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    Three dimensional circuit modules for thick-film circuits and the like and methods for making same
    61.
    发明授权
    Three dimensional circuit modules for thick-film circuits and the like and methods for making same 失效
    用于薄膜电路的三维电路模块及其制造方法

    公开(公告)号：US3755891A

    公开(公告)日：1973-09-04

    申请号：US3755891D

    申请日：1971-06-03

    Applicant: HAWKINS S ,  MUCKELROY W

    Inventor： MUCKELROY W ,  HAWKINS S

    IPC: H01R12/55 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K1/04

    CPC classification number: H05K1/189 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/16 ,  H05K2201/09018 ,  H05K2201/09181 ,  H05K2201/0999 ,  H05K2201/10363 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10651 ,  Y10T29/49155

    Abstract: Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.

    Abstract translation: 提供用于厚膜电路等的三维电路模块及其制造方法相同的方法，其中这些电路以中空圆柱形基板的内壁和外壁的选定部分印刷，以去除通常存在于等效平面中的交叉 电路配置。 电路部分设置在基板上，使得它们之间的公共连接通过以形成在其中的凹口或倾斜度跨接在基板的端面上的导电夹来实现，以接收夹子。 类似的表现被用于物理和电互连多个基板和/或外部电路部件等。 这些基板还包括用于上述类型的独立功能电路模块的壳体。

    Electronic Device
    66.
    发明公开
    Electronic Device 审中-公开

    公开(公告)号：US20240130048A1

    公开(公告)日：2024-04-18

    申请号：US17800289

    申请日：2022-04-29

    Applicant: Honor Device Co., Ltd.

    Inventor： Xiaoyong Dong

    IPC: H05K3/30 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/10

    CPC classification number: H05K3/301 ,  H05K1/0219 ,  H05K1/05 ,  H05K1/11 ,  H05K3/103 ,  H05K2201/0355 ,  H05K2201/10121 ,  H05K2201/10386

    Abstract: This application relates to the field of electronic technologies, and in particular, to an electronic device. A camera assembly may be supported, and a charging path or a high-current path may be shortened, so that an impedance can be reduced, efficiency can be improved, and power consumption can be prevented from being increased. An electronic device is provided, including a circuit board and a camera assembly, where the circuit board has a mounting hole extending through the circuit board in a thickness direction, and the mounting hole includes a first end and a second end oppositely arranged along the thickness direction of the circuit board; and the camera assembly includes a first part arranged in the mounting hole and a second part extending out from the first end of the mounting hole, and the first part includes a camera substrate assembly; and a support member, arranged on the circuit board and at the mounting hole, where the first part is arranged on the support member, the support member includes at least one conductive sheet, the at least one conductive sheet is further coupled to a metal wiring of the circuit board, and the at least one conductive sheet is insulated from the camera substrate assembly.

    Lightweight electronic device for automotive applications and method
    68.
    发明授权
    Lightweight electronic device for automotive applications and method 有权
    汽车应用轻便电子设备及方法

    公开(公告)号：US09042119B2

    公开(公告)日：2015-05-26

    申请号：US14100794

    申请日：2013-12-09

    Applicant: DELPHI TECHNOLOGIES, INC.

    Inventor： Edgar Glenn Hassler

    IPC: H05K7/02 ,  H05K7/12 ,  H04B1/08

    CPC classification number: H05K3/00 ,  B29C70/68 ,  B29C70/882 ,  B29C70/885 ,  H04B1/082 ,  H05K1/0215 ,  H05K1/141 ,  H05K7/12 ,  H05K7/14 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/1422 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T428/24917

    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

    Abstract translation: 用于车辆应用的轻量级无线电/ CD播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的壳体和正面接口，其被模制以提供细节以接收音频设备，如回放机构（如果需要）和无线电接收器，以及 作为电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 金属丝网通过暴露的金属丝网垫和相邻的接地夹提供EMC，RFI，BCI和ESD屏蔽和电路板的接地。 主要部件和组件通过整体引导和连接功能自我互连，实现“滑动锁定”和“卡锁”自动互连。 主要部件和子组件通过与裸露的，弹性的，压花的网状部分形成过盈配合而自我研磨。

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