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    PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND MOBILE BODY
    71.
    发明申请
    PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND MOBILE BODY 审中-公开
    物理量传感器，电子设备和移动体

    公开(公告)号：US20160054353A1

    公开(公告)日：2016-02-25

    申请号：US14816162

    申请日：2015-08-03

    Applicant: Seiko Epson Corporation

    Inventor： Satoru TANAKA

    IPC: G01P15/125

    CPC classification number: G01P15/125 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C1/00357 ,  B81C2201/0194 ,  G01P2015/0831

    Abstract: A physical quantity sensor includes a substrate, a support section, a movable section which is connected to the support section via linking sections, and fixed electrodes which are disposed on the substrate facing the movable section. The movable section has a first mass section, a second mass section which has a smaller mass than the first mass section, a first movable electrode which is disposed in the first mass section, and a second movable electrode which is disposed in the second mass section, the fixed electrodes include a first fixed electrode and a second fixed electrode, and when a length of the movable section in the longitudinal direction of the movable section is set as L and a length of the second mass section in the longitudinal direction of the movable section is set as L2, a relationship of 0.2≦L2/L≦0.48 is satisfied.

    Abstract translation: 物理量传感器包括基板，支撑部分，通过连接部分连接到支撑部分的可移动部分，以及设置在面向可动部分的基板上的固定电极。 可移动部分具有第一质量部分，质量小于第一质量部分的第二质量部分，设置在第一质量部分中的第一可移动电极和设置在第二质量部分中的第二可动电极 所述固定电极包括第一固定电极和第二固定电极，并且当所述可移动部分在所述可动部分的纵向方向上的长度被设定为L时，所述第二质量部分在所述可移动部分的纵向方向上的长度被设定为L 部分设为L2，满足0.2＆nlE; L2 / L＆nlE; 0.48的关系。

    Inkjet print head, method of manufacturing the same and drawing apparatus equipped with the same
    72.
    发明授权
    Inkjet print head, method of manufacturing the same and drawing apparatus equipped with the same 有权
    喷墨打印头，其制造方法和配备有该喷墨打印头的绘图装置

    公开(公告)号：US09211708B2

    公开(公告)日：2015-12-15

    申请号：US14453635

    申请日：2014-08-07

    Applicant: NLT TECHNOLOGIES, LTD.

    Inventor： Shigeru Mori ,  Setsuo Kaneko ,  Hideki Asada

    IPC: B41J2/05 ,  B41J2/14 ,  B41J2/045

    CPC classification number: B41J2/1601 ,  B41J2/0455 ,  B41J2/0458 ,  B41J2/14016 ,  B41J2/14129 ,  B41J2/1626 ,  B41J2/1634 ,  B41J2002/14387 ,  B81C1/00357 ,  B81C1/00817 ,  B81C2201/0194 ,  C09K13/00

    Abstract: Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.

    Abstract translation: 提供了一种喷墨打印头，喷墨打印头和装备有喷墨打印头的绘图装置的制造方法。 该制造方法包括：在基板上形成分离辅助层; 在分离辅助层上形成用于喷射液体的加热电阻器，薄膜晶体管和喷嘴; 从所述基板分离所述分离辅助层; 在分离辅助层的相对表面上与喷嘴形成第一导热层; 以及形成用于从喷墨打印头的第一导热层侧向喷嘴供墨的供墨口。

    Transferable probe tips
    73.
    发明授权
    Transferable probe tips 有权
    可转移探针尖端

    公开(公告)号：US09200883B2

    公开(公告)日：2015-12-01

    申请号：US13101253

    申请日：2011-05-05

    Applicant: Paul S. Andry ,  Bing Dang ,  Steven L. Wright

    Inventor： Paul S. Andry ,  Bing Dang ,  Steven L. Wright

    IPC: G01N27/84 ,  G01R33/12 ,  G01R31/26 ,  H01L21/66 ,  H01L21/44 ,  G01B5/28 ,  G03F7/00 ,  G01R1/073 ,  G01R3/00 ,  G01Q70/14 ,  G01R1/067 ,  G01Q70/16 ,  G01Q40/02

    CPC classification number: G01B5/28 ,  B81B2201/12 ,  B81C3/001 ,  B81C2201/0194 ,  G01Q40/02 ,  G01Q70/14 ,  G01Q70/16 ,  G01R1/067 ,  G01R1/06738 ,  G01R1/07378 ,  G01R3/00 ,  G03F7/00

    Abstract: Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.

    Abstract translation: 本发明提供了包括金属探针，覆盖金属探针的一部分的分层和可接合的探针尖端，以及接合合金，其中接合合金在未被分层的被覆层的探针的一部分处接触金属探针。 此外，提供了用于产生可转移探针尖端的技术，包括蚀刻处理器衬底以形成一个或多个通孔阵列，在每个通孔阵列中沉积分层，在每个通孔阵列中沉积一个或多个金属以形成探针尖端结构， 以及在未被分层层覆盖的探针尖端结构的一部分上沉积接合合金。 此外，提供了用于传送可转移的探针尖端的技术，包括从探针尖端结构去除处理器基底，以及通过将探针尖端结构连接到目标探针头基底的倒装芯片来传送探针尖端结构。

    Method for producing a micromechanical component, and micromechanical component
    75.
    发明申请
    Method for producing a micromechanical component, and micromechanical component 有权
    微机械部件的制造方法以及微机电部件

    公开(公告)号：US20150232323A1

    公开(公告)日：2015-08-20

    申请号：US14624071

    申请日：2015-02-17

    Applicant: Robert Bosch GmbH

    Inventor： Dietmar HABERER

    IPC: B81B1/00 ,  B81B7/02 ,  B81C1/00

    CPC classification number: B81B1/004 ,  B81B7/02 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00103 ,  B81C2201/0194 ,  B81C2203/0172

    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

    Abstract translation: 微机械部件的制造方法和微机械部件包括提供具有第一和第二外表面的基板，所述第二表面背离所述第一表面; 从所述第一外表面到所述第二外表面形成穿过所述基板的通孔; 在所述第二外表面上附着光学功能层以覆盖所述通孔; 去除所述基板的所述第一表面上的所述基板的第一部分，使得出现相对于所述第二表面倾斜的第三外表面，所述第三表面背离所述第二表面，所述倾斜表面包围所述通孔; 以及通过从所述基板的剩余部分分离具有所述通孔的所述基板的第一部分和附接到所述第一部分的所述光学功能层的第二部分和所述光学部件的剩余部分来分离所述微机械部件 功能层。

    Method for handling a thin substrate and for substrate capping
    78.
    发明授权
    Method for handling a thin substrate and for substrate capping 有权
    处理薄基板和基板封盖的方法

    公开(公告)号：US08796110B2

    公开(公告)日：2014-08-05

    申请号：US13214917

    申请日：2011-08-22

    Applicant: Kuei-Sung Chang ,  Yi Heng Tsai

    Inventor： Kuei-Sung Chang ,  Yi Heng Tsai

    IPC: H01L21/306

    CPC classification number: B81C1/00539 ,  B81C1/00269 ,  B81C1/00634 ,  B81C2201/0194 ,  B81C2203/0127 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68381

    Abstract: An embodiment is a method for bonding. The method comprises bonding a handle substrate to a capping substrate; thinning the capping substrate; etching the capping substrate; and after the thinning and the etching the capping substrate, bonding the capping substrate to an active substrate. The handle substrate has an opening therethrough. The method also comprises removing the handle substrate from the capping substrate. The removing comprises providing an etchant through the opening to separate the handle substrate from the capping substrate. Other embodiments further include forming a bonding material on a surface of at least one of the handle substrate and the capping substrate such that the capping substrate is bonded to the handle substrate by the bonding material. The bonding material may be removed by using a dry etching to remove the handle substrate from the capping substrate.

    Abstract translation: 实施例是一种粘合方法。 该方法包括将手柄基板粘合到封盖基板上; 减薄封盖基板; 蚀刻封盖基板; 并且在减薄和蚀刻封盖衬底之后，将覆盖衬底粘合到活性衬底上。 手柄基板具有穿过其中的开口。 该方法还包括从封盖基板上移除手柄基板。 除去包括通过开口提供蚀刻剂以将手柄衬底与封盖衬底分离。 其他实施例还包括在手柄基板和封盖基板中的至少一个的表面上形成接合材料，使得封盖基板通过接合材料结合到手柄基板。 可以通过使用干法蚀刻来去除接合材料以从封盖基板去除手柄基板。

    Quartz-based MEMS resonators and methods of fabricating same
    79.
    发明授权
    Quartz-based MEMS resonators and methods of fabricating same 有权
    基于石英的MEMS谐振器及其制造方法

    公开(公告)号：US08765615B1

    公开(公告)日：2014-07-01

    申请号：US12816292

    申请日：2010-06-15

    Applicant: David T. Chang ,  Frederic P. Stratton ,  Hung Nguyen ,  Randall L. Kubena

    Inventor： David T. Chang ,  Frederic P. Stratton ,  Hung Nguyen ,  Randall L. Kubena

    IPC: H01L21/302 ,  H01L21/311 ,  H01L21/3105

    CPC classification number: H01L21/31111 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C2201/0194 ,  B81C2203/036 ,  B81C2203/038 ,  H01L21/31056 ,  H03H3/0072 ,  H03H2009/02291

    Abstract: A quart resonator for use in lower frequency applications (typically lower than the higher end of the UHF spectrum) where relatively thick quartz members, having a thickness greater than ten microns, are called for. A method for fabricating same resonator includes providing a first quart substrate; thinning the first quartz substrate to a desired thickness; forming a metallic etch stop on a portion of a first major surface of the first quartz substrate; adhesively attaching the first major surface of the first quartz substrate with the metallic etch stop formed thereon to a second quartz substrate using a temporary adhesive; etching a via though the first quartz substrate to the etch stop; forming a metal electrode on a second major surface of the first quartz substrate, the metal electrode penetrating the via in the first quartz substrate to make ohmic contact with the metallic etch stop; bonding the metal electrode formed on the second major surface of the first quartz substrate to a pad formed on a substrate bearing oscillator drive circuitry to form a bond there between; and dissolving the temporary adhesive to thereby release the second quartz substrate from the substrate bearing oscillator drive circuitry and a portion of the first quartz substrate bonded thereto via the bond formed between the metal electrode formed on the second major surface of the first quartz substrate to and the pad formed on the substrate bearing oscillator drive circuitry.

    Abstract translation: 用于低频应用（通常低于UHF频谱的较高端）的夸特谐振器，其中厚度大于10微米的相对较厚的石英构件被要求。 一种制造相同谐振器的方法包括提供第一夸脱基片; 将第一石英基板变薄至所需厚度; 在所述第一石英衬底的第一主表面的一部分上形成金属蚀刻停止件; 使用临时粘合剂将第一石英基板的第一主表面与其上形成的金属蚀刻停止粘合到第二石英基板上; 将通过第一石英衬底的通孔蚀刻到蚀刻停止部; 在所述第一石英衬底的第二主表面上形成金属电极，所述金属电极穿过所述第一石英衬底中的通孔以与所述金属蚀刻停止件欧姆接触; 将形成在第一石英衬底的第二主表面上的金属电极接合到形成在承载振荡器驱动电路的衬底上的焊盘，以在其之间形成结合; 并且将临时粘合剂溶解，从而从基板轴承振荡器驱动电路和第一石英基板的一部分经由形成在第一石英基板的第二主表面上的金属电极之间的键与第一石英基板接合的部分而释放第二石英基板 衬垫形成在承载振荡器驱动电路的衬底上。

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