SENSING DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20230228623A1

    公开(公告)日:2023-07-20

    申请号:US17890275

    申请日:2022-08-18

    CPC classification number: G01J1/44 H01L27/14629 H01L27/14685 G01J2001/446

    Abstract: A sensing device includes a flexible substrate, a reflective layer, a planarization layer, plural switching elements and plural sensing elements. The flexible substrate has plural recesses on a surface. The reflective layer is located on the flexible substrate and conforms to an inner surface of the plural recesses. The planarization layer is disposed on the reflective layer. The plural switching elements are disposed on the planarization layer. The plural sensing elements are disposed on the planarization layer and electrically connected to the plural switching elements respectively. A method for fabricating a sensing device is also provided.

    ELECTRONIC DEVICE
    72.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230184586A1

    公开(公告)日:2023-06-15

    申请号:US17896063

    申请日:2022-08-25

    CPC classification number: G01J1/44 G01J2001/446 G01R31/31723

    Abstract: An electronic device is provided. The electronic device includes an electronic component and a sensing circuit. The sensing circuit is electrically connected to the electronic component through a sensing node. The sensing circuit comprises a first capacitor, a first transistor, a second transistor, a third transistor and a fourth transistor. The second transistor is electrically connected between the first capacitor and a control terminal of the first transistor. The third transistor is electrically connected to the first transistor. The fourth transistor is electrically connected to the first transistor. The first capacitor is electrically connected between the sensing node and the control terminal of the first transistor.

    OPTICAL SENSOR MODULE
    79.
    发明申请

    公开(公告)号:US20180209844A1

    公开(公告)日:2018-07-26

    申请号:US15628648

    申请日:2017-06-21

    Abstract: An optical sensor including a substrate and a plurality of pixel units are provided. The pixel units are disposed on the substrate, and each of the pixel units includes a light source element, a light sensor element, a circuit unit, and an isolation element. Herein, the light source element emits light, the light sensor element senses an optical image. The circuit unit is configured to drive the light source element to emit light and to drive the light sensor element to sense the optical image. The isolation element isolates the light sensor element from the light source element. In addition, the light source element is disposed between the isolation element of the respective pixel unit and an isolation element of a neighboring pixel unit.

    Charge packet signal processing using pinned photodiode devices

    公开(公告)号:US10001406B2

    公开(公告)日:2018-06-19

    申请号:US15175958

    申请日:2016-06-07

    Inventor: Roger Panicacci

    CPC classification number: G01J1/4228 G01J1/44 G01J2001/446 H04N5/378

    Abstract: An image sensor may include an array of image pixels coupled to analog-to-digital conversion circuitry formed from pinned photodiode charge transfer circuits. Majority charge carriers for the pinned photodiodes in the charge transfer circuits may be electrons for photodiode wells formed from n-type doped regions and may be holes for photodiode formed from p-type doped regions. Pinned photodiodes may be used for charge integration onto a capacitive circuit node. Pinned photodiodes may also be used for charge subtraction from a capacitive circuit node. Comparator circuitry may be used to determine digital values for the pixel output levels in accordance with single-slope conversion, successive-approximation-register conversion, cyclic conversion, and first or second order delta-sigma conversion techniques. The array of image pixels used for imaging may have a conversion mode wherein at least a portion of the pixel circuitry in the array are operated similar to the charge transfer circuits.

Patent Agency Ranking