Radiation system
    75.
    发明授权

    公开(公告)号:US11984236B2

    公开(公告)日:2024-05-14

    申请号:US16743025

    申请日:2020-01-15

    Abstract: A radiation system includes a beam splitting apparatus configured to split a main radiation beam into a plurality of branch radiation beams and a radiation alteration device arranged to receive an input radiation beam and output a modified radiation beam, wherein the radiation alteration device is configured to provide an output modified radiation beam which has an increased etendue, when compared to the received input radiation beam, wherein the radiation alteration device is arranged such that the input radiation beam which is received by the radiation alteration device is a main radiation beam and the radiation alteration device is configured to provide a modified main radiation beam to the beam splitting apparatus, or wherein the radiation alteration device is arranged such that the input radiation beam which is received by the radiation alteration device is a branch radiation beam output from the beam splitting apparatus.

    SYSTEM AND METHOD FOR BENDING CRYSTAL WAFERS FOR USE IN HIGH RESOLUTION ANALYZERS

    公开(公告)号:US20240062928A1

    公开(公告)日:2024-02-22

    申请号:US17892020

    申请日:2022-08-19

    CPC classification number: G21K1/06 G21K2201/062 G21K2201/064 G21K2201/067

    Abstract: The invention provides a method for fabricating analyzers, the method comprising providing a radiation manipulating material on a first surface of a flexible support; contacting a second surface of the flexible support to a permeable mold, wherein the mold has a first flexible support contact surface and a second surface; and applying negative pressure to the second side of the flexible support to cause the flexible support to conform to the first flexible support contact surface of the mold. Also provided is a system for fabricating crystal analyzers, the system comprising crystal structures reversibly attached to a flexible support; a porous mold reversibly contacting the flexible support, wherein the mold defines a topography; and a negative pressure applied to the flexible support to cause the crystal structures to conform to the topography.

    Method and apparatus for measuring scattering intensity distribution

    公开(公告)号:US09714907B2

    公开(公告)日:2017-07-25

    申请号:US14651813

    申请日:2013-12-10

    CPC classification number: G01N23/20008 G01N23/20 G21K2201/062 G21K2201/064

    Abstract: It is an object of the present invention to provide a method and an apparatus for measuring a scattering intensity distribution capable of measuring a scattering intensity distribution in a reciprocal space in a short time. The method or apparatus for measuring a scattering intensity distribution causes X-rays emitted from an X-ray source (101) to be reflected by an X-ray optical element (102) so as to converge in the vicinity of a surface of a sample (SA), causes monochromatic X-rays condensed after passing through a plurality of optical paths to be incident on the sample at glancing angles (ω) that differ depending on the respective optical paths at a time in a state in which there is a correlation between an angle formed by each optical path of the monochromatic X-rays and a reference plane, and an angle formed by each optical path and a plane including the normal of the reference plane and an optical path located in the center of the respective optical paths, detects scattering intensities of the monochromatic X-rays scattered by the sample using a two-dimensional detector (103) and calculates a scattering intensity distribution in the reciprocal space based on the scattering intensity distribution detected by the two-dimensional detector and the correlation.

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