperture. The individual leads extend into the apertures and are soldered to both the terminals and the housing. The first solder connection electrically connects each lead to the terminal aligned with the aperture and the second solder connection anchors each lead to the metallized surface of the housing to absorb mechanical stress applied to an outwardly extending portion of the lead.

Abstract translation: 封装的微电路包括具有多个孔的绝缘材料的壳体，该多个孔从壳体的内部延伸到外部。 金属化引线连接表面形成在每个孔的壁上。 具有多个端子的微电路设置在壳体的内部，其每个端子与相应的孔对准。 单独的引线延伸到孔中并且被焊接到端子和壳体两者。 第一焊接连接将每个导线电连接到与孔对准的端子，并且第二焊接连接锚固件各自导向壳体的金属化表面，以吸收施加到引线的向外延伸部分的机械应力。

公开(公告)号：US4044460A

公开(公告)日：1977-08-30

申请号：US724611

申请日：1976-09-20

Applicant: Herbert I. Schachter

Inventor： Herbert I. Schachter

IPC: H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K13/04 ,  H01R43/02

CPC classification number: H05K3/4015 ,  H01L24/34 ,  H01R43/205 ,  H05K13/0465 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/305 ,  H05K3/3421 ,  Y10T29/49147

Abstract: Prefabricated fingers suitable for mounting on a printed circuit board for use in conjunction with card edge connectors are provided on a lengthwise strip which may be cut to the desired size to correspond with the number of fingers which are to be mounted on the board. The strip, which may be formed in a roll, includes a pair of parallel carriers. The fingers extend between and are integrally formed with the carriers and are spaced along the lengths thereof and in substantially coplanar relationship therewith. After severing one of the carriers, the resulting free ends of the fingers may be aligned in overlapping relation with the circuit conductor ends to which the fingers are to be joined. After the finger free ends are joined to the printed circuit conductors and after the fingers are joined to the printed circuit board, the remaining carrier which projects beyond the edge of the circuit board is severed from the other ends of the fingers to permit or allow same for mating with a cooperating edge connector which is to be electrially connected to the printed circuit on the board.

Abstract translation: 适于安装在印刷电路板上以与卡边缘连接器一起使用的预制手指设置在纵向条上，纵向条可以被切割成期望的尺寸以对应于将要安装在电路板上的手指的数量。 可以形成为卷的条带包括一对平行的载体。 指状物在载体之间延伸并且与载体一体地形成并且沿其长度间隔开并且与其基本上共面的关系。 在切断一个载体之后，所得到的手指的自由端可以与手指将被连接的电路导体端重叠地对准。 在手指自由端连接到印刷电路导体之后，并且在手指接合到印刷电路板之后，突出超过电路板边缘的剩余载体从手指的另一端切断以允许或允许相同 用于与要与电路板上的印刷电路电连接的配合边缘连接器配合。

公开(公告)号：US3969010A

公开(公告)日：1976-07-13

申请号：US471023

申请日：1974-05-17

Applicant: William Kirby Nailor, III ,  David Clyde Thompson

Inventor： William Kirby Nailor, III ,  David Clyde Thompson

IPC: H01R12/72 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K1/06

CPC classification number: H05K3/3405 ,  H01R12/728 ,  H05K2201/0311 ,  H05K2201/0979 ,  H05K2201/1034 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/3447 ,  H05K3/4015

Abstract: An improved substrate for mounting electronic components including a plurality of uniformly spaced terminals on opposite sides along an edge of the substrate. The terminals comprise a contact having an outward bow, a narrowed transition section extending from the contact at an oblique angle from the longitudinal axis of the contact, and a tail bent at an angle, inserted through a first hole spaced from the edge of the substrate, bent at a second opposite angle along a side of the substrate, and inserted laterally in a second spaced hole by forming a U-shaped bend in the tail within the hole.

Abstract translation: 一种用于安装电子部件的改进的基板，包括沿着基板的边缘的相对侧上的多个均匀间隔的端子。 端子包括具有向外的弓形的接触件，从接触件以接触件从接触件的纵向轴线以倾斜角度延伸的窄过渡部分和以一定角度弯曲的尾部，其穿过与基板的边缘间隔开的第一孔 沿着基板的一侧以第二相对角度弯曲，并且通过在孔内的尾部中形成U形弯曲而侧向插入第二间隔开的孔中。