Abstract:
An object of the present invention is to provide a TiO2-containing quartz glass substrate which, when used as a mold base for nanoimprint lithography, can form a concavity and convexity pattern having a dimensional variation falling within ±10%. The invention relates to a TiO2-containing quartz glass substrate: in which a coefficient of thermal expansion in the range of from 15 to 35° C. is within ±200 ppb/° C.; a TiO2 concentration is from 4 to 9 wt %; and a TiO2 concentration distribution, in a substrate surface on the side where a transfer pattern is to be formed, is within ±1 wt %.
Abstract translation:本发明的目的是提供一种含TiO 2的石英玻璃基板,其用作纳米压印光刻用的模具基底时,可以形成尺寸变化在±10%以内的凹凸图案。 本发明涉及一种含TiO 2的石英玻璃基板,其中15至35℃范围内的热膨胀系数在±200ppb /℃以内。 TiO 2浓度为4〜9重量%。 并且在要形成转印图案的一侧的基板表面中的TiO 2浓度分布在±1重量%以内。
Abstract:
The present invention provides a TiO2—SiO2 glass in which when used as an optical member for an exposure tool for EUVL, a thermal expansion coefficient is substantially zero at the time of irradiation with high-EUV energy light, and physical properties of a multilayer can be kept over a long period of time by releasing hydrogen from the glass. The present invention relates to a TiO2-containing silica glass having a fictive temperature of 1,100° C. or lower, a hydrogen molecule concentration of 1×1016 molecules/cm3 or more, and a temperature, at which a linear thermal expansion coefficient is 0 ppb/° C., falling within the range of from 40 to 110° C.
Abstract:
The present invention is to provide a TiO2—SiO2 glass having suitable thermal expansion properties as an optical member of an exposure tool for EUVL. The present invention relates to a TiO2-containing silica glass having a temperature, at which a coefficient of thermal expansion is 0 ppb/° C., falling within the range of 23±4° C. and a temperature width, in which a coefficient of thermal expansion is 0±5 ppb/° C., of 5° C. or more.
Abstract:
A silica glass containing TiO2, which has a fictive temperature of at most 1,200° C., a F concentration of at least 100 ppm and a coefficient of thermal expansion of 0±200 ppb/° C. from 0 to 100° C.A process for producing a silica glass containing TiO2, which comprises a step of forming a porous glass body on a target quartz glass particles obtained by flame hydrolysis of glass-forming materials, a step of obtaining a fluorine-containing porous glass body, a step of obtaining a fluorine-containing vitrified glass body, a step of obtaining a fluorine-containing formed glass body and a step of carrying out annealing treatment.
Abstract:
In the nanoimprint lithography, a titania-doped quartz glass having a CTE of −300 to 300 ppb/° C. between 0° C. and 250° C. and a CTE distribution of up to 100 ppb/° C. at 25° C. is suited for use as nanoimprint molds.
Abstract:
Titania-containing silica glass bodies and extreme ultraviolet elements having low levels of striae are disclosed. Methods and apparatus for manufacturing and measuring striae in glass elements and extreme ultraviolet elements are also disclosed.
Abstract:
It is to provide a silica glass containing TiO2, having a wide temperature range wherein the coefficient of thermal expansion is substantially zero.A silica glass containing TiO2, which has a TiO2 concentration of from 3 to 10 mass %, a OH group concentration of at most 600 mass ppm and a Ti3+ concentration of at most 70 mass ppm, characterized by having a fictive temperature of at most 1,200° C., a coefficient of thermal expansion from 0 to 100° C. of 0±150 ppb/° C., and an internal transmittance T400-700 per 1 mm thickness in a wavelength range of from 400 to 700 nm of at least 80%. A process for producing a silica glass containing TiO2, which comprises porous glass body formation step, F-doping step, oxygen treatment step, densification step and vitrification step.
Abstract:
A silica glass containing TiO2, which has a fictive temperature of at most 1,200° C., an OH group concentration of at most 600 ppm and a coefficient of thermal expansion of 0±200 ppb/° C. from 0 to 100° C.
Abstract:
A silica glass containing from 3 to 10 mass % of TiO2, which has a coefficient of thermal expansion from 0 to 100° C., i.e. CTE0 to 100, of 0±300 ppb/° C. and an internal transmittance per mm in thickness within a wavelength region of from 200 to 700 nm, i.e. T200 to 700, of at most 80%.
Abstract:
The invention discloses an SiO2—TiO2 glass, which is preferably made by flame-hydrolysis and which distinguishes itself by increased resistance to radiation, especially in connection with EUV lithography. By purposefully reducing the hydrogen content, clearly improved resistance to radiation and reduced shrinking is achieved.