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    Tented diode shunt RF switch
    61.
    发明授权
    Tented diode shunt RF switch 有权
    帐篷二极管分流RF开关

    公开(公告)号：US6014066A

    公开(公告)日：2000-01-11

    申请号：US135206

    申请日：1998-08-17

    Applicant: Harry S. Harberts ,  Jeffrey A. Grant

    Inventor： Harry S. Harberts ,  Jeffrey A. Grant

    IPC: H01P1/15 ,  H05K1/02

    CPC classification number: H01P1/15 ,  H05K1/0243 ,  H05K2201/10174 ,  H05K2201/1028 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611

    Abstract: A stand-alone circuit board (3), a packaged surface mount PIN diode (1) and a metal ribbon (9) are mounted together in a new tented diode configuration. The flat end surface of the diode end terminal (4) is attached to a metal trace (5) on the circuit board, positioning the diode in an upstanding position, overlying the metal trace and leaving the other diode end terminal (2) in an elevated position over the circuit board. The metal ribbon wraps over the diode symmetrically extending along opposed sides of the diode to complete an electrical connect on the circuit board. In performance, the configuration emulates that prior configuration employing a thick metal plate backed circuit board. An improved RF switch incorporates the foregoing tented diode configuration.

    Abstract translation: 独立电路板（3），封装的表面贴装PIN二极管（1）和金属色带（9）以新的帐篷二极管配置安装在一起。 二极管端子（4）的平坦端面附着在电路板上的金属迹线（5）上，将二极管置于直立位置上，覆盖金属迹线并将另一个二极管端子（2）留在一个 升高位置在电路板上。 金属带缠绕在二极管对称延伸的二极管的两侧，以完成电路板上的电气连接。 在性能上，配置模拟了先前的配置采用厚金属板背板电路板。 改进的RF开关包含前述的帐篷二极管配置。

    Strap device clamping soldered wires for use in solar cell arrays
    63.
    发明授权
    Strap device clamping soldered wires for use in solar cell arrays 失效
    用于太阳能电池阵列的带状装置夹持焊丝

    公开(公告)号：US5948175A

    公开(公告)日：1999-09-07

    申请号：US764802

    申请日：1996-12-12

    Applicant: Gregory S. Glenn

    Inventor： Gregory S. Glenn

    IPC: H01R4/02 ,  H01R12/55 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01L31/05

    CPC classification number: H05K3/3421 ,  H01R12/55 ,  H01R4/027 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K3/328 ,  H05K3/4015 ,  Y02P70/613

    Abstract: A strap device clamps soldered wires to a conductive pad to reduce stress on the solder joints and to prevent the wire from springing off of the conductive pad if the solder joint should fail. This is accomplished by forming a conductive strap on a die into a yoke shape. The ends of the strap are then welded to a conductive pad so that the strap's yoke shape defines an opening between the strap and the conductive pad. A wire is inserted into the opening and soldered to form a solder joint between the wire, the strap, and the conductive pad. The strap reduces the stress on the solder joint by increasing its surface area and by clamping the wire to the conductive pad during the high temperature portion of a thermal cycle. If the solder joint should fail, the conductive strap maintains a electro-mechanical connection between the wire and the conductive pad.

    Abstract translation: 绑带装置将焊接的电线钳夹到导电焊盘，以减少焊点上的应力，并且如果焊点失效，则防止电线从导电焊盘上弹出。 这通过在模具上形成磁轭形状的导电带来实现。 然后将带的端部焊接到导电垫，使得带的轭形状限定了带和导电垫之间的开口。 将导线插入开口中并焊接以在导线，带和导电垫之间形成焊接接头。 带通过增加其表面积并通过在热循环的高温部分期间将导线夹紧到导电焊盘来减小焊点上的应力。 如果焊点失效，导电带将保持电线与导电焊盘之间的机电连接。

    Capillary action promoting surface mount connectors
    64.
    发明授权
    Capillary action promoting surface mount connectors 失效
    毛细管作用促进表面贴装连接器

    公开(公告)号：US5816868A

    公开(公告)日：1998-10-06

    申请号：US600112

    申请日：1996-02-12

    Applicant: Janos Legrady ,  Ronald M. Fredriks

    Inventor： Janos Legrady ,  Ronald M. Fredriks

    IPC: H01R4/02 ,  H01R12/57 ,  H05K1/18 ,  H05K3/34

    CPC classification number: H01R12/57 ,  H05K3/3426 ,  H01R4/02 ,  H05K2201/1084 ,  H05K2201/10916 ,  Y02P70/613 ,  Y10S439/94

    Abstract: One and two piece surface mount pin constructions include excess solder receiving channels. In the one piece construction an elongate channel is provided through a tubular pin which is flared or swaged at the lower end to form a base. In the two piece construction a solid pin is provided at a lower end with a uniform cross section in the form of a regular polygon, such as a square, hexagon or octagon. The resulting edges are press-fit against an internal surface of a sleeve which is also swaged at a lower end to form a base. The spaces between the sleeve and the flat or convex surfaces on the captured end of the pin provide the solder-receiving channels. A bead or shoulder on the pins can provide a stop for a vacuum nozzle. When a flared upper lip is used for this purpose it can also serve as a reservoir or well to receive excess solder beyond the amount that can be received in the channels.

    Abstract translation: 一个和两个表面安装针结构包括多余的焊料接收通道。 在单件式结构中，通过管状销提供细长通道，管状销在下端开口或模锻以形成底座。 在两件式的构造中，实心销设置在下端，其形状为均匀的横截面，如正方形，六边形或八边形。 所得到的边缘压合在套筒的内表面上，套筒的内表面也在下端锻造以形成底座。 套筒与捕获端的平面或凸面之间的空间提供焊料接收通道。 销上的珠或肩可以为真空喷嘴提供停止。 当为此目的使用扩口式上唇时，它也可用作储存器或井，以接收超过可在通道中接收的量的多余焊料。

    Surface mount electronic reed switch component
    65.
    发明授权
    Surface mount electronic reed switch component 失效
    表面安装电子簧片开关组件

    公开(公告)号：US5698819A

    公开(公告)日：1997-12-16

    申请号：US420061

    申请日：1995-04-11

    Applicant: Stephen Neil Brockett ,  Colin Stratford

    Inventor： Stephen Neil Brockett ,  Colin Stratford

    IPC: H01H36/00 ,  H05K3/34 ,  H02G3/08 ,  H05K7/10

    CPC classification number: H05K3/3426 ,  H01H36/0033 ,  H01H2001/5888 ,  H05K2201/10053 ,  H05K2201/10651 ,  H05K2201/10916 ,  Y02P70/613

    Abstract: A surface mount electronic reed switch component (10) is provided having a rod-shaped pad element (40) connected in transverse relationship to the outer end (30) of each switch lead (12, 14) of the reed switch (10) to provide a stable surface mounting foot without bending the leads (12,14) to thus avoid adversely affecting the switch gap (28) defined by the inner ends (22,24) of the leads (12,14). Element (40) may be of round, square, rectangular or tubular cross-section.

    Abstract translation: 提供了一种表面安装式电子舌簧开关元件（10），其具有与舌簧开关（10）的每个开关引线（12,14）的外端（30）横向相连的杆形垫元件（40）， 提供稳定的表面安装脚而不弯曲引线（12,14），从而避免不利地影响由引线（12,14）的内端（22,24）限定的开关间隙（28）。 元件（40）可以是圆形，正方形，矩形或管状横截面。

    Method for forming gold bump connection using tin-bismuth solder
    67.
    发明授权
    Method for forming gold bump connection using tin-bismuth solder 失效
    使用锡 - 铋焊料形成金凸块连接的方法

    公开(公告)号：US5316205A

    公开(公告)日：1994-05-31

    申请号：US43102

    申请日：1993-04-05

    Applicant: Cynthia Melton

    Inventor： Cynthia Melton

    IPC: H05K3/34

    CPC classification number: H05K3/3426 ,  H05K3/3463 ,  H05K2201/10681 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K3/3473 ,  Y02P70/613 ,  Y10T29/49144

    Abstract: A gold bump contact on an electronic component is solder bonded to a bond pad of a printed circuit board or the like utilizing a solder composed of tin-bismuth alloy. The solder is applied to the bond pad as an electroplate or a paste, after which the gold bump is superposed onto the bond pad. The assembly is heated to a first temperature to melt the solder and thereafter maintained at a temperature less than 150.degree. C. to permit the molten solder to wet the gold surface, after which the assembly is cooled to solidify the solder and complete the connection. Wetting at the relatively low temperature retards dissolution of the gold and thereby reduces formation of unwanted gold tin intermetallic compounds that tend to decrease mechanical properties of the connection.

    Abstract translation: 使用由锡 - 铋合金构成的焊料将电子部件上的金凸点接触焊接到印刷电路板等的接合焊盘。 将焊料作为电镀板或糊料施加到接合焊盘，之后将金凸块重叠在接合焊盘上。 将组件加热至第一温度以熔化焊料，然后保持在低于150℃的温度下，以使熔融焊料润湿金表面，之后将组件冷却以固化焊料并完成连接。 在相对低的温度下润湿会延缓金的溶解，从而减少倾向于降低连接的机械性能的不想要的金锡金属间化合物的形成。

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