公开(公告)号：US10941280B2

公开(公告)日：2021-03-09

申请号：US15528739

申请日：2015-09-01

Applicant: NAMICS Corporation

Inventor： Tomoya Yamazawa ,  Haruyuki Yoshii

IPC: C08L63/00 ,  C09J163/00 ,  H01L23/00 ,  H01L21/56 ,  C08K3/22 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28 ,  C08K9/06 ,  C08K3/36

Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

公开(公告)号：US20200332431A1

公开(公告)日：2020-10-22

申请号：US16762587

申请日：2018-11-09

Applicant: NAMICS CORPORATION

Inventor： Makiko SATO ,  Osamu SUZUKI ,  Naoki OBATA ,  Yoshinobu KOKAJI

IPC: C25D7/06 ,  C23C18/18 ,  C25D5/34 ,  C23C22/52

Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

公开(公告)号：US10800873B2

公开(公告)日：2020-10-13

申请号：US15034726

申请日：2014-12-12

Applicant: NAMICS CORPORATION

Inventor： Kazuyoshi Yamada

IPC: C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  C08L33/06

Abstract: To provide a technique for producing an epoxy resin cured product having toughness and elasticity. (A) the amine curing agent (B) an epoxy resin curing agent characterized in that the acrylic block copolymer is dissolved.

公开(公告)号：US20200185548A1

公开(公告)日：2020-06-11

申请号：US16323762

申请日：2017-07-12

Applicant: NAMICS CORPORATION

Inventor： Seiya KONNO ,  Noriyuki SAKAI

IPC: H01L31/0224 ,  H01B1/22 ,  C03C3/062 ,  C03C8/04

Abstract: Provided is a conductive paste for forming bus bar electrodes having high adhesive strength with respect to a passivation film in a crystalline silicon solar cell without having a detrimental effect on the passivation film so as to affect solar cell properties.The conductive paste is a conductive paste formed on a passivation film of a solar cell, containing: (A) silver particles, (B) an organic vehicle, and (C) glass fit containing TeO2 at 1.0 mol % to 20 mol % and Bi2O3 at 10 mol % to 30 mol %.

公开(公告)号：US20200148922A1

公开(公告)日：2020-05-14

申请号：US16614351

申请日：2018-05-18

Applicant: NAMICS CORPORATION

Inventor： Fuminori ARAI ,  Kazuki IWAYA

IPC: C09J129/12 ,  H01L23/10 ,  C08J5/24 ,  C08J5/18 ,  C08K3/013 ,  C08K5/00 ,  C08K5/17

Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

公开(公告)号：US20200062926A1

公开(公告)日：2020-02-27

申请号：US16346673

申请日：2017-11-02

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI

IPC: C08K9/02 ,  C01G23/04 ,  C08L101/00 ,  H01B1/20

Abstract: Obtained are metal-coated particles able to be used in a resin composition capable of forming the wiring of an electrical circuit and/or electronic circuit having a low possibility of disconnection. The metal-coated particles have a metal coating layer on the surface of titanium oxide, wherein the titanium oxide has a columnar shape having a particle length and a particle diameter and the particle length of the titanium oxide is longer than the particle diameter, and the metal-coated particles have a columnar shape having a particle length and a particle diameter and the particle length of the metal-coated particles is longer than the particle diameter.

公开(公告)号：US10475938B2

公开(公告)日：2019-11-12

申请号：US15331005

申请日：2016-10-21

Applicant: NAMICS CORPORATION

Inventor： Tetsu Takahashi

IPC: H01L31/0224 ,  H01L31/0256 ,  H01L31/18 ,  H01L31/068 ,  C03C4/14 ,  C03C8/10 ,  C03C8/18 ,  C09D5/24

Abstract: A process for producing conductive pastes for forming solar cell electrodes, including a step of measuring binding energies of oxygen in a glass frit by X-ray photoelectron spectroscopy, a step of selecting a glass frit providing an X-ray photoelectron spectrum representing binding energies of oxygen in which the signal intensity of a peak with a peak top at a range from 529 eV to less than 531 eV has a proportion of 40% or more relative to the total of signal intensities from 526 eV to 536 eV, and a step of mixing together a conductive powder, the glass frit and an organic vehicle.

公开(公告)号：US20190316009A1

公开(公告)日：2019-10-17

申请号：US16309534

申请日：2017-06-27

Applicant: NAMICS CORPORATION

Inventor： Katsunori ARAI

IPC: C09J11/06 ,  C08K5/14 ,  C08K5/32 ,  C08G73/06 ,  C09J11/04 ,  C09J4/00 ,  C08K3/08 ,  C08F20/18

Abstract: To provide adhesive compositions that have a long pot life which, when used in a two-stage process involving partial curing and complete curing, can be cured completely at a temperature lower than that for partial curing. An adhesive composition including: a curable resin that is radically polymerizable; an organic peroxide having a one-minute half-life temperature of less than 100° C.; and a radical polymerization inhibitor, wherein a rate of viscosity increase of the adhesive composition at 25° C. and after 48 hours is 1.5 or less, partial curing of the adhesive composition is possible by heating at 100° C. to 180° C. for 1 to 5 second(s), and complete curing of the adhesive composition is possible by heating at 70° C. to 100° C. after the partial curing.

公开(公告)号：US20190044005A1

公开(公告)日：2019-02-07

申请号：US16074883

申请日：2017-02-24

Applicant: NAMICS CORPORATION

Inventor： Kenichi SAKATA

IPC: H01L31/0224 ,  H01B1/22 ,  H01L21/28 ,  H01L23/482 ,  H01L31/0216 ,  H01L31/036

Abstract: An electrically conductive paste used to form an electrode used for electrical connection to a p-type semiconductor layer of a crystalline silicon solar cell, wherein the electrically conductive paste is able to fire through an antireflective film during firing and is capable of forming an electrode having low contact resistance on a p-type semiconductor layer. The electrically conductive paste contains (A) an electrically conductive powder, (B) Al powder or Al compound powder having an average particle diameter of 0.5 μm to 3.5 μm, (C) a glass frit and (D) an organic medium, and contains 0.5 parts by weight to 5 parts by weight of the Al powder or Al compound powder (B) based on 100 parts by weight of the electrically conductive powder (A).

公开(公告)号：US10141090B2

公开(公告)日：2018-11-27

申请号：US15860136

申请日：2018-01-02

Applicant: NAMICS CORPORATION

Inventor： Yoshitaka Kamata ,  Pawel Czubarow ,  Toshiyuki Sato ,  Takayuki Fujita

IPC: H01C7/105 ,  C08L63/00

Abstract: A resin composition which includes (A) an epoxy resin, (B) a curing agent, and (C) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.